公开(公告)号：US20050168731A1

公开(公告)日：2005-08-04

申请号：US11095614

申请日：2005-04-01

申请人： Hisae Shibuya ,  Yuji Takagi

发明人： Hisae Shibuya ,  Yuji Takagi

IPC分类号： H01L21/66 ,  G01N21/95 ,  G06T7/00 ,  G01N21/88

CPC分类号： G01N21/956 ,  G06T7/0006 ,  G06T7/001 ,  G06T2207/30148

摘要： The distribution states of defects are analyzed on the basis of the coordinates of defects detected by an inspection apparatus to classify them into a distribution feature category, or any one of repetitive defect, congestion defect, linear distribution defect, ring/lump distribution defect and random defect. In the manufacturing process for semiconductor substrates, defect distribution states are analyzed on the basis of defect data detected by an inspection apparatus, thereby specifying the cause of defect in apparatus or process.

摘要翻译： 基于由检查装置检测到的缺陷坐标来分析缺陷的分布状态，将其分类为分布特征类别，或重复缺陷，拥塞缺陷，线性分布缺陷，环/块分布缺陷和随机 缺陷。 在半导体基板的制造工序中，基于由检查装置检测出的缺陷数据来分析缺陷分布状态，从而指定装置或处理中的缺陷的原因。

公开(公告)号：USRE38706E1

公开(公告)日：2005-02-22

申请号：US10345243

申请日：2003-01-16

申请人： Yuji Takagi ,  Takahiro Nagai ,  Yoshihisa Fukushima ,  Shunji Ohara ,  Isao Satoh

发明人： Yuji Takagi ,  Takahiro Nagai ,  Yoshihisa Fukushima ,  Shunji Ohara ,  Isao Satoh

IPC分类号： G11B7/00

CPC分类号： G11B7/00

摘要： In a recording and reproducing apparatus for a disc-shaped recording medium, and a defect substitution method for a disc-shaped recording medium (8), whether reproduction of recorded data is good is determined by sector unit and not by product code unit, defective sector discrimination is performed by sector unit, and only sectors determined defective are alternately recorded, when using a recording format in which data that is error detection and correction coded with a product code is segmented and recorded to a plurality of sectors.

公开(公告)号：US06841403B2

公开(公告)日：2005-01-11

申请号：US10348747

申请日：2003-01-21

申请人： Maki Tanaka ,  Shunji Maeda ,  Minori Noguchi ,  Takafumi Okabe ,  Yuji Takagi ,  Chie Shishido

发明人： Maki Tanaka ,  Shunji Maeda ,  Minori Noguchi ,  Takafumi Okabe ,  Yuji Takagi ,  Chie Shishido

IPC分类号： H01L21/00 ,  H01L21/66 ,  G06F19/00

CPC分类号： H01L21/67276 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed herein is a method for manufacturing semiconductor device and a method and apparatus for processing detected defect data, making it possible to quickly infer or determine a process and related manufacturing equipment that causes defects in a fabrication line of semiconductor devices, take remedy action, and achieve a constant and high yield. The method of the invention comprises quantitatively evaluating similarity of a defects distribution on a wafer that suffered abnormal occurrence of defects to inspection results for wafers inspected in the past, analyzing cyclicity of data sequence of evaluated similarity, evaluating relationship between the cyclicity of defects obtained from the analysis and the process method according to each manufacturing equipment in the fabrication line, and inferring or determining a causal process and equipment that caused the defects.

摘要翻译： 本发明公开了一种用于制造半导体器件的方法和用于处理检测到的缺陷数据的方法和装置，使得可以快速推断或确定导致半导体器件制造线中的缺陷的处理和相关制造设备，采取补救措施，以及 实现恒定和高收益。 本发明的方法包括定量评估在异常发生缺陷的晶片上的缺陷分布与以往检查的晶片的检查结果的相似性，分析评估的相似性的数据序列的循环性，评估从 根据制造线上每个制造设备的分析和处理方法，并推断或确定引起缺陷的因果过程和设备。

公开(公告)号：US06828554B2

公开(公告)日：2004-12-07

申请号：US10785949

申请日：2004-02-26

申请人： Takashi Hiroi ,  Maki Tanaka ,  Masahiro Watanabe ,  Asahiro Kuni ,  Yukio Matsuyama ,  Yuji Takagi ,  Hiroyuki Shinada ,  Mari Nozoe ,  Aritoshi Sugimoto

发明人： Takashi Hiroi ,  Maki Tanaka ,  Masahiro Watanabe ,  Asahiro Kuni ,  Yukio Matsuyama ,  Yuji Takagi ,  Hiroyuki Shinada ,  Mari Nozoe ,  Aritoshi Sugimoto

IPC分类号： G01N2300

CPC分类号： H01J37/28 ,  H01J2237/2817

摘要： A method of detecting a defect includes of determining an image acquisition condition for irradiating a converged electron beam onto a specimen and detecting a secondary electron emanated from the specimen, acquiring an image by detecting the secondary electron emanated from the specimen in synchronism with the irradiation of the electron beam, processing the acquired image to detect a defect on the specimen, and outputting information regarding the detected defect. The image acquisition condition is determined based on plural images which are acquired by changing at least one of acceleration condition of the secondary electron and an electrical field in the vicinity of the specimen.

公开(公告)号：US06797526B2

公开(公告)日：2004-09-28

申请号：US10232871

申请日：2002-08-30

申请人： Maki Tanaka ,  Shunji Maeda ,  Minori Noguchi ,  Takafumi Okabe ,  Yuji Takagi ,  Chie Shishido

发明人： Maki Tanaka ,  Shunji Maeda ,  Minori Noguchi ,  Takafumi Okabe ,  Yuji Takagi ,  Chie Shishido

IPC分类号： H01L2100

CPC分类号： H01L21/67276 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed herein is a method for manufacturing semiconductor device and a method and apparatus for processing detected defect data, making it possible to quickly infer or determine a process and related manufacturing equipment that causes defects in a fabrication line of semiconductor devices, take remedy action, and achieve a constant and high yield. The method of the invention comprises quantitatively evaluating similarity of a defects distribution on a wafer that suffered abnormal occurrence of defects to inspection results for wafers inspected in the past, analyzing cyclicity of data sequence of evaluated similarity, evaluating relationship between the cyclicity of defects obtained from the analysis and the process method according to each manufacturing equipment in the fabrication line, and inferring or determining a causal process and equipment that caused the defects.

摘要翻译： 本发明公开了一种用于制造半导体器件的方法和用于处理检测到的缺陷数据的方法和装置，使得可以快速推断或确定导致半导体器件制造线中的缺陷的处理和相关制造设备，采取补救措施，以及 实现恒定和高收益。 本发明的方法包括定量评估在异常发生缺陷的晶片上的缺陷分布与以往检查的晶片的检查结果的相似性，分析评估的相似性的数据序列的循环性，评估从 根据制造线上每个制造设备的分析和处理方法，并推断或确定引起缺陷的因果过程和设备。

公开(公告)号：US06728195B2

公开(公告)日：2004-04-27

申请号：US10044321

申请日：2002-01-10

申请人： Isao Satoh ,  Yoshihisa Fukushima ,  Yuji Takagi ,  Yasushi Azumatani ,  Hiroshi Hamasaka

发明人： Isao Satoh ,  Yoshihisa Fukushima ,  Yuji Takagi ,  Yasushi Azumatani ,  Hiroshi Hamasaka

IPC分类号： G11B724

CPC分类号： G11B7/24038 ,  G11B7/00736 ,  G11B7/00745 ,  G11B7/08511 ,  G11B7/0908 ,  G11B7/0945 ,  G11B7/24 ,  G11B7/26 ,  G11B2007/0013

摘要： A multi-layered optical disk comprising a plurality of recording layers accumulated in the thickness direction wherein a light beam is focused on one of tracks of one of the layers thereby to record and reproduce data, the optical disk being characterized in that recording layers each have an identification section storing an address of the recording layer which the identification section belongs to.

摘要翻译： 一种多层光盘，包括在厚度方向上累积的多个记录层，其中光束聚焦在一个层的一个轨道上，从而记录和再现数据，该光盘的特征在于记录层各自具有 存储识别部所属的记录层的地址的识别部。

公开(公告)号：US06657221B2

公开(公告)日：2003-12-02

申请号：US09988436

申请日：2001-11-20

申请人： Ryo Nakagaki ,  Yuji Takagi ,  Takashi Hiroi ,  Masahiro Watanabe ,  Minori Noguchi ,  Kazuo Aoki

发明人： Ryo Nakagaki ,  Yuji Takagi ,  Takashi Hiroi ,  Masahiro Watanabe ,  Minori Noguchi ,  Kazuo Aoki

IPC分类号： G01N2186

CPC分类号： G01N21/9501

摘要： There are provided an automatic image collection apparatus and method capable of acquiring and automatically classifying fast an image of a defect part caused in a semiconductor wafer production process detected by a defect inspection unit. The image collection apparatus for automatically imaging and collecting images of a plurality of observed parts on a semiconductor wafer is provided with a scheduling portion for deciding the imaging order of the defects and stage moving velocities based on the positional relation of the plurality of observed parts on the wafer and a control portion for feed backing the stage movement amount to the beam deflection amount, thereby imaging and collecting images via an optimal route while moving the stage.

摘要翻译： 提供一种自动图像采集装置和方法，其能够快速地获取由缺陷检查单元检测的半导体晶片制造过程中引起的缺陷部分的图像的自动分类。 用于在半导体晶片上自动成像和收集多个观察部分的图像的图像采集装置设置有调度部分，用于基于多个观察部分的位置关系来确定缺陷和阶段移动速度的成像顺序 晶片和用于馈送背景的控制部分，舞台移动量达到光束偏转量，从而在移动舞台的同时通过最佳路线对图像进行成像和收集。

公开(公告)号：US06567350B1

公开(公告)日：2003-05-20

申请号：US09664835

申请日：2000-09-19

申请人： Yuji Takagi ,  Keiichi Kawashima ,  Hiroshi Sugimoto ,  Hirofumi Ide ,  Kenzo Ishibashi

发明人： Yuji Takagi ,  Keiichi Kawashima ,  Hiroshi Sugimoto ,  Hirofumi Ide ,  Kenzo Ishibashi

IPC分类号： G11B2108

CPC分类号： G11B7/126 ,  G11B7/094 ,  G11B20/10 ,  G11B27/034 ,  G11B27/105 ,  G11B27/36 ,  G11B33/144 ,  G11B2220/216 ,  G11B2220/2562 ,  G11B2220/2575 ,  H04N5/85 ,  H04N9/8042

摘要： A control adjustment method for adjusting a control of a recording/reproduction apparatus for a disc-shaped recording medium is provided, wherein the control is adjusted in response to an environmental change inside the recording/reproduction apparatus, such as a temperature change, the control adjustment method comprising the steps of: requesting an execution of the control adjustment; determining whether to inhibit or approve the execution of the control adjustment; and executing the control adjustment in the case where the execution of the control adjustment is approved in the step of determining the execution of adjustment.

摘要翻译： 提供了一种用于调整用于盘形记录介质的记录/再现装置的控制的控制调节方法，其中响应于诸如温度变化的记录/再现装置内的环境变化来调节控制，控制 调整方法，包括以下步骤：请求执行所述控制调整; 确定是否禁止或批准执行控制调整; 以及在确定调整执行的步骤中批准执行控制调整的情况下执行控制调整。

公开(公告)号：US06373054B1

公开(公告)日：2002-04-16

申请号：US09752468

申请日：2001-01-03

申请人： Takashi Hiroi ,  Maki Tanaka ,  Masahiro Watanabe ,  Asahiro Kuni ,  Yukio Matsuyama ,  Yuji Takagi ,  Hiroyuki Shinada ,  Mari Nozoe ,  Aritoshi Sugimoto

发明人： Takashi Hiroi ,  Maki Tanaka ,  Masahiro Watanabe ,  Asahiro Kuni ,  Yukio Matsuyama ,  Yuji Takagi ,  Hiroyuki Shinada ,  Mari Nozoe ,  Aritoshi Sugimoto

IPC分类号： H01J37304

摘要： An inspection method and apparatus which controls an acceleration voltage of an electron beam, irradiates the electron beam to an object to be inspected mounted on a stage which is continuously moving at least in one direction, detects at least one of a secondary electron and a reflected electron emanated from the object by the irradiating, obtains an image of the object from the detected electron by using positional information of the stage, conducts inspection or measurement of the object using the image obtained, and outputs a result of the inspection or the measurement through a network system which is connected to a computer.

公开(公告)号：US06172365B2

公开(公告)日：2001-01-09

申请号：US09437313

申请日：1999-11-10

申请人： Takashi Hiroi ,  Maki Tanaka ,  Masahiro Watanabe ,  Asahiro Kuni ,  Yukio Matsuyama ,  Yuji Takagi ,  Hiroyuki Shinada ,  Mari Nozoe ,  Aritoshi Sugimoto

发明人： Takashi Hiroi ,  Maki Tanaka ,  Masahiro Watanabe ,  Asahiro Kuni ,  Yukio Matsuyama ,  Yuji Takagi ,  Hiroyuki Shinada ,  Mari Nozoe ,  Aritoshi Sugimoto

IPC分类号： H01J3728

CPC分类号： H01J37/28 ,  H01J2237/2817

摘要： An electron beam inspection method including the steps of irradiating an electron beam to an object to be inspected, detecting at least one of a secondary electron and a reflected electron emanated from the object by the irradiation of the electron beam, and obtaining an image of the object from the detected electron. The method further includes the steps of controlling an electric field in a neighborhood of the object for filtering the at least one of the secondary and reflected electron emanated from the object so as to control the contrast of the image, detecting at least one of the secondary and reflected electron emanated from the object which passes through the electric field in the neighborhood of the object by the irradiation of the electron beam, and conducting inspection or measurement of the object on the basis of a detected signal of the detection in the controlled electric field.

摘要翻译： 一种电子束检查方法，包括以下步骤：将电子束照射到待检查对象，通过电子束的照射检测从物体发射的二次电子和反射电子中的至少一种，并获得 物体来自被检测的电子。 该方法还包括以下步骤：控制物体附近的电场，以对从物体发出的次级和反射电子中的至少一种进行过滤，以便控制图像的对比度，检测二次 以及通过电子束的照射而在物体附近通过电场发射的反射电子，并且根据检测到的受控电场的检测信号进行物体的检查或测量 。