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公开(公告)号:US09969610B2
公开(公告)日:2018-05-15
申请号:US15416206
申请日:2017-01-26
Applicant: Raytheon Company
Inventor: Buu Q. Diep , Adam M. Kennedy , Thomas Allan Kocian , Mark Lamb
IPC: H01L31/0203 , B81B7/00 , B81C1/00
CPC classification number: B81B7/0058 , B81B7/0041 , B81B2201/0207 , B81B2201/04 , B81C1/00269 , B81C1/00317 , B81C2203/0109 , B81C2203/0118 , B81C2203/0145 , B81C2203/019
Abstract: A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.
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公开(公告)号:US09803979B2
公开(公告)日:2017-10-31
申请号:US14860443
申请日:2015-09-21
Applicant: Honeywell International Inc.
Inventor: Robert D. Horning , Grant Lodden
IPC: G01C19/00 , G01C19/5726 , G01C19/5621 , G01C19/5656 , G01C25/00 , G01P15/093 , G01P21/00 , G01C19/574 , G01P15/03 , G02B6/293 , G01P15/08
CPC classification number: G01C19/5726 , B81B2201/0228 , B81B2201/04 , B81B2203/053 , G01C19/5621 , G01C19/5656 , G01C19/574 , G01C25/00 , G01P15/032 , G01P15/093 , G01P21/00 , G01P2015/0822 , G02B6/29331
Abstract: Systems and methods for a time-based optical pickoff for MEMS sensors are provided. In one embodiment, a method for an integrated waveguide time-based optical-pickoff sensor comprises: launching a light beam generated by a light source into an integrated waveguide optical-pickoff monolithically fabricated within a first substrate, the integrated waveguide optical-pickoff including an optical input port, a coupling port, and an optical output port; and detecting changes in an area of overlap between the coupling port and a moving sensor component separated from the coupling port by a gap by measuring an attenuation of the light beam at the optical output port, wherein the moving sensor component is moving in-plane with respect a surface of the first substrate comprising the coupling port and the coupling port is positioned to detect movement of an edge of the moving sensor component.
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公开(公告)号:US09771258B2
公开(公告)日:2017-09-26
申请号:US14748482
申请日:2015-06-24
Applicant: Raytheon Company
Inventor: Buu Q. Diep , Adam M. Kennedy , Thomas Allan Kocian , Mark Lamb
IPC: H01L23/498 , B81C1/00 , B81B7/00
CPC classification number: B81B7/0058 , B81B7/0041 , B81B2201/0207 , B81B2201/04 , B81C1/00269 , B81C1/00317 , B81C2203/0109 , B81C2203/0118 , B81C2203/0145 , B81C2203/019
Abstract: A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.
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公开(公告)号:US09715107B2
公开(公告)日:2017-07-25
申请号:US14599507
申请日:2015-01-18
Applicant: APPLE INC.
Inventor: Yuval Gerson , Naftali Chayat , Noel Axelrod , Alexander Shpunt
CPC classification number: G02B26/101 , B81B2201/04 , B81C1/0015 , B81C2201/013 , G01S7/4817 , G01S17/10 , G01S17/42 , G01S17/89 , G02B26/085
Abstract: A scanning device includes a substrate, which is etched to define an array of two or more parallel rotating members and a gimbal surrounding the rotating members. First hinges connect the gimbal to the substrate and defining a first axis of rotation, about which the gimbal rotates relative to the substrate. Second hinges connect the rotating members to the support and defining respective second, mutually-parallel axes of rotation of the rotating members relative to the support, which are not parallel to the first axis.
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公开(公告)号:US09423605B2
公开(公告)日:2016-08-23
申请号:US13202528
申请日:2010-02-19
Applicant: Sasikanth Manipatruni , Michal Lipson , Jacob T. Robinson
Inventor: Sasikanth Manipatruni , Michal Lipson , Jacob T. Robinson
CPC classification number: G02B26/001 , A61F9/022 , A61F9/023 , B81B3/0083 , B81B2201/04 , B81B2201/047 , B81B2203/0118 , B81B2203/0315 , B81C1/0015 , B81C2201/013 , G02B1/005 , G02B6/4209 , G02C7/104 , G02C7/107 , H01S3/005 , H01S3/0064
Abstract: There is set forth herein an optomechanical device which can comprise a first mirror and a second mirror forming with the first mirror a cavity. In one aspect the first mirror can be a movable mirror. The optomechanical device can be adapted so that the first mirror is moveable responsively to radiation force.
Abstract translation: 这里提出了一种光学机械装置,其可以包括第一反射镜和形成有第一反射镜的第二反射镜的腔。 在一个方面,第一镜可以是可移动镜。 光学机械装置可以适于使得第一反射镜能够响应于辐射力而移动。
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公开(公告)号:US20150029606A1
公开(公告)日:2015-01-29
申请号:US14341344
申请日:2014-07-25
Applicant: GlobalMEMS TAIWAN CORPORATION LIMITED
Inventor: SU-JHEN LIN , MING-CHING WU
CPC classification number: G02B7/08 , B81B3/00 , B81B3/0018 , B81B2201/02 , B81B2201/04 , B81B2201/042 , G02B7/18 , G02B7/182 , G02B26/0833 , G02B26/085 , G02B26/101 , H02K33/18 , H02K35/00 , H02K41/02
Abstract: A micro-electromechanical system (MEMS) carrier formed by a typical surface micro-machining and bulk micro-machining process on a silicon substrate, having a frame, a movable carrier element, a conductive coil, two return springs and a pair of permanent magnets. The movable carrier element is formed within the frame and movable along a path, the conductive coil is formed on or embedded in the movable carrier element. The two return springs are formed between the movable carrier element and the frame thereby connecting the movable carrier element to the frame and providing a return force to the carrier element, and the pair of permanent magnets are formed a magnetic field for co-acting with the conductive coil for generating an electromagnetic Lorenz force to drive the movable carrier element to move against the return force of the two return springs.
Abstract translation: 通过在硅衬底上的典型的表面微加工和体微加工工艺形成的微机电系统(MEMS)载体,其具有框架,可移动载体元件,导电线圈,两个复位弹簧和一对永磁体 。 可移动的载体元件形成在框架内并沿着路径移动,导电线圈形成在可动载体元件上或嵌入可移动的载体元件中。 两个复位弹簧形成在可移动的载体元件和框架之间,从而将可移动的载体元件连接到框架上,并向载体元件提供返回力,并且该对永久磁铁形成一个磁场,用于与 导电线圈,用于产生电磁洛伦兹力,以驱动可移动载体元件克服两个复位弹簧的返回力移动。
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