Hybrid planar and finFET CMOS devices
    46.
    发明授权
    Hybrid planar and finFET CMOS devices 失效
    混合平面和finFET CMOS器件

    公开(公告)号:US06911383B2

    公开(公告)日:2005-06-28

    申请号:US10604097

    申请日:2003-06-26

    摘要: The present invention provides an integrated semiconductor circuit containing a planar single gated FET and a FinFET located on the same SOI substrate. Specifically, the integrated semiconductor circuit includes a FinFET and a planar single gated FET located atop a buried insulating layer of an silicon-on-insulator substrate, the planar single gated FET is located on a surface of a patterned top semiconductor layer of the silicon-on-insulator substrate and the FinFET has a vertical channel that is perpendicular to the planar single gated FET. A method of forming a method such an integrated circuit is also provided. In the method, resist imaging and a patterned hard mask are used in trimming the width of the FinFET active device region and subsequent resist imaging and etching are used in thinning the thickness of the FET device area. The trimmed active FinFET device region is formed such that it lies perpendicular to the thinned planar single gated FET device region.

    摘要翻译: 本发明提供一种集成半导体电路,其包含位于同一SOI衬底上的平面单栅极FET和FinFET。 具体地,集成半导体电路包括FinFET和位于绝缘体上硅衬底的掩埋绝缘层顶上的平面单栅极FET,平面单门控FET位于硅 - 硅绝缘体的图案化顶部半导体层的表面上, 绝缘体上的衬底和FinFET具有垂直于平面单门控FET的垂直沟道。 还提供了一种形成集成电路的方法。 在该方法中,抗蚀剂成像和图案化的硬掩模用于修整FinFET有源器件区域的宽度,并且随后的抗蚀剂成像和蚀刻用于减薄FET器件区域的厚度。 经修整的有源FinFET器件区域形成为垂直于薄化的平面单栅极FET器件区域。

    Self-aligned SOI with different crystal orientation using WAFER bonding and SIMOX processes
    47.
    发明申请
    Self-aligned SOI with different crystal orientation using WAFER bonding and SIMOX processes 失效
    使用WAFER键合和SIMOX工艺,具有不同晶体取向的自对准SOI

    公开(公告)号:US20050070077A1

    公开(公告)日:2005-03-31

    申请号:US10967398

    申请日:2004-10-18

    摘要: The present invention provides integrated semiconductor devices that are formed upon an SOI substrate having different crystal orientations that provide optimal performance for a specific device. Specifically, an integrated semiconductor structure including at least an SOI substrate having a top semiconductor layer of a first crystallographic orientation and a semiconductor material of a second crystallographic orientation, wherein the semiconductor material is substantially coplanar and of substantially the same thickness as that of the top semiconductor layer and the first crystallographic orientation is different from the second crystallographic orientation is provided. The SOI substrate is formed by wafer bonding, ion implantation and annealing.

    摘要翻译: 本发明提供了在具有不同晶体取向的SOI衬底上形成的集成半导体器件,其为特定器件提供最佳性能。 具体地说,一种集成半导体结构,其至少包括具有第一晶体取向的顶部半导体层和第二晶体取向的半导体材料的SOI衬底,其中半导体材料基本上是共面的,并且具有与顶部基本相同的厚度 半导体层和第一晶体取向与第二晶体取向不同。 SOI衬底通过晶片接合,离子注入和退火形成。

    Self-aligned SOI with different crystal orientation using wafer bonding and SIMOX processes
    48.
    发明授权
    Self-aligned SOI with different crystal orientation using wafer bonding and SIMOX processes 失效
    使用晶圆接合和SIMOX工艺的具有不同晶体取向的自对准SOI

    公开(公告)号:US06830962B1

    公开(公告)日:2004-12-14

    申请号:US10634446

    申请日:2003-08-05

    IPC分类号: H01L2100

    摘要: The present invention provides integrated semiconductor devices that are formed upon an SOI substrate having different crystal orientations that provide optimal performance for a specific device. Specifically, an integrated semiconductor structure including at least an SOI substrate having a top semiconductor layer of a first crystallographic orientation and a semiconductor material of a second crystallographic orientation, wherein the semiconductor material is substantially coplanar and of substantially the same thickness as that of the top semiconductor layer and the first crystallographic orientation is different from the second crystallographic orientation is provided. The SOI substrate is formed by wafer bonding, ion implantation and annealing.

    摘要翻译: 本发明提供了在具有不同晶体取向的SOI衬底上形成的集成半导体器件,其为特定器件提供最佳性能。 具体地说,一种集成半导体结构,其至少包括具有第一晶体取向的顶部半导体层和第二晶体取向的半导体材料的SOI衬底,其中半导体材料基本上是共面的,并且具有与顶部基本相同的厚度 半导体层和第一晶体取向与第二晶体取向不同。 SOI衬底通过晶片接合,离子注入和退火形成。

    Ultra-thin silicon-on-insulator and strained-silicon-direct-on-insulator with hybrid crystal orientations
    49.
    发明授权
    Ultra-thin silicon-on-insulator and strained-silicon-direct-on-insulator with hybrid crystal orientations 有权
    超薄绝缘体上硅和具有混合晶体取向的应变硅绝缘体

    公开(公告)号:US06815278B1

    公开(公告)日:2004-11-09

    申请号:US10647395

    申请日:2003-08-25

    申请人: Meikei Ieong Min Yang

    发明人: Meikei Ieong Min Yang

    IPC分类号: H01L218234

    摘要: The invention provides integrated semiconductor devices that are formed upon an SOI substrate having different crystal orientations that provide optimal performance for a specific device. Specifically, an integrated semiconductor structure including at least an SOI substrate having a top semiconductor layer of a first crystallographic orientation and a semiconductor material of a second crystallographic orientation, wherein the semiconductor material is substantially coplanar and of substantially the same thickness as that of the top semiconductor layer and the first crystallographic orientation is different from the second crystallographic orientation is provided. The SOI substrate is formed by forming an opening into a structure that includes at least a first semiconductor layer and a second semiconductor layer that have different crystal orientations. The opening extends to the first semiconductor layer. A semiconductor material is epitaxial grown in the opening and then various etching and etch back processing steps are used in forming the SOI substrate.

    摘要翻译: 本发明提供了在具有不同晶体取向的SOI衬底上形成的集成半导体器件,其为特定器件提供了最佳性能。 具体地说,一种集成半导体结构,其至少包括具有第一晶体取向的顶部半导体层和第二晶体取向的半导体材料的SOI衬底,其中半导体材料基本上是共面的,并且具有与顶部基本相同的厚度 半导体层和第一晶体取向与第二晶体取向不同。 通过将开口形成为至少包括具有不同晶体取向的第一半导体层和第二半导体层的结构,形成SOI衬底。 开口延伸到第一半导体层。 半导体材料在开口中外延生长,然后在形成SOI衬底中使用各种蚀刻和回蚀加工步骤。

    Semiconductor laser diode and method for manufacturing the same
    50.
    发明授权
    Semiconductor laser diode and method for manufacturing the same 失效
    半导体激光二极管及其制造方法

    公开(公告)号:US5445993A

    公开(公告)日:1995-08-29

    申请号:US67834

    申请日:1993-05-27

    CPC分类号: H01L33/0062

    摘要: A semiconductor laser diode includes a semiconductor substrate, an active layer having a double hetero structure formed on the semiconductor substrate, a first quantum well layer formed between the active layer and the current confinement layer, a second quantum well layer formed on the active layer corresponding to the current injection groove, and a clad layer having its flat surface formed on the current injection groove and the current confinement layer. A method for manufacturing the semiconductor laser diode includes the steps of forming an active layer having a double hetero structure on the semiconductor substrate, selectively forming a current confinement layer on the active layer to form a current injection groove, forming a clad layer having its flat surface on the current injection groove and the current confinement layer.

    摘要翻译: 半导体激光二极管包括半导体衬底,在半导体衬底上形成的具有双异质结构的有源层,形成在有源层和电流限制层之间的第一量子阱层,形成在有源层上的第二量子阱层对应 以及在电流注入槽和电流限制层上形成有平坦表面的覆盖层。 一种制造半导体激光二极管的方法包括以下步骤:在半导体衬底上形成具有双异质结构的有源层,在有源层上选择形成电流限制层,形成电流注入槽,形成具有平坦的覆层 电流注入槽表面和电流限制层。