Method for multilayer molding of thermoplastic resins and multilayer molding apparatus
    41.
    发明申请
    Method for multilayer molding of thermoplastic resins and multilayer molding apparatus 审中-公开
    热塑性树脂多层成型方法及多层成型装置

    公开(公告)号:US20090121375A1

    公开(公告)日:2009-05-14

    申请号:US11990780

    申请日:2006-08-23

    IPC分类号: B29C67/20

    CPC分类号: B29C44/0461 B29C44/086

    摘要: A multilayer-molding method includes the steps of mixing at least one thermoplastic resin selected from a plurality of types of thermoplastic resins with a bubble-nucleating agent and a foaming gas, injecting the plurality of types of thermoplastic resins into a mold cavity such that the thermoplastic resins are layered in the mold cavity, and then, after increasing the volume of the mold cavity, foaming the at least one thermoplastic resin mixed with the bubble-nucleating agent and the foaming gas. The multilayer-molding method is characterized in that the foaming gas is supplied at a pressure of 0.1 MPa or more but less than 1.0 MPa to at least one injection-molding machine selected from a plurality of injection-molding machines, and that the thermoplastic resin plasticized in the injection-molding machine is mixed with the foaming gas.

    摘要翻译: 多层成型方法包括将选自多种热塑性树脂的至少一种热塑性树脂与气泡成核剂和发泡气体混合的步骤,将多种类型的热塑性树脂注入模腔,使得 将热塑性树脂层叠在模腔中,然后在增加模腔的体积之后,使与泡沫成核剂和发泡气体混合的至少一种热塑性树脂发泡。 多层成型方法的特征在于,将发泡气体以0.1MPa以上且小于1.0MPa的压力供给到从多台注塑机中选择的至少一种注射成型机,热塑性树脂 在注射成型机中增塑的发泡气体与发泡气体混合。

    Method for Injection Expansion Molding of Thermoplastic Resin
    42.
    发明申请
    Method for Injection Expansion Molding of Thermoplastic Resin 有权
    热塑性树脂注射膨胀成型方法

    公开(公告)号:US20080290543A1

    公开(公告)日:2008-11-27

    申请号:US11579414

    申请日:2005-07-21

    IPC分类号: B29C45/00 B29C45/70

    CPC分类号: B29C44/422 B29C44/586

    摘要: An injection-foaming method for a thermoplastic resin comprising using an injection unit 30 provided with a hopper 35, a plasticizing cylinder 31 and a screw 32, and a mold 10 having a mold cavity 10a of changeable capacity; filling the mold cavity 10a with a foaming-agent-containing melted resin injected from the injection unit 30; and then enlarging the mold cavity 10a for allowing the foaming-agent-containing melted resin to expand, wherein inclusion of a foaming agent into a thermoplastic resin is done by using a mixture of a foam nucleating agent and a foaming gas as foaming agent, feeding the mixture to hopper 35 or plasticizing cylinder 31 and screw 32 of injection unit 30 at a pressure of 0.1 MPa or more and less than 1.0 MPa, and contacting the mixture with a pre- or post-plasticized thermoplastic resin present in hopper 35 or plasticizing cylinder 31 and screw 32.

    摘要翻译: 一种热塑性树脂的注射发泡方法,包括使用设有料斗35,塑化筒31和螺杆32的注射单元30和具有可变容量的模腔10a的模具10。 用从注射单元30注入的含发泡剂的熔融树脂填充模腔10a; 然后扩大模腔10a,使含发泡剂的熔融树脂膨胀,其中通过使用泡沫成核剂和发泡气体的混合物作为发泡剂,将发泡剂包含在热塑性树脂中进行,进料 在0.1MPa以上且小于1.0MPa的压力下将混合物与料斗35或塑化筒31和注射单元30的螺杆32接触,并将混合物与存在于料斗35中的预塑化后塑化树脂或增塑剂 气缸31和螺杆32。

    Resin composition
    44.
    发明授权
    Resin composition 有权
    树脂组成

    公开(公告)号:US06410649B1

    公开(公告)日:2002-06-25

    申请号:US09646771

    申请日:2000-09-22

    IPC分类号: C08L2300

    摘要: A resin composition characterized by comprising from 5 to 95 wt % of an aromatic vinyl compound/olefin random copolymer (A) which has an aromatic vinyl compound content of from 1 to 99 mol % and has a head-to-tail chain structure composed of two or more aromatic vinyl compound units, and from 95 to 5 wt % of an &agr;-olefin type polymer (B) and/or an aromatic vinyl compound type polymer (C) (provided that it is neither a medical material nor a medical device), which contains substantially no chlorine and is excellent in the impact resistance, moldability, weather resistance and chemical resistance and which is useful for an injection molded product, an extrusion molded product, a film, a sheet, etc. Further, it provides an excellent damping material.

    摘要翻译: 一种树脂组合物,其特征在于,含有5〜95重量%的芳香族乙烯基化合物/烯烃无规共聚物(A),其芳香族乙烯基化合物含量为1〜99摩尔%,并具有头 - 尾链结构, 两种或多种芳族乙烯基化合物单元和95至5重量%的α-烯烃型聚合物(B)和/或芳族乙烯基化合物型聚合物(C)(条件是它既不是医疗材料也不是医疗装置 ),其基本上不含氯,并且耐冲击性,成型性,耐候性和耐化学性优异,并且可用于注射成型产品,挤出成型产品,膜,片材等。此外,它提供了一种 优良的阻尼材料。

    Idle speed control device for an engine
    46.
    发明授权
    Idle speed control device for an engine 失效
    怠速发动机调速装置

    公开(公告)号:US5513610A

    公开(公告)日:1996-05-07

    申请号:US423445

    申请日:1995-04-19

    摘要: The idle speed control device according to the present invention controls a two-solenoid rotary type idle speed control valve properly even when one of the solenoids fails. When one of the solenoids fails, the device calculates the amount of bypass air from the amount of inlet air and the degree of opening of the throttle valve, and estimates the degree of opening of the idle speed control valve. If the degree of opening of the bypass valve is larger than that of the neutral valve position, the device sets the duty ratio of the control signal for driving the idle speed control valve at 0%, and if the degree of opening of the idle speed control valve is less than that of the neutral valve position, the device sets the duty ratio of the control signal at 100%. By this control, the two-solenoid rotary type idle speed control valve is maintained at neutral valve position without determining the type of the failure of the solenoids precisely.

    摘要翻译: 根据本发明的怠速控制装置即使当其中一个螺线管故障时也适当地控制双电磁旋转怠速控制阀。 当其中一个螺线管故障时,该装置根据入口空气量和节流阀的开度计算旁路空气量,并估计怠速控制阀的开度。 如果旁通阀的开度大于中性阀位置的开度,则将该怠速控制阀的驱动控制信号的占空比设定为0%,如果怠速的开度 控制阀小于中性阀位置时,设备将控制信号的占空比设置为100%。 通过该控制,双电磁旋转式怠速转速控制阀保持在中性阀位置,而不会精确地确定螺线管的故障类型。

    Thin film silicon semiconductor device and process for producing thereof
    47.
    发明授权
    Thin film silicon semiconductor device and process for producing thereof 失效
    薄膜硅半导体器件及其制造方法

    公开(公告)号:US5248630A

    公开(公告)日:1993-09-28

    申请号:US857944

    申请日:1992-03-26

    摘要: A thin film silicon semiconductor device provided on a substrate according to the present invention comprises a thin polycrystalline silicon film having a lattice constant smaller than that of a silicon single crystal and a small crystal grain size. This thin polycrystalline silicon film can be obtained by depositing a thin amorphous silicon film in an inert gas having a pressure of 3.5 Pa or lower by a sputtering deposition method and annealing the thin amorphous silicon film for a short time of 10 seconds or less to effect polycrystallization thereof. A thin film silicon semiconductor device comprising such a thin polycrystalline silicon film having a small lattice constant has excellent characteristics including a carrier mobility of 100 cm.sup.2 /V.multidot.s or higher.

    摘要翻译: 根据本发明的设置在基板上的薄膜硅半导体器件包括晶格常数小于单晶晶格和小晶粒尺寸的薄多晶硅薄膜。 该薄多晶硅膜可以通过溅射沉积法将薄的非晶硅膜沉积在具有3.5Pa或更低的压力的惰性气体中并在10秒或更短的时间内退火薄的非晶硅膜来获得, 多结晶。 包括这种具有小晶格常数的薄多晶硅膜的薄膜硅半导体器件具有包括100cm 2 / Vxs或更高的载流子迁移率的优异特性。