-
41.发明申请公开(公告)号：US20200259116A1
公开(公告)日：2020-08-13
申请号：US16848243
申请日：2020-04-14
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Akihiro Chida
Abstract: A light-emitting element, a bonding layer, and a frame-like partition are formed over a substrate. The partition is provided to surround the bonding layer and the light-emitting element, with a gap left between the partition and the bonding layer. A pair of substrates overlap with each other under a reduced-pressure atmosphere and then exposed to an air atmosphere or a pressurized atmosphere, whereby the reduced-pressure state of a space surrounded by the pair of substrates and the partition is maintained and atmospheric pressure is applied to the pair of substrates. Alternatively, a light-emitting element and a bonding layer are formed over a substrate. A pair of substrates overlap with each other, and then, pressure is applied to the bonding layer with the use of a member having a projection before or at the same time as curing of the bonding layer.
-
公开(公告)号：US20200020875A1
公开(公告)日：2020-01-16
申请号：US16580432
申请日：2019-09-24
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Akihiro Chida
IPC: H01L51/52 , H01L33/00 , H01L51/00 , H01L33/48 , H01L33/20 , H01L27/12 , H01L27/32 , H01L51/56 , H01L33/62
Abstract: A highly reliable light-emitting device and a manufacturing method thereof are provided. A light-emitting element and a terminal electrode are formed over an element formation substrate; a first substrate having an opening is formed over the light-emitting element and the terminal electrode with a bonding layer provided therebetween; an embedded layer is formed in the opening; a transfer substrate is formed over the first substrate and the embedded layer; the element formation substrate is separated; a second substrate is formed under the light-emitting element and the terminal electrode; and the transfer substrate and the embedded layer are removed. In addition, an anisotropic conductive connection layer is formed in the opening, and an electrode is formed over the anisotropic conductive connection layer. The terminal electrode and the electrode are electrically connected to each other through the anisotropic conductive connection layer.
-
公开(公告)号：US10442172B2
公开(公告)日：2019-10-15
申请号：US15610890
申请日：2017-06-01
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Kayo Kumakura , Tomoya Aoyama , Akihiro Chida , Kohei Yokoyama , Masakatsu Ohno , Satoru Idojiri , Hisao Ikeda , Hiroki Adachi , Yoshiharu Hirakata , Shingo Eguchi , Yasuhiro Jinbo
IPC: B32B43/00 , G02B6/00 , H01L21/67 , B26D1/04 , H01L51/56 , B32B38/10 , B26D1/00 , H01L27/12 , H01L27/32
Abstract: A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.
-
公开(公告)号：US10304919B2
公开(公告)日：2019-05-28
申请号：US15966640
申请日：2018-04-30
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Yasuhiro Jinbo , Kohei Yokoyama , Yuki Tamatsukuri , Naoto Goto , Masami Jintyou , Masayoshi Dobashi , Masataka Nakada , Akihiro Chida , Naoyuki Senda
Abstract: To provide a display device with a manufacturing yield and/or a display device with suppressed mixture of colors between adjacent pixels. The display device includes a first pixel electrode, a second pixel electrode, a first insulating layer, a second insulating layer, and an adhesive layer. The first insulating layer includes a first opening. The second insulating layer includes a second opening. The first opening and the second opening are provided between the first pixel electrode and the second pixel electrode. In a top view, a periphery of the second opening is positioned on an inner side than a periphery of the first opening. The adhesive layer has a region overlapping with the second insulating layer below the second insulating layer.
-
公开(公告)号：US10038171B2
公开(公告)日：2018-07-31
申请号：US15880601
申请日：2018-01-26
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Tatsuya Sakuishi , Daiki Nakamura , Akihiro Chida , Tomoya Aoyama
CPC classification number: H01L51/56 , B32B38/105 , B32B2310/0843 , B32B2457/20 , H01L27/1218 , H01L27/1225 , H01L27/124 , H01L27/1266 , H01L27/322 , H01L27/3276 , H01L29/78603 , H01L51/0024 , H01L51/003 , H01L51/0097 , H01L2227/323 , H01L2227/326 , H01L2251/5338
Abstract: A method for manufacturing a display device is provided. The method includes forming a display element interposed between a first substrate and a second substrate and peeling the second substrate from the first substrate so that an electrode, which is located between the first and second substrates and to be connected to an external electrode, is exposed simultaneously with the peeling of the second substrate.
-
Patent Agency Ranking
公开(公告)号：US09941475B2
公开(公告)日：2018-04-10
申请号：US15213767
申请日：2016-07-19
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Akihiro Chida
IPC: H01L51/00 , H01L51/56 , H01L27/32 , G02F1/1368 , G02F1/1362 , G02F1/1343
CPC classification number: H01L51/003 , G02F1/133305 , G02F1/134309 , G02F1/1345 , G02F1/136213 , G02F1/1368 , G02F2001/13613 , H01L27/3276 , H01L51/0097 , H01L51/56 , H01L2227/323 , H01L2227/326 , H01L2251/5338
Abstract: Provided is a method for manufacturing a highly reliable display device. The method includes steps of providing a first layer, a first insulating layer, an electrode, and a second insulating layer over a first surface of a first substrate; removing a part of the second insulating layer to provide a first opening; providing a display element and a second layer over the second insulating layer; providing a third layer and a third insulating layer over a second surface of a second substrate; removing part of the third layer and part of the third insulating layer to provide a second opening; overlapping the first substrate and the second substrate with a bonding layer positioned therebetween such that the first surface and the second surface face each other and the first opening and the second opening have an overlap region; separating the first substrate and the first layer from the first insulating layer; providing a third substrate such that the first insulating layer and the third substrate overlap with each other; separating the second substrate, part of the bonding layer, part of the second layer, and the third layer from the third insulating layer; and providing a fourth substrate such that the third insulating layer and the fourth substrate overlap with each other.
-
公开(公告)号：US09917267B2
公开(公告)日：2018-03-13
申请号：US15363624
申请日：2016-11-29
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Tatsuya Sakuishi , Daiki Nakamura , Akihiro Chida , Tomoya Aoyama
CPC classification number: H01L51/0097 , H01L27/3244 , H01L27/3276 , H01L51/003 , H01L51/5012 , H01L51/5203 , H01L2227/326 , Y02E10/549 , Y02P70/521
Abstract: A method for manufacturing a display device is provided. The method includes: forming, between a first substrate and a second substrate, a light-emitting element including an electroluminescence layer and a wiring over which a peeling layer formed by using the material of the electroluminescence layer is provided; and peeling whole of the second substrate from the first substrate so that the peeling layer over the wiring is simultaneously exposed.
-
公开(公告)号：US20180024680A1
公开(公告)日：2018-01-25
申请号：US15711120
申请日：2017-09-21
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Tatsuya Sakuishi , Tomoya Aoyama , Akihiro Chida , Daiki Nakamura
CPC classification number: G06F3/0412 , G02F1/133305 , G02F1/13338 , G02F2001/13629 , G06F3/044 , G06F2203/04103 , H01L27/1214 , H01L27/323 , H01L27/3276 , H01L33/62 , H01L51/0097 , H01L2221/101 , H01L2227/326 , H01L2251/5338
Abstract: A display device with high design flexibility is provided. The display device includes a display element, a touch sensor, and a transistor between two flexible substrates. An external electrode that supplies a signal to the display element and an external electrode that supplies a signal to the touch sensor are connected from the same surface of one of the substrates.
-
公开(公告)号：US09682544B2
公开(公告)日：2017-06-20
申请号：US15147020
申请日：2016-05-05
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Kayo Kumakura , Tomoya Aoyama , Akihiro Chida , Kohei Yokoyama , Masakatsu Ohno , Satoru Idojiri , Hisao Ikeda , Hiroki Adachi , Yoshiharu Hirakata , Shingo Eguchi , Yasuhiro Jinbo
IPC: B32B38/10 , B32B43/00 , G02B6/00 , H01L21/67 , B26D1/04 , H01L51/56 , B26D1/00 , H01L27/12 , H01L27/32
CPC classification number: B32B43/006 , B26D1/04 , B26D2001/006 , B32B38/10 , B32B2457/00 , G02B6/00 , H01L21/67092 , H01L27/1248 , H01L27/3258 , H01L27/3262 , H01L51/56 , H01L2221/68327 , H01L2227/323 , H01L2251/5338 , Y10T156/1126 , Y10T156/1132 , Y10T156/1168 , Y10T156/1184 , Y10T156/1933 , Y10T156/1944 , Y10T156/1961 , Y10T156/1967
Abstract: A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.
-
公开(公告)号：US09333736B2
公开(公告)日：2016-05-10
申请号：US14468662
申请日：2014-08-26
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Kayo Kumakura , Tomoya Aoyama , Akihiro Chida , Kohei Yokoyama , Masakatsu Ohno , Satoru Idojiri , Hisao Ikeda , Hiroki Adachi , Yoshiharu Hirakata , Shingo Eguchi , Yasuhiro Jinbo
CPC classification number: B32B43/006 , B26D1/04 , B26D2001/006 , B32B38/10 , B32B2457/00 , G02B6/00 , H01L21/67092 , H01L27/1248 , H01L27/3258 , H01L27/3262 , H01L51/56 , H01L2221/68327 , H01L2227/323 , H01L2251/5338 , Y10T156/1126 , Y10T156/1132 , Y10T156/1168 , Y10T156/1184 , Y10T156/1933 , Y10T156/1944 , Y10T156/1961 , Y10T156/1967
Abstract: A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.
Abstract translation: 提供堆叠的处理装置。 堆叠包括彼此附接的两个基板，其间隙设置在它们的端部之间。 处理装置包括：固定机构，其固定堆叠的一部分;多个吸附夹具，其固定堆叠体的一个基板的外周边缘;以及楔形夹具，其插入到堆叠的角部。 多个吸附夹具包括允许吸附夹具在垂直方向和水平方向上分开移动的机构。 处理装置还包括传感器，其感测堆叠中的端部之间的间隙的位置。 楔形夹具的尖端沿着形成在堆叠的端表面上的倒角移动。 楔形夹具插入到堆叠中的端部之间的间隙中。
-
-
-
-
-
-
-
-
-
Search Results
102
records
(took 0.042 seconds)
