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55 条记录 (耗时 0.035 秒)

    Combination structural support and thermal protection system
    42.
    发明申请
    Combination structural support and thermal protection system 有权
    组合结构支撑和热保护系统

    公开(公告)号：US20090022977A1

    公开(公告)日：2009-01-22

    申请号：US12174360

    申请日：2008-07-16

    申请人： Kenneth L. Dudley ,  Holly A. Elliott ,  John W. Connell ,  Joseph G. Smith ,  Sayata Ghose ,  Kent A. Watson ,  Donavon Mark Delozier

    发明人： Kenneth L. Dudley ,  Holly A. Elliott ,  John W. Connell ,  Joseph G. Smith ,  Sayata Ghose ,  Kent A. Watson ,  Donavon Mark Delozier

    IPC分类号： B32B5/16 ,  C08K3/08

    CPC分类号： C08K3/08 ,  B82Y30/00 ,  C08K2201/011

    摘要： A dielectric material includes a network of nanosubstrates, such as but not limited to nanotubes, nanosheets, or other nanomaterials or nanostructures, a polymer base material or matrix, and nanoparticles constructed at least partially of an elemental metal. The network has a predetermined nanosubstrate loading percentage by weight with respect to a total weight of the dielectric material, and a preferential or predetermined longitudinal alignment with respect to an orientation of an incident electrical field. A method of forming the dielectric material includes depositing the metal-based nanoparticles onto the nanosubstrates and subsequently mixing these with a polymer matrix. Once mixed, alignment can be achieved by melt extrusion or a similar mechanical shearing process. Alignment of the nanosubstrate may be in horizontal or vertical direction with respect to the orientation of an incident electrical field.

    摘要翻译： 电介质材料包括纳米基层网络，例如但不限于纳米管，纳米片或其它纳米材料或纳米结构，聚合物基材或基体，以及至少部分由元素金属构成的纳米颗粒。 网络具有相对于电介质材料的总重量的预定的纳米基质载荷百分比，以及相对于入射电场的取向的优选或预定的纵向对准。 形成电介质材料的方法包括将金属基纳米颗粒沉积到纳米基板上，随后将其与聚合物基体混合。 一旦混合，可以通过熔体挤出或类似的机械剪切工艺来实现对准。 纳米基板的对准可以相对于入射电场的取向在水平或垂直方向上。

    Poly(arylene ether imidazole) surfacing films for flat and parabolic structures
    43.
    发明授权
    Poly(arylene ether imidazole) surfacing films for flat and parabolic structures 失效
    用于平面和抛物线结构的聚（亚芳基醚咪唑）表面膜

    公开(公告)号：US5496639A

    公开(公告)日：1996-03-05

    申请号：US238102

    申请日：1994-05-04

    申请人： John W. Connell ,  Timothy W. Towell ,  Stephen S. Tompkins

    发明人： John W. Connell ,  Timothy W. Towell ,  Stephen S. Tompkins

    IPC分类号： H01Q15/14

    CPC分类号： H01Q15/141 ,  Y10T428/31511 ,  Y10T428/31721

    摘要： Films of thermoplastic poly(arylene ether imidazole)s (PAEI)s are used as surface modifiers for neat resin panels and composite resin panels. The PAEI polymer contains imidazole groups along the backbone which co-cure, i.e., react chemically, with epoxies or bismaleimides during processing and thereby provide excellent adhesion between the PAEI film and an epoxy or bismaleimide neat resin or composite resin facesheet. The film provides good adhesion and a smooth surface to the finished part and acts as a release agent from the mold. The as-processed integral structures have very smooth (specular) surfaces, and since the film releases readily from a glass mold, no release agent is necessary. The PAEI film is thermally stable, resistant to electron radiation, and adheres tenaciously to the facesheet. The film maintains good adhesion even after thermal cycling from room temperature to .about. -196.degree. C.

    摘要翻译： 热塑性聚（亚芳基醚咪唑）（PAEI）的膜用作纯树脂板和复合树脂板的表面改性剂。 PAEI聚合物包含沿着主链的咪唑基，其在加工期间与环氧化物或双马来酰亚胺共固化，即化学反应，从而提供PAEI膜与环氧或双马来酰亚胺纯树脂或复合树脂面之间的优异粘合性。 该膜提供良好的粘附性和光滑的表面到成品部分并充当脱模剂从模具。 经处理的整体结构具有非常光滑的（镜面）表面，并且由于膜容易从玻璃模具中释放，因此不需要脱模剂。 PAEI膜是热稳定的，耐电子辐射，并且牢固地粘附在面板上。 即使在从室温到DIFFERENCE -196℃的热循环之后，该膜也保持良好的附着力。

    Highly thermal conductive nanocomposites
    45.
    发明授权
    Highly thermal conductive nanocomposites 有权
    高导热性纳米复合材料

    公开(公告)号：US09067794B1

    公开(公告)日：2015-06-30

    申请号：US12536153

    申请日：2009-08-05

    申请人： Ya-Ping Sun ,  John W. Connell ,  Lucia Monica Veca

    发明人： Ya-Ping Sun ,  John W. Connell ,  Lucia Monica Veca

    IPC分类号： C01B31/04 ,  C08K9/00 ,  C08L63/00 ,  C08K3/04

    CPC分类号： C01B32/152 ,  B82Y30/00 ,  C01B32/22 ,  C01B32/225 ,  C08K3/04 ,  C08K5/14 ,  C08K9/04 ,  C08K2201/011 ,  C09K5/14

    摘要： Disclosed are methods for forming carbon-based fillers as may be utilized in forming highly thermal conductive nanocomposite materials. Formation methods include treatment of an expanded graphite with an alcohol/water mixture followed by further exfoliation of the graphite to form extremely thin carbon nanosheets that are on the order of between about 2 and about 10 nanometers in thickness. Disclosed carbon nanosheets can be functionalized and/or can be incorporated in nanocomposites with extremely high thermal conductivities. Disclosed methods and materials can prove highly valuable in many technological applications including, for instance, in formation of heat management materials for protective clothing and as may be useful in space exploration or in others that require efficient yet light-weight and flexible thermal management solutions.

    摘要翻译： 公开了用于形成高导热性纳米复合材料的碳基填料的形成方法。 形成方法包括用醇/水混合物处理膨胀石墨，然后进一步剥离石墨以形成厚度在约2至约10纳米之间的极薄碳纳米片。 公开的碳纳米片可以被官能化和/或可以掺入具有极高热导率的纳米复合材料中。 公开的方法和材料在许多技术应用中可以证明是非常有价值的，包括例如形成用于防护服的热管理材料，并且可用于空间探索或其它需要高效而轻量且灵活的热管理解决方案的方法和材料。

    Method for exfoliation of hexagonal boron nitride
    50.
    发明授权
    Method for exfoliation of hexagonal boron nitride 有权
    六方氮化硼剥离方法

    公开(公告)号：US08303922B2

    公开(公告)日：2012-11-06

    申请号：US12546185

    申请日：2009-08-24

    申请人： Yi Lin ,  John W. Connell

    发明人： Yi Lin ,  John W. Connell

    IPC分类号： C01B21/064 ,  C01B35/10 ,  C01B35/00 ,  B29C47/00 ,  C07K1/00 ,  C07K14/00 ,  C07K16/00 ,  C07C205/00 ,  A62D3/00 ,  B01J19/12 ,  C08F110/00 ,  C08G73/10

    CPC分类号： C01B21/0687 ,  C01P2002/85 ,  C01P2004/20 ,  Y10T428/139 ,  Y10T442/699

    摘要： A new method is disclosed for the exfoliation of hexagonal boron nitride into mono- and few-layered nanosheets (or nanoplatelets, nanomesh, nanoribbons). The method does not necessarily require high temperature or vacuum, but uses commercially available h-BN powders (or those derived from these materials, bulk crystals) and only requires wet chemical processing. The method is facile, cost efficient, and scalable. The resultant exfoliated h-BN is dispersible in an organic solvent or water thus amenable for solution processing for unique microelectronic or composite applications.

    摘要翻译： 公开了一种将六角形氮化硼剥离成单层和几层纳米片（或纳米片，纳米片，纳米带）的新方法。 该方法不一定需要高温或真空，但使用市售的h-BN粉末（或衍生自这些材料的本体晶体）的粉末，并且仅需要湿化学处理。 该方法简便，成本效益高，可扩展。 所得到的剥离的h-BN可分散在有机溶剂或水中，因此适用于独特的微电子或复合应用的溶液处理。