摘要:
An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
摘要:
An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
摘要:
A magnetic disk drive is to be provided wherein a ramp and a magnetic disk do not overlap each other and both rigidity and dynamic characteristics of a suspension are maintained. In one embodiment, a ramp and an actuator lying at a retractive position are spaced away from and do not overlap an outer peripheral end of a magnetic disk. A tab is formed centrally of a front end of a load beam and is bent in U shape. Flanges are formed along both longitudinal edges of the load beam. An aperture is formed in a front portion of the load beam. The aperture permits the tab to be machined in a desired shape. An aperture is formed behind the aperture. The aperture is used to clamp a head in a wire bonding step for the head. The apertures and are not formed in an integrally contiguous manner but are separated from each other by a bridge portion.
摘要:
Embodiments of the invention provide techniques to prevent, when a bonding pad and a lead wiring pad are to be connected using a solder ball, the solder ball from deviating from a centerline and a soldering problem from occurring. In one embodiment, a head suspension assembly includes a solder ball disposed between a lead wiring pad provided for a flexure and a bonding pad provided for a slider. The solder ball is then melted for making a soldered joint between the lead wiring pad and the bonding pad. A through slot is provided at a position near a centerline on a front surface of the lead wiring pad. The solder ball is dropped into the through slot by gravity from the front surface of the lead wiring pad. A contact area in contact with the solder ball is thereby secured on a side of the slider.
摘要:
An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
摘要:
A base plate of a stainless-steel body material formed by pressing is polished and cleared of burrs by means of an abrasive material that consists mainly of Fe2O3 in a polishing process. The polished base plate is heated to a heat treatment temperature for solid solution in a reducing atmosphere in a heat treatment process. In this heat treatment process, an oxide in the constituents of minute fragments of the abrasive material in the surface of the body material of the base plate is reduced to leave iron, which is dispersed into the body material.
摘要翻译:通过压制形成的不锈钢主体材料的基板通过在抛光工艺中主要由Fe 2 O 3组成的研磨材料抛光和清除毛刺。 在热处理工序中将抛光后的基板加热至还原气氛中的固溶体的热处理温度。 在该热处理工序中,基板的主体材料表面的研磨材料的微小碎片成分中的氧化物被还原,留下分散在主体材料中的铁。
摘要:
A method of wiring a head suspension assembly includes fixing a tube binding a plurality of wires on a suspension assembly, and fixing the wires extending from the fixed tube on the suspension while leading them to a top side of the suspension. The suspension has a tab frame with first and second frames. Each wire led to the top side of the suspension is bonded to the second frame of a tab frame. An insulation film is removed from each connecting portion of the wires to connect the wires to respective connecting pads of the slider. A first frame is bent substantially perpendicular to the suspension, and the second frame is bent substantially perpendicular to the first frame, thereby positioning the wires bonded to the second frame at the connecting pads on the slider. The wires are then ultrasonically welded to the respective connecting pads on the slider.
摘要:
The present invention relates to controlling the flying height of a magnetic head or slider relative to a magnetic disk in a disk storage device. The flying height of the negative pressure slider is not affected by changes in temperature. By controlling a ratio of crown sensitivity of the flying height to camber sensitivity of the flying height, changes in flying height due to the crown change of the slider corresponding to temperature changes are canceled. It is necessary to set a ratio of the area of a reverse step surface, R, to the area of a center rail, C, within a range of 2:1 to 6:1 (preferably 4:1 to 6:1; ideally 5:1). Then, setting can be performed so that the center of the substantially negative pressure generated may be the center of the slider surface.
摘要:
Apertures are formed in the portion of a flexure adjacent to the soldered portions between the bonding pads of the slider and the lead pads of lead end portions. With this, an adhesive agent for bonding the slider to a flexure tongue is moved downward from the apertures so there is no fear that the adhesive agent will contact the lead pads and the bonding pads. This design prevents the protrusion of an adhesive agent from short-circuiting the flexure, and absorbs a warp produced by shrinkage of a soldered portion by decreasing rigidity of the flexure. When both the bonding pad formed on the slider and the lead pad of a lead fixed to the platform of the flexure are disposed and soldered, the quality of the soldered portion is improved by locating the pads as close to each other as possible.
摘要:
A head support arm of a disk drive device comprises; a front portion supporting a head/slider assembly, a rear portion pivotally mounted on a frame of the disk drive device, a bending portion between the front portion and the rear portion, a plurality of electrically conductive wires covered by a tube, and a first fixing position and a second fixing position symmetrically located on both sides of a center line of the head support arm at positions between the bending portion and the front portion, characterized in that the tube is attached to the head support arm between the bending portion and the rear portion, the plurality of electrically conductive wires extending from a front end of the tube on the side of the front portion of the head support arm extend over the bending portion and are divided into a first group and a second group, the first group of wires is fixed to the second fixing position.