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公开(公告)号：US20170367228A1
公开(公告)日：2017-12-21
申请号：US15187451
申请日：2016-06-20
Applicant: KEMET Electronics Corporation
Inventor： John E. McConnell , John Bultitude
Abstract: An electronic component assembly is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations. A component stability structure is attached to at least one face. A circuit board is provided wherein the circuit board comprises circuit traces arranged for electrical engagement with the external terminations. The component stability structure mechanically engages with the circuit board and inhibits the electronic device from moving relative to the circuit board.
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公开(公告)号：US20170358397A1
公开(公告)日：2017-12-14
申请号：US15670247
申请日：2017-08-07
Applicant: KEMET Electronics Corporation
Inventor： John E. McConnell , Garry L. Renner , John Bultitude , R. Allen Hill , Galen W. Miller
IPC: H01G4/40 , H01G4/002 , H01G4/30 , H01G4/38 , H01G4/232 , H01G4/012 , H01G4/248 , B22F3/10 , H01G4/12
CPC classification number: H01G4/40 , B22F3/1035 , B23K20/002 , B23K20/026 , B23K20/16 , B23K20/22 , B23K35/0227 , B23K35/3613 , B23K2101/40 , B23K2101/42 , H01G4/002 , H01G4/0085 , H01G4/012 , H01G4/12 , H01G4/1227 , H01G4/232 , H01G4/2325 , H01G4/248 , H01G4/30 , H01G4/38 , H01L2224/83825 , H01L2924/01322 , H01L2924/01327 , H01L2924/1461 , Y10T29/435 , H01L2924/00012 , H01L2924/00015 , H01L2924/00
Abstract: An electronic component is described wherein the electronic component comprises a stack of electronic elements comprising a transient liquid phase sintering adhesive between and in electrical contact with each said first external termination of adjacent electronic elements
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公开(公告)号：US09805872B2
公开(公告)日：2017-10-31
申请号：US14963766
申请日：2015-12-09
Applicant: Kemet Electronics Corporation
Inventor： Galen W. Miller , John E. McConnell , John Bultitude , Garry L. Renner
Abstract: An improved module is provided. The module comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination with at least one first longitudinal edge and a second external termination with at least one second longitudinal edge. A first lead is connected to the first longitudinal edge by a first interconnect and a second lead is connected to the second longitudinal edge by a second interconnect.
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公开(公告)号：US20140230210A1
公开(公告)日：2014-08-21
申请号：US14266364
申请日：2014-04-30
Applicant: Kemet Electronics Corporation
Inventor： John Bultitude , James R. Magee , Lonnie G. Jones
IPC: H01G4/30
CPC classification number: H01G4/30 , H01G4/005 , H01G4/232 , Y10T29/435
Abstract: New designs for multilayer ceramic capacitors are described with high voltage capability without the need of coating the part to resist surface arc-over. One design combines a high overlap area for higher capacitance whilst retaining a high voltage capability. A variation of this design has increased voltage capability over this design as well as another described in the prior art although overlap area and subsequently capacitance is lowered in this case. These designs are compared to the prior art in examples below.
Abstract translation: 描述了具有高电压能力的多层陶瓷电容器的新设计，而不需要涂覆部件来抵抗表面电弧。 一个设计结合了高重叠面积，用于更高的电容，同时保持高电压能力。 这种设计的变化在这种设计中增加了电压能力，而且在现有技术中描述了另一种，尽管在这种情况下重叠区域和随后的电容降低。 这些设计在下面的实施例中与现有技术进行比较。
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45.发明申请公开(公告)号：US20130314845A1
公开(公告)日：2013-11-28
申请号：US13959995
申请日：2013-08-06
Applicant: Kemet Electronics Corporation
Inventor： Antony P. Chacko , John E. McConnell , Robert Ramsbottom , Philip M. Lessner , Randolph S. Hahn , John Bultitude
CPC classification number: H01G9/048 , H01G9/0029 , H01G9/012 , H01G9/04 , H01G9/0425 , H01G11/26 , Y10T29/417
Abstract: A solid electrolytic capacitor is described which comprises an anode, a dielectric on the anode and a cathode on the dielectric. A conductive coating is on the cathode wherein the conductive layer comprises an exterior surface of a first high melting point metal. An adjacent layer is provided comprising a second high melting point metal, wherein the first high melting point metal and the second high melting point metal are metallurgically bonded with a low melting point metal.
Abstract translation: 描述了一种固体电解电容器，其包括阳极，阳极上的电介质和电介质上的阴极。 导电涂层在阴极上，其中导电层包括第一高熔点金属的外表面。 提供了包括第二高熔点金属的相邻层，其中第一高熔点金属和第二高熔点金属用低熔点金属冶金结合。
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Patent Agency Ranking
公开(公告)号：US12249463B2
公开(公告)日：2025-03-11
申请号：US17233796
申请日：2021-04-19
Applicant: KEMET Electronics Corporation
Inventor： Mark R. Laps , John Bultitude , Philip M. Lessner , Lonnie G. Jones , Allen Templeton , Nathan A. Reed
Abstract: Provided is a heat dissipating capacitor comprising internal electrodes of opposing polarity forming a capacitive couple between external terminations. A dielectric is between the internal electrodes. The heat dissipating capacitor comprises at least one thermal dissipation layer and at least one thermal conductive termination wherein the thermal dissipation layer is in thermally conductive contact with the thermal conductive termination.
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公开(公告)号：US20230038175A1
公开(公告)日：2023-02-09
申请号：US17968567
申请日：2022-10-18
Applicant: KEMET Electronics Corporation
Inventor： John E. McConnell , John Bultitude , Allen Templeton
Abstract: Provided is an electronic module comprising at least one electronic component. A thermoelectric cooler is in thermal contact with the electronic component. A temperature controller is capable of determining a device temperature of the electronic component is provided and capable of providing current to the thermoelectric cooler proportional to a deviation of the device temperature from an optimal temperature range.
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公开(公告)号：US11227719B2
公开(公告)日：2022-01-18
申请号：US15909735
申请日：2018-03-01
Applicant: KEMET Electronics Corporation
Inventor： John E. McConnell , Garry L Renner , John Bultitude , Allen Hill
IPC: B23K1/00 , H01G4/30 , H01G4/232 , H01G4/38 , B23K1/005 , B23K1/008 , H01G4/228 , B23K1/20 , B23K35/36 , B23K35/02 , H01G4/008 , H01G4/12 , B23K101/40 , B23K101/42
Abstract: A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.
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公开(公告)号：US20210241977A1
公开(公告)日：2021-08-05
申请号：US17148038
申请日：2021-01-13
Applicant: KEMET Electronics Corporation
Inventor： Galen W. Miller , John Bultitude , Lonnie G. Jones
Abstract: Provided is an improved electronic component package. The electronic component package comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination. The electronic component package also includes a structural lead frame comprising multiple leads wherein each lead is mounted to at least one first external termination and the structural lead frame comprises at least one break away feature between adjacent leads.
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公开(公告)号：US10950688B2
公开(公告)日：2021-03-16
申请号：US16531255
申请日：2019-08-05
Applicant: KEMET Electronics Corporation
Inventor： John Bultitude , Lonnie G. Jones , Allen Templeton , Philip M. Lessner
IPC: H01L49/02 , H01L23/522 , H01L23/48
Abstract: Provided herein is a module for packaging semiconductors comprising: at least one PDC comprising parallel internal electrodes of alternating polarity with a paraelectric dielectric between adjacent internal electrodes wherein the paraelectric dielectric has a permittivity above 10 to no more than 300; and wherein the PDC forms a capacitor couple with at least one semiconductor.
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