公开(公告)号：US20120075216A1

公开(公告)日：2012-03-29

申请号：US13235158

申请日：2011-09-16

申请人： Justin Phelps Black ,  Ravindra V. Shenoy ,  Evgeni Petrovich Gousev ,  Aristotele Hadjichristos ,  Thomas Andrew Myers ,  Jonghae Kim ,  Mario Francisco Velez ,  Je-Hsiung Jeffrey Lan ,  Chi Shun Lo

发明人： Justin Phelps Black ,  Ravindra V. Shenoy ,  Evgeni Petrovich Gousev ,  Aristotele Hadjichristos ,  Thomas Andrew Myers ,  Jonghae Kim ,  Mario Francisco Velez ,  Je-Hsiung Jeffrey Lan ,  Chi Shun Lo

IPC分类号： G06F3/041 ,  H01L21/02 ,  H03F3/04 ,  H01L27/06

CPC分类号： G02B26/001 ,  H01L21/565 ,  H01L23/3128 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/00

摘要： This disclosure provides systems, methods and apparatus for combining devices deposited on a first substrate, with integrated circuits formed on a second substrate such as a semiconducting substrate or a glass substrate. The first substrate may be a glass substrate. The first substrate may include conductive vias. A power combiner circuit may be deposited on a first side of the first substrate. The power combiner circuit may include passive devices deposited on at least the first side of the first substrate. The integrated circuit may include a power amplifier circuit disposed on and configured for electrical connection with the power combiner circuit, to form a power amplification system. The conductive vias may include thermal vias configured for conducting heat from the power amplification system and/or interconnect vias configured for electrical connection between the power amplification system and a conductor on a second side of the first substrate.

摘要翻译： 本公开提供了用于组合沉积在第一衬底上的器件与形成在第二衬底（例如半导体衬底或玻璃衬底）上的集成电路的系统，方法和装置。 第一基板可以是玻璃基板。 第一衬底可以包括导电通孔。 功率组合器电路可以沉积在第一衬底的第一侧上。 功率组合器电路可以包括沉积在第一衬底的至少第一侧上的无源器件。 集成电路可以包括设置在功率合成器电路上并被配置为与功率组合器电路电连接的功率放大器电路，以形成功率放大系统。 导电通孔可以包括被配置为用于传导来自功率放大系统的热的热通孔和/或配置用于功率放大系统和第一衬底的第二侧上的导体之间的电连接的互连通孔。

公开(公告)号：US07825674B2

公开(公告)日：2010-11-02

申请号：US11479068

申请日：2006-06-30

申请人： Makarand S. Shinde ,  Richard A. Larder ,  Timothy E. Cooper ,  Ravindra V. Shenoy ,  Benjamin N. Eldridge

发明人： Makarand S. Shinde ,  Richard A. Larder ,  Timothy E. Cooper ,  Ravindra V. Shenoy ,  Benjamin N. Eldridge

IPC分类号： G01R31/02 ,  H01R11/18

CPC分类号： G01R31/2889 ,  G01R1/07378

摘要： A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface tile provided between the probes and a lower flexural strength space transformer substrate.

摘要翻译： 提供了用于晶片测试系统的探针卡的机械支撑结构，以增加对支撑弹簧探针的极低弯曲强度基底的支撑。 通过以下方式提供增加的机械支撑：（1）围绕基板的周边的框架，在基板的表面上具有增大尺寸的水平延伸; （2）具有弯曲的板簧，使得板簧能够垂直延伸并使内框架接近弹簧探针; （3）绝缘柔性膜或加工到内框架中的负载支撑构件，使低弯曲强度基板与其边缘更远地接合; （4）加载支撑结构，例如支撑销，以提供支撑以抵消在空间变压器基板的中心附近的探头负载; 和/或（5）设置在所述探针与下弯曲强度空间变换器基板之间的高刚性界面砖。

公开(公告)号：US07326327B2

公开(公告)日：2008-02-05

申请号：US10456343

申请日：2003-06-06

申请人： Michael Armstrong ,  Gayle Herman ,  Greg Omweg ,  Ravindra V. Shenoy

发明人： Michael Armstrong ,  Gayle Herman ,  Greg Omweg ,  Ravindra V. Shenoy

IPC分类号： C25D5/02 ,  C25D3/00

CPC分类号： C25D3/54 ,  Y10T428/12 ,  Y10T428/24612 ,  Y10T428/265

摘要： A halide based stress reducing agent is added to the bath of a rhodium plating solution. The stress reducing agent reduces stress in the plated rhodium, increasing the thickness of the rhodium that can be plated without cracking. In addition, the stress reducing agent does not appreciably decrease the wear resistance or hardness of the plated rhodium.

摘要翻译： 将卤化物基应力降低剂加入到镀铑溶液的浴中。 减压剂可减少电镀铑中的应力，增加镀层中不会开裂的铑的厚度。 此外，应力降低剂不会明显降低镀覆铑的耐磨性或硬度。

公开(公告)号：US07071715B2

公开(公告)日：2006-07-04

申请号：US10771099

申请日：2004-02-02

申请人： Makarand S. Shinde ,  Richard A. Larder ,  Timothy E. Cooper ,  Ravindra V. Shenoy ,  Benjamin N. Eldridge

发明人： Makarand S. Shinde ,  Richard A. Larder ,  Timothy E. Cooper ,  Ravindra V. Shenoy ,  Benjamin N. Eldridge

IPC分类号： G01R31/02 ,  G01R31/26 ,  H05K7/02 ,  H01R12/04

CPC分类号： G01R31/2889 ,  G01R1/07378

摘要： A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface tile provided between the probes and a lower flexural strength space transformer substrate.

摘要翻译： 提供了用于晶片测试系统的探针卡的机械支撑结构，以增加对支撑弹簧探针的极低弯曲强度基底的支撑。 通过以下方式提供增加的机械支撑：（1）围绕基板的周边的框架，在基板的表面上具有增大尺寸的水平延伸; （2）具有弯曲的板簧，使得板簧能够垂直延伸并使内框架接近弹簧探针; （3）绝缘柔性膜或加工到内框架中的负载支撑构件，使低弯曲强度基板与其边缘更远地接合; （4）加载支撑结构，例如支撑销，以提供支撑以抵消在空间变压器基板的中心附近的探头负载; 和/或（5）设置在所述探针与下弯曲强度空间变换器基板之间的高刚性界面砖。