公开(公告)号：US06459549B1

公开(公告)日：2002-10-01

申请号：US09586830

申请日：2000-06-05

申请人： Tatsumi Tsuchiya ,  Tatsushi Yoshida ,  Hiroyasu Tsuchida ,  Hiroo Inoue ,  Surya Pattanaik ,  Hiromi Ishikawa ,  Masaaki Nanba

发明人： Tatsumi Tsuchiya ,  Tatsushi Yoshida ,  Hiroyasu Tsuchida ,  Hiroo Inoue ,  Surya Pattanaik ,  Hiromi Ishikawa ,  Masaaki Nanba

IPC分类号： G11B2116

CPC分类号： G11B5/4853 ,  G11B5/4826

摘要： Apertures are formed in the portion of a flexure adjacent to the soldered portions between the bonding pads of the slider and the lead pads of lead end portions. With this, an adhesive agent for bonding the slider to a flexure tongue is moved downward from the apertures so there is no fear that the adhesive agent will contact the lead pads and the bonding pads. This design prevents the protrusion of an adhesive agent from short-circuiting the flexure, and absorbs a warp produced by shrinkage of a soldered portion by decreasing rigidity of the flexure. When both the bonding pad formed on the slider and the lead pad of a lead fixed to the platform of the flexure are disposed and soldered, the quality of the soldered portion is improved by locating the pads as close to each other as possible.

摘要翻译： 在与滑块的接合焊盘和引线端部的引线焊盘之间的焊接部分相邻的挠曲部分中形成有孔。 由此，用于将滑块结合到挠曲舌的粘合剂从孔向下移动，因此不用担心粘合剂将接触引线焊盘和焊盘。 这种设计防止了粘合剂的突起使挠曲变短，并且通过降低挠曲的刚度来吸收由焊接部分的收缩产生的翘曲。 当形成在滑块上的接合焊盘和固定到弯曲部的平台的引线的引线焊盘都被布置和焊接时，通过将焊盘尽可能靠近地定位来改善焊接部分的质量。

公开(公告)号：US06742694B2

公开(公告)日：2004-06-01

申请号：US10074718

申请日：2002-02-13

申请人： Takuya Satoh ,  Tatsumi Tsuchiya ,  Yasuhiro Mita ,  Lan Shi ,  Hiroyoshi Yokome ,  Tatsushi Yoshida ,  Surya Pattanaik

发明人： Takuya Satoh ,  Tatsumi Tsuchiya ,  Yasuhiro Mita ,  Lan Shi ,  Hiroyoshi Yokome ,  Tatsushi Yoshida ,  Surya Pattanaik

IPC分类号： B23K100

CPC分类号： G11B5/486 ,  B23K1/0056 ,  B23K3/0623 ,  B23K3/08 ,  B23K2101/40 ,  B23K2101/42 ,  H05K3/3442 ,  H05K3/3478

摘要： An apparatus joins bonding pads of a slider and lead pads of lead wires in a head gimbals assembly to improve efficiency, downsizing, and maintenance of solder-ball disposing devices, and solder-ball reflow devices for reflowing solder balls. The solder-ball disposing apparatus discharges solder balls from solder-ball discharging holes of a solder-ball feeder unit which are evacuated by a suction pad. An environmental space and an inert-gas supply portion for forming inactive atmosphere are formed on a table to eliminate an inert-gas supply unit from an optical unit, so that converged laser beams are directly radiated onto the solder balls.

摘要翻译： 一种装置将滑块的接合焊盘和引线的引线垫连接在头部万向节组件中，以提高焊球配置装置的效率，小型化和维护，以及用于回流焊球的焊球回流装置。 焊球配置装置从通过吸盘抽真空的焊球供给装置的焊球排出孔排出焊球。 用于形成无活性气氛的环境空间和惰性气体供应部分形成在桌子上以从光学单元消除惰性气体供应单元，使得会聚的激光束直接辐射到焊球上。

公开(公告)号：US06543677B2

公开(公告)日：2003-04-08

申请号：US09872252

申请日：2001-05-31

申请人： Surya Pattanaik ,  Takuya Satoh ,  Tatsumi Tsuchiya ,  Tatsushi Yoshida

发明人： Surya Pattanaik ,  Takuya Satoh ,  Tatsumi Tsuchiya ,  Tatsushi Yoshida

IPC分类号： B23K3512

CPC分类号： H05K3/3478 ,  B23K3/0623 ,  G11B5/4853 ,  H05K3/3442 ,  H05K3/3494 ,  H05K2201/10727 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/082 ,  H05K2203/086 ,  H05K2203/107

摘要： In devices for solder-ball bonding of a bonding pad of a slider of a head gimbal assembly to a lead pad of a lead, although a device that can perform (1) the supply of solder balls, (2) the positioning of a solder ball, (3) the blowing of nitrogen gas N2, and (4) the melting of the solder ball by laser radiation in one device is available, there are various problems that cannot improve the efficiency of laser radiation, maintenance, or operation efficiency, due to spatial restriction, difficulty of weight reduction, or fixed operation procedures. A solder-ball holder and an optical device are configured separately, and a vacuum pad is provided. A solder ball held in a solder-ball holding hole of the solder-ball holder is transported by the vacuum pad to a connecting portion of a head gimbal assembly, and solder reflow is carried out by the optical device.

公开(公告)号：US07583475B2

公开(公告)日：2009-09-01

申请号：US11066949

申请日：2005-02-25

申请人： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Takaaki Murokawa ,  Yoshio Uematsu ,  Tatsushi Yoshida ,  Nobuyuki Hashi ,  Hiroyasu Tsuchida ,  Takuma Muraki

发明人： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Takaaki Murokawa ,  Yoshio Uematsu ,  Tatsushi Yoshida ,  Nobuyuki Hashi ,  Hiroyasu Tsuchida ,  Takuma Muraki

IPC分类号： G11B5/48

CPC分类号： H05K3/3442 ,  G11B5/4853 ,  H05K1/111 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2201/10727 ,  H05K2203/041 ,  Y02P70/611 ,  Y02P70/613

摘要： Embodiments of the invention provide techniques to prevent, when a bonding pad and a lead wiring pad are to be connected using a solder ball, the solder ball from deviating from a centerline and a soldering problem from occurring. In one embodiment, a head suspension assembly includes a solder ball disposed between a lead wiring pad provided for a flexure and a bonding pad provided for a slider. The solder ball is then melted for making a soldered joint between the lead wiring pad and the bonding pad. A through slot is provided at a position near a centerline on a front surface of the lead wiring pad. The solder ball is dropped into the through slot by gravity from the front surface of the lead wiring pad. A contact area in contact with the solder ball is thereby secured on a side of the slider.

摘要翻译： 本发明的实施例提供了当使用焊球连接接合焊盘和引线接线焊盘时防止焊料球偏离中心线并发生焊接问题的技术。 在一个实施例中，头悬挂组件包括设置在为弯曲提供的引线布线垫和为滑块设置的接合焊盘之间的焊球。 然后将焊球熔化以在引线接线焊盘和焊盘之间形成焊接接头。 在引线配线衬垫的前表面上的中心线附近的位置处设有通槽。 焊球通过重力从引线接线板的前表面落入通槽。 因此，与滑块接触的接触区域被固定在滑块的一侧。

公开(公告)号：US20050199680A1

公开(公告)日：2005-09-15

申请号：US11066949

申请日：2005-02-25

申请人： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Takaaki Murokawa ,  Yoshio Uematsu ,  Tatsushi Yoshida ,  Nobuyuki Hashi ,  Hiroyasu Tsuchida ,  Takuma Muraki

发明人： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Takaaki Murokawa ,  Yoshio Uematsu ,  Tatsushi Yoshida ,  Nobuyuki Hashi ,  Hiroyasu Tsuchida ,  Takuma Muraki

IPC分类号： G11B5/60 ,  B23K1/00 ,  G11B21/21 ,  H05K1/11 ,  H05K3/34

CPC分类号： H05K3/3442 ,  G11B5/4853 ,  H05K1/111 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2201/10727 ,  H05K2203/041 ,  Y02P70/611 ,  Y02P70/613

摘要： Embodiments of the invention provide techniques to prevent, when a bonding pad and a lead wiring pad are to be connected using a solder ball, the solder ball from deviating from a centerline and a soldering problem from occurring. In one embodiment, a head suspension assembly includes a solder ball disposed between a lead wiring pad provided for a flexure and a bonding pad provided for a slider. The solder ball is then melted for making a soldered joint between the lead wiring pad and the bonding pad. A through slot is provided at a position near a centerline on a front surface of the lead wiring pad. The solder ball is dropped into the through slot by gravity from the front surface of the lead wiring pad. A contact area in contact with the solder ball is thereby secured on a side of the slider.

摘要翻译： 本发明的实施例提供了当使用焊球连接接合焊盘和引线接线焊盘时防止焊料球偏离中心线并发生焊接问题的技术。 在一个实施例中，头悬挂组件包括设置在为弯曲提供的引线布线垫和为滑块设置的接合焊盘之间的焊球。 然后将焊球熔化以在引线接线焊盘和焊盘之间形成焊接接头。 在引线配线衬垫的前表面上的中心线附近的位置处设有通槽。 焊球通过重力从引线接线板的前表面落入通槽。 因此，与滑块接触的接触区域被固定在滑块的一侧。

公开(公告)号：US06556384B1

公开(公告)日：2003-04-29

申请号：US09590659

申请日：2000-06-07

申请人： Hiroo Inoue ,  Tatsushi Yoshida ,  Tatsumi Tsuchiya ,  Yurika Shimozawa

发明人： Hiroo Inoue ,  Tatsushi Yoshida ,  Tatsumi Tsuchiya ,  Yurika Shimozawa

IPC分类号： G11B2124

CPC分类号： G11B5/4853 ,  G11B5/4826

摘要： The present invention provides a head supporting arm that allows for laser tacking while having a merging lip and limiters for loading/unloading respectively. A head supporting arm according to the present invention includes a load beam, and a flexure connecting the load beam to a slider. The load beam having a dimple for generating a gimbal motion between the flexure and the slider. The slider having a head connected to its one end. The head supporting arm of the present invention further including an exposure opening formed in the load beam. The exposure opening allowing for the exposing of the bonding portion of the flexure that is bonded to the other end of the slider. The exposure opening further providing an opening to extend the limiters formed unitarily with the flexure 36 onto a surface of the load beam that is opposite to the surface on which the flexure 36 is provided. The extended limiters are hooked to the load beam at the opposite surface.

摘要翻译： 本发明提供了一种头部支撑臂，其允许在具有合并唇缘和分别用于装载/卸载的限制器的情况下进行激光粘贴。 根据本发明的头部支撑臂包括负载梁和将负载梁连接到滑块的挠曲件。 负载梁具有用于在挠曲件和滑块之间产生万向运动的凹坑。 滑块具有连接到其一端的头部。 本发明的头支撑臂还包括形成在负载梁中的曝光开口。 曝光开口允许暴露粘合到滑块另一端的挠曲件的粘合部分。 曝光开口还提供一个开口，用于将与弯曲部36一体形成的限制器延伸到与设置挠曲件36的表面相反的负载梁的表面上。 扩展的限制器被钩在相对表面的负载梁上。

公开(公告)号：US6052259A

公开(公告)日：2000-04-18

申请号：US98687

申请日：1998-06-17

申请人： Yasuhiro Mita ,  Tatsushi Yoshida ,  Hiromi Ishikawa ,  Tatsuya Tanaka ,  Hiroyasu Tsuchida ,  Takuya Satoh

发明人： Yasuhiro Mita ,  Tatsushi Yoshida ,  Hiromi Ishikawa ,  Tatsuya Tanaka ,  Hiroyasu Tsuchida ,  Takuya Satoh

IPC分类号： G11B5/60 ,  G11B5/48 ,  G11B21/21

CPC分类号： G11B5/4853

摘要： A head support arm of a disk drive device comprises; a front portion supporting a head/slider assembly, a rear portion pivotally mounted on a frame of the disk drive device, a bending portion between the front portion and the rear portion, a plurality of electrically conductive wires covered by a tube, and a first fixing position and a second fixing position symmetrically located on both sides of a center line of the head support arm at positions between the bending portion and the front portion, characterized in that the tube is attached to the head support arm between the bending portion and the rear portion, the plurality of electrically conductive wires extending from a front end of the tube on the side of the front portion of the head support arm extend over the bending portion and are divided into a first group and a second group, the first group of wires is fixed to the second fixing position.

摘要翻译： 盘驱动装置的头部支撑臂包括： 支撑头部/滑动器组件的前部，可枢转地安装在盘驱动装置的框架上的后部，前部和后部之间的弯曲部分，由管覆盖的多个导电线，以及第一 固定位置和第二固定位置对称地位于头部支撑臂的中心线的两侧之间的弯曲部分和前部之间的位置处，其特征在于，所述管在所述弯曲部分和所述前部之间的位置处附接到所述头部支撑臂， 在头部支撑臂的前部侧从管的前端延伸的多个导电线在弯曲部分上延伸并分成第一组和第二组，第一组 电线固定到第二固定位置。

公开(公告)号：US07210221B2

公开(公告)日：2007-05-01

申请号：US10929512

申请日：2004-08-30

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： B23P19/02

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assembling jigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.

摘要翻译： 用于HG组件的底板和负载梁通过堆叠层系列形式的传送系统串联，堆叠和传送，以进行必要的组装过程，例如层接合，滑块附接和电连接 其上的端子。 当为每个制造过程转移未完成的HG组件时，未完成的HG组件安装在组装夹具上，例如托盘或用于转移的块。 因此，需要组装夹具的数量至少等于在各个组装过程中保留的未完成的HG组件的数量。 因此，减少了工作空间的效率，并且由于需要组装夹具而引起制造成本的上升。

公开(公告)号：US20050028353A1

公开(公告)日：2005-02-10

申请号：US10929322

申请日：2004-08-30

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： G11B21/21 ,  G11B5/48 ,  G11B21/20 ,  G11B5/012 ,  G11B17/00

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assemblingjigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.

摘要翻译： 用于HG组件的底板和负载梁通过堆叠层系列形式的传送系统串联，堆叠和传送，以进行必要的组装过程，例如层接合，滑块附接和电连接 其上的端子。 当为每个制造过程转移未完成的HG组件时，未完成的HG组件安装在组装夹具上，例如托盘或用于转移的块。 因此，需要其数量至少等于在各个组装过程中保留的未完成的HG组件的数量的组装。 因此，减少了工作空间的效率，并且由于需要组装夹具而引起制造成本的上升。

公开(公告)号：US07380329B2

公开(公告)日：2008-06-03

申请号：US10929322

申请日：2004-08-30

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： G11B5/48

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A method of assembling a head gimbal assembly. The method comprises a series of steps which include: stacking a base plate, a load beam, and a flexure to form a three-layered stacked series with at least a bottom layer being a base plate series; joining portions of the load beam to the base plate, and the flexure to the load beam in the three-layered stacked series to make a suspension section; attaching a slider to the flexure in the suspension section to make a head gimbal assembly; load-bending a hinge portion formed in the head gimbal assembly; and heating the hinge portion in order to adjust a bending load on the hinge portion at a predetermined bending angle to a predetermined value.

摘要翻译： 头部万向节组件的组装方法。 该方法包括一系列步骤，其包括：堆叠基板，负载梁和挠曲件以形成至少底层为基板系列的三层堆叠系列; 将所述负载梁的部分接合到所述基板，并且将所述弯曲部分连接到所述三层堆叠系列中的所述负载梁以形成悬挂部; 将滑块附接到悬架部分中的挠曲件以制造头部万向节组件; 负载弯曲形成在头部万向节组件中的铰链部分; 并加热铰链部分，以便以预定的弯曲角度将铰链部分上的弯曲载荷调整到预定值。