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    Wearable device for taking symmetric thermal measurements
    41.
    发明申请
    Wearable device for taking symmetric thermal measurements 有权
    用于进行对称热测量的可穿戴设备

    公开(公告)号：US20160363483A1

    公开(公告)日：2016-12-15

    申请号：US15182566

    申请日：2016-06-14

    Applicant: Facense Ltd.

    Inventor： Arie Tzvieli ,  Ari M Frank ,  Gil Thieberger

    IPC: G01J5/02 ,  A61B5/00 ,  A61B5/01

    CPC classification number: A61B5/015 ,  A61B5/0075 ,  A61B5/0077 ,  A61B5/165 ,  A61B5/6803 ,  A61B5/6814 ,  A61B5/7282 ,  A61B5/748 ,  A61B2562/0271 ,  A61B2562/0276 ,  A61B2576/00 ,  G01J5/0265 ,  G01J5/12 ,  G01J2005/0077 ,  G01J2005/0085

    Abstract: Wearable devices for taking symmetric thermal measurements. One device includes first and second thermal cameras physically coupled to a frame worn on a user's head. The first thermal camera takes thermal measurements of a first region of interest that covers at least a portion of the right side of the user's forehead. The second thermal camera takes thermal measurements of a second ROI that covers at least a portion of the left side of the user's forehead. Wherein the first and second thermal cameras are not in physical contact with their corresponding ROIs, and as a result of being coupled to the frame, the thermal cameras remain pointed at their corresponding ROIs when the user's head makes angular movements.

    Abstract translation: 用于进行对称热测量的可穿戴设备。 一个设备包括物理地耦合到佩戴在用户头部上的框架的第一和第二热敏照相机。 第一热敏照相机对第一感兴趣区域进行热测量，该第一感兴趣区域覆盖用户前额右侧的至少一部分。 第二热敏照相机对覆盖使用者前额左侧的至少一部分的第二ROI进行热测量。 其中第一和第二热像仪不与其对应的ROI物理接触，并且作为耦合到帧的结果，当用户的头进行角运动时，热摄像机保持指向其相应的ROI。

    METHOD FOR DETERMING A TRANSITION POINT AND/OR FOR DETERMINING WALL SHEAR STRESSES ON SURFACES AROUND WHICH SURFACES A FLOW CIRCULATES, AND MEASURING DEVICE
    42.
    发明申请
    METHOD FOR DETERMING A TRANSITION POINT AND/OR FOR DETERMINING WALL SHEAR STRESSES ON SURFACES AROUND WHICH SURFACES A FLOW CIRCULATES, AND MEASURING DEVICE 审中-公开
    用于确定过渡点和/或用于确定表面流动循环和测量装置的表面上的壁剪应力的方法

    公开(公告)号：US20160258827A1

    公开(公告)日：2016-09-08

    申请号：US14897444

    申请日：2014-06-10

    Applicant: MTU AERO ENGINES AG

    Inventor： Martin Stadlbauer ,  Jurgen Grundmayer ,  Felix Von Plehwe

    IPC: G01L1/24 ,  G01N25/72 ,  G01J5/10

    CPC classification number: G01L1/241 ,  G01J5/10 ,  G01J2005/0085 ,  G01M9/067 ,  G01N25/72

    Abstract: The invention relates to a method for determining a transition point and/or for determining wall shear stresses on surfaces (1) around which surfaces a flow circulates by means of thermography, wherein the method comprises the following steps: providing a surface with a heat insulation layer (3) on the surface (1) around which a flow is to circulate, circulating a flow around the surface (1) around which a flow is to circulate, heating the surface (1) around which a flow circulates, contactless measuring of the emitted flow intensity of the surface (1) around which a flow circulates by means of a camera system (7), determining at least one temperature decay coefficient on the surface (1) around which a flow circulates and ascertaining the transition point and/or the wall shear stresses on the surface (1) around which a flow circulates.

    Abstract translation: 本发明涉及一种用于确定转变点和/或用于确定表面（1）上的壁剪切应力的方法，在该表面上，流体通过热成像流动循环的表面，其中该方法包括以下步骤：为表面提供绝热 在流动周围的表面（1）上的层（3），围绕流动循环的表面（1）周围流动，加热流动循环的表面（1），非接触测量 流体通过相机系统（7）循环的表面（1）的发射流强度，确定表面（1）上的至少一个温度衰减系数，流体周围循环并确定转换点和/ 或流动循环周围的表面（1）上的壁剪切应力。

    Three-dimensional hot spot localization
    43.
    发明授权
    Three-dimensional hot spot localization 有权
    三维热点定位

    公开(公告)号：US09322715B2

    公开(公告)日：2016-04-26

    申请号：US14294016

    申请日：2014-06-02

    Applicant: DCG Systems, Inc. ,  Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.

    Inventor： Frank Altmann ,  Christian Schmidt ,  Rudolf Schlangen ,  Herve Deslandes

    IPC: G01J5/00 ,  G01R31/311 ,  G01N1/00 ,  G01N25/00 ,  G01N21/88 ,  G01N21/35 ,  G01N21/84

    CPC classification number: G01J5/0066 ,  G01J2005/0077 ,  G01J2005/0085 ,  G01N1/00 ,  G01N21/35 ,  G01N21/88 ,  G01N25/00 ,  G01N2021/8461 ,  G01R31/311

    Abstract: A non-destructive approach for the 3D localization of buried hot spots in electronic device architectures by use of Lock-in Thermography (LIT). The 3D analysis is based on the principles of thermal wave propagation through different material layers and the resulting phase shift/thermal time delay. With more complex multi level stacked die architectures it is necessary to acquire multiple LIT results at different excitation frequencies for precise hot spot depth localization. Additionally, the use of multiple time-resolved thermal waveforms, measured in a minimized field of view on top of the hot spot location, can be used to speed up the data acquisition. The shape of the resulting waveforms can be analyzed to further increase the detection accuracy and confidence level.

    Abstract translation: 通过使用锁定热成像（LIT）在电子设备架构中对埋藏热点的3D定位的非破坏性方法。 3D分析基于通过不同材料层的热波传播的原理以及由此产生的相移/热时间延迟。 使用更复杂的多级堆叠管芯结构，需要在不同的激发频率下获取多个LIT结果，以实现精确的热点深度定位。 此外，可以使用在热点位置顶部的最小视场内测量的多个时间分辨热波形来加速数据采集。 可以分析所得波形的形状，以进一步提高检测精度和置信度。

    DETERMINING THERMAL PROFILES OF SEMICONDUCTOR STRUCTURES
    44.
    发明申请
    DETERMINING THERMAL PROFILES OF SEMICONDUCTOR STRUCTURES 有权
    确定半导体结构的热分布

    公开(公告)号：US20150362373A1

    公开(公告)日：2015-12-17

    申请号：US14302934

    申请日：2014-06-12

    Applicant: International Business Machines Corporation

    Inventor： Nicholas G. Clore ,  Kendra A. Lyons ,  Andrew H. Norfleet ,  Jared P. Yanofsky

    IPC: G01J5/08 ,  G01J5/02 ,  H01L33/06

    CPC classification number: G01J5/0878 ,  G01J5/0007 ,  G01J5/025 ,  G01J2005/0085 ,  G01J2005/283 ,  H01L22/12 ,  H01L22/20 ,  H01L22/34

    Abstract: According to embodiments of the present invention, a semiconductor substrate is formed on at least a portion of a surface of a semiconductor substrate. The emitting layer is excited for a first predetermined time period. A first luminescent intensity value of the emitting layer is determined. In response to exposing the semiconductor substrate and the emitting layer to a condition for a second predetermined time period, a second luminescent intensity value of the emitting layer is determined. A thermal profile of at least the portion of the surface of the semiconductor substrate is determined utilizing the first luminescent intensity value and the second luminescent intensity value of the emitting layer. The thermal profile at least reflects information about one or more of the condition and the semiconductor substrate subsequent to exposure to the condition.

    Abstract translation: 根据本发明的实施例，在半导体衬底的表面的至少一部分上形成半导体衬底。 发光层被激发第一预定时间段。 确定发光层的第一发光强度值。 响应于将半导体衬底和发光层暴露于第二预定时间段的条件，确定发光层的第二发光强度值。 使用发光层的第一发光强度值和第二发光强度值来确定至少半导体衬底的表面部分的热分布。 热分布至少反映在暴露于该条件之后关于条件和半导体衬底中的一个或多个的信息。

    APPARATUS AND METHOD TO CALCULATE ENERGY DISSIPATED FROM AN OBJECT
    47.
    发明申请
    APPARATUS AND METHOD TO CALCULATE ENERGY DISSIPATED FROM AN OBJECT 有权
    计算从物体中排出的能量的装置和方法

    公开(公告)号：US20150049783A1

    公开(公告)日：2015-02-19

    申请号：US14470762

    申请日：2014-08-27

    Applicant: FLIR Systems AB

    Inventor： Katrin Strandemar ,  Henrik Jönsson ,  Torbjörn Hamrelius ,  Gunnar Palm

    IPC: G01J5/02 ,  G01J5/10

    CPC classification number: G01J5/025 ,  G01J5/0275 ,  G01J5/10 ,  G01J2005/0077 ,  G01J2005/0085 ,  G01J2005/068 ,  G01S17/08 ,  G01S17/88 ,  G02B13/14 ,  H04N5/33

    Abstract: An IR camera includes: a thermal radiation capturing arrangement for capturing thermal radiation of an imaged view in response to input control unit(s) receiving user inputs from a user of the IR camera; a processing unit arranged to process the thermal radiation data in order for the thermal radiation data to be displayed by an IR camera display as thermal images; and an IR camera display arranged to display thermal images to a user of the IR camera. The processing unit is further arranged to determine at least one temperature reference value representing the temperature of the surrounding environment of the imaged view; and calculate at least one output power value indicative of an amount of energy dissipated in a part of the imaged view by using the temperature value of the thermal radiation data corresponding to said part of the imaged view and the at least one determined temperature reference value.

    Abstract translation: IR摄像机包括：热辐射捕获装置，用于响应于从IR摄像机的用户接收用户输入的输入控制单元捕获成像视图的热辐射; 处理单元，其被设置为处理所述热辐射数据，以使所述热辐射数据由IR相机显示器显示为热图像; 以及IR摄像机显示器，被布置为向IR摄像机的用户显示热图像。 所述处理单元还被布置成确定表示所述成像视图的周围环境的温度的至少一个温度参考值; 并且通过使用与所述成像视图的所述部分对应的热辐射数据的温度值和所述至少一个确定的温度参考值来计算指示在成像视图的一部分中消散的能量的量的至少一个输出功率值。

    SYSTEM AND METHOD FOR TEMPERATURE MONITORING IN A ROOM
    48.
    发明申请
    SYSTEM AND METHOD FOR TEMPERATURE MONITORING IN A ROOM 有权
    室内温度监测系统及方法

    公开(公告)号：US20140334519A1

    公开(公告)日：2014-11-13

    申请号：US14359162

    申请日：2011-12-21

    Applicant: Roberto Antonini ,  Felice Fulvio Faraci ,  Marco Gaspardone

    Inventor： Roberto Antonini ,  Felice Fulvio Faraci ,  Marco Gaspardone

    IPC: G01J5/10

    CPC classification number: G01J5/10 ,  G01J2005/0085 ,  G01J2005/0092 ,  G01K1/143 ,  G01K7/42 ,  G01K2213/00

    Abstract: A method for monitoring a temperature of a survey surface in a room. The method includes: providing a number of temperature sensors coupled to the survey surface; receiving from the number of temperature sensors respective temperature values; applying an extrapolation model to the received temperature values and extrapolating an extrapolated thermographic scan of the survey surface; and monitoring the temperature of the survey surface on the basis of the extrapolated thermographic scan.

    Abstract translation: 一种用于监测房间中测量表面的温度的方法。 该方法包括：提供耦合到测量表面的多个温度传感器; 从温度传感器的数量接收各自的温度值; 将外推模型应用于所接收的温度值并外推测量表面的外推热敏成像扫描; 并根据外推热敏成像扫描监测测量表面的温度。

    THREE-DIMENSIONAL HOT SPOT LOCALIZATION
    50.
    发明申请
    THREE-DIMENSIONAL HOT SPOT LOCALIZATION 有权
    三维热点定位

    公开(公告)号：US20110297829A1

    公开(公告)日：2011-12-08

    申请号：US13156289

    申请日：2011-06-08

    Applicant: Frank ALTMANN ,  Christian Schmidt ,  Rudolf Schlangen ,  Herve Deslandes

    Inventor： Frank ALTMANN ,  Christian Schmidt ,  Rudolf Schlangen ,  Herve Deslandes

    IPC: G01J5/10 ,  G01J5/02

    CPC classification number: G01J5/0066 ,  G01J2005/0077 ,  G01J2005/0085 ,  G01N1/00 ,  G01N21/35 ,  G01N21/88 ,  G01N25/00 ,  G01N2021/8461 ,  G01R31/311

    Abstract: A non-destructive approach for the 3D localization of buried hot spots in electronic device architectures by use of Lock-in Thermography (LIT). The 3D analysis is based on the principles of thermal wave propagation through different material layers and the resulting phase shift/thermal time delay. With more complex multi level stacked die architectures it is necessary to acquire multiple LIT results at different excitation frequencies for precise hot spot depth localization. Additionally, the use of multiple time-resolved thermal waveforms, measured in a minimized field of view on top of the hot spot location, can be used to speed up the data acquisition. The shape of the resulting waveforms can be analyzed to further increase the detection accuracy and confidence level.

    Abstract translation: 通过使用锁定热成像（LIT）在电子设备架构中对埋藏热点的3D定位的非破坏性方法。 3D分析基于通过不同材料层的热波传播的原理以及由此产生的相移/热时间延迟。 使用更复杂的多级堆叠管芯结构，需要在不同的激发频率下获取多个LIT结果，以实现精确的热点深度定位。 此外，可以使用在热点位置顶部的最小视场内测量的多个时间分辨热波形来加速数据采集。 可以分析所得波形的形状，以进一步提高检测精度和置信度。

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