摘要:
A piezoelectric vibrating piece includes a pair of vibration arm portions that is placed in a row in a width direction; a base portion to which proximal end sides in the pair of vibration arm portions in an extending direction are connected; and weight metal films that are formed on outer surfaces of the vibration arm portions, wherein the weight metal films are formed in positions that avoid regions of tip portions in the vibration arm portions in a longitudinal direction.
摘要:
An evaluation device 20 comprises a circuit element comprising respective pairs of inputs and outputs including several capacitances 25a-25c and resistances 26a-26d, one end of each being connected to both ends of the capacitances 25a-25c, wherein a resistance value of a signal input side is generally equal to that of a signal output side. The evaluation device 20 is further provided with a connecting terminal with an output device 10 for outputting signals to a device to be evaluated 30 on the signal input side, and is provided with a connecting terminal with the device to be evaluated 30 on the signal output side.
摘要:
For providing a cheap semiconductor memory device with improving reliability by level of a cell, in the place of escaping from defects on memory cells electrically, through such as ECC, and further for providing a cell structure enabling scaling-down in the vertical direction with maintaining the reliability, in a semiconductor memory device, upon which high-speeded read-out operation is required, a charge storage region is constructed with particles made from a large number of semiconductor charge storage small regions, each being independent, thereby increasing the reliability by the cell level.
摘要:
To carry out frequency adjustment easily, accurately and efficiently without being influenced by a size of a piezoelectric vibrating piece and achieve low cost formation and promotion of maintenance performance, there is provided a method of fabricating a piezoelectric vibrating piece which is a method of fabricating a piezoelectric vibrating piece having a piezoelectric vibrating plate 11, a pair of exciting electrodes 12, 13, and a pair of mount electrodes 15, 16 by utilizing a wafer S, the method including an outer shape forming step of forming a frame portion S1 at a wafer and forming a plurality of piezoelectric plates at the frame portion to be connected thereto by way of a connecting portion 11a, an electrode forming step of forming pairs of exciting electrodes and pairs of mount electrodes respectively at the plurality of piezoelectric plates and forming a common electrode S2 respectively electrically connected to a plurality of the pairs of mount electrodes 15 on one side by way of the connecting portion, a frequency adjusting step of adjusting a frequency of the piezoelectric plate by applying a drive voltage between the common electrode and the mount electrode 16 on other side, and a cutting step of fragmenting the plurality of piezoelectric plates.
摘要:
The present invention provides a stage apparatus capable of reducing a positioning time without increasing a positional deviation. A positioning control method of a sample stage apparatus includes: a high-speed movement step of moving a table to a high-speed movement target position at a first movement speed; a positional deviation correcting step of moving the table to a low-speed positioning step start position at a second movement speed that is lower than the first movement speed; a low-speed positioning step of moving the table to a target position at a third movement speed that is lower than the second movement speed. After the low-speed positioning step is completed, a rod connected to a motor returns to its original position to separate a pin of the rod side from a concave portion of the table side.
摘要:
A perforation method and an perforation apparatus in which a hollow member of a fuel injection nozzle is filled with a filler such as a zirconia ball, and a laser light is applied to the hollow member to form an injection hole while vibrating the zirconia ball using an ultrasonic vibrator. After the injection hole is formed, the laser light is introduced through the injection hole to the inside of the fuel injection nozzle, and thereby is applied to the vibrated zirconia ball.
摘要:
A technique of manufacturing a semiconductor device capable of performing a probe test by a common test apparatus as normal LSI chips even for large-area chips is provided. A chip comprising a device formed on a device area by a semiconductor process and including a plurality of test areas sectioned by chip areas is prepared. Next, pads to be electrically connected to the device are formed at corresponding positions on the respective plurality of test areas. Subsequently, the respective test areas are tested by a same probe card via the plurality of pads.
摘要:
The present invention provides a method for forming a silicon oxide film, with a substantially uniform film thickness and without being so influenced by dense sites and scattered sites in a pattern provided on an object to be processed, while keeping advantageous points of a plasma oxidation process performed under a lower-pressure and lower-oxygen-concentration condition. In this method, plasma of a processing gas is applied to a surface of the object having a concavo-convex pattern, in a processing chamber of a plasma processing apparatus, so as to oxidize silicon on the surface of the object, thereby forming the silicon oxide film. The plasma is generated under the condition that a ratio of oxygen in the processing gas is within a range of 0.1% to 10% and pressure is within a range of 0.133 Pa to 133.3 Pa. This plasma oxidation process is performed, with a plate, having a plurality of through-holes formed therein, being provided between a region for generating the plasma in the processing chamber and the object to be processed.
摘要:
There is provided an ultrasound probe including a first substrate having a silicon substrate and an ultrasound transmit-receive element, an acoustic lens disposed over an upper surface of the first substrate, and a damping layer disposed under the first substrate, in which a second substrate is disposed between a lower surface of the first substrate and an upper surface of the damping layer, and the second substrate is made of a material having approximately the same linear expansion coefficient and acoustic impedance as the silicon substrate of the first substrate. With this structure, it is possible to provide the ultrasound probe which can prevent damage to the silicon substrate due to temperature change and has excellent transmission/reception performance and structure reliability while reducing noise by reflected waves in transmission and reception.
摘要:
For providing a cheap semiconductor memory device with improving reliability by level of a cell, in the place of escaping from defects on memory cells electrically, through such as ECC, and further for providing a cell structure enabling scaling-down in the vertical direction with maintaining the reliability, in a semiconductor memory device, upon which high-speeded read-out operation is required, a charge storage region is constructed with particles made from a large number of semiconductor charge storage small regions, each being independent, thereby increasing the reliability by the cell level.