公开(公告)号：US20150307344A1

公开(公告)日：2015-10-29

申请号：US14693902

申请日：2015-04-23

Applicant: Infineon Technologies AG

Inventor： Georg ERNST ,  Horst THEUSS

IPC: B81B7/00 ,  G01L1/16 ,  G01L1/14 ,  B81C1/00

CPC classification number: B81B7/007 ,  B81B7/0048 ,  B81B2201/0264 ,  B81B2207/098 ,  B81C1/00301 ,  G01L1/148 ,  G01L1/16 ,  G01L19/0069 ,  G01L19/0084 ,  H01L23/49838 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: In various embodiments, a sensor apparatus is provided. The sensor apparatus includes a sensor device having a plurality of electrical contacts; a housing having a plurality of sidewalls; and a metal carrier structure, which extends into the housing in a manner passing through two mutually opposite sidewalls from the plurality of sidewalls. The metal carrier structure is embodied in a resilient fashion at least in the direction of a sidewall through which the metal carrier structure extends. The sensor device having the plurality of electrical contacts is mounted in a resilient fashion on the metal carrier structure and is electrically conductively connected to the metal carrier structure by the plurality of contacts.

Abstract translation: 在各种实施例中，提供了传感器装置。 传感器装置包括具有多个电触点的传感器装置; 壳体，具有多个侧壁; 以及金属载体结构，其以从多个侧壁穿过两个彼此相对的侧壁的方式延伸到壳体中。 金属载体结构至少在金属载体结构延伸的侧壁的方向上以弹性方式实施。 具有多个电触头的传感器装置以弹性方式安装在金属载体结构上，并且通过多个触点与导电连接到金属载体结构。

公开(公告)号：US09170164B2

公开(公告)日：2015-10-27

申请号：US14376447

申请日：2012-12-17

Applicant: Dieter Naegele-Preissmann ,  J. V. Sreedhar

Inventor： Dieter Naegele-Preissmann ,  J. V. Sreedhar

IPC: G01L1/14 ,  G01L9/00 ,  G01L19/06 ,  B81C1/00

CPC classification number: G01L1/148 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00182 ,  B81C1/00626 ,  G01L9/0048 ,  G01L9/0073 ,  G01L19/0618 ,  H04R19/005 ,  H04R19/04 ,  H04R31/006

Abstract: The invention discloses a capacitive pressure sensor and a method of fabricating the same. The capacitive pressure sensor includes a fixed plate configured as a back plate, a movable plate configured as diaphragm for sensing pressure, wherein a cavity is formed between the fixed plate and the movable plate, an isolation layer between the fixed plate and the movable plate and electrical contacts thereof for minimizing the leakage current, plurality of damping holes for configuring the contour of the fixed plate as the deflected diaphragm when pressure is exerted, a vent hole extending to the cavity having resistive air path for providing equilibrium to the diaphragm and an extended back chamber for increasing the sensitivity of the capacitive pressure sensor. The capacitive pressure sensor is also configured for minimizing parasitic capacitance.

Abstract translation: 本发明公开了一种电容式压力传感器及其制造方法。 电容式压力传感器包括构成为背板的固定板，被构造为用于感测压力的隔膜的可动板，其中在固定板和可动板之间形成空腔，在固定板和可动板之间形成隔离层， 用于使泄漏电流最小化的电触头，用于在施加压力时将作为偏转隔膜的固定板的轮廓构成的多个阻尼孔，延伸到具有用于为隔膜提供平衡的电阻空气路径的空腔的通气孔和延伸的 后室，用于增加电容式压力传感器的灵敏度。 电容式压力传感器也被配置为最小化寄生电容。

公开(公告)号：US20150259196A1

公开(公告)日：2015-09-17

申请号：US14476409

申请日：2014-09-03

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Naofumi NAKAMURA

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0038 ,  B81B7/0058 ,  B81B2201/0264 ,  B81C1/00285 ,  B81C1/00476 ,  G01L1/148 ,  G01L9/0073

Abstract: According to one embodiment, a MEMS device is disclosed. The device includes a substrate, a MEMS element provided on the substrate, a first film having a plurality of through holes. The first film and the substrate form a cavity containing the MEMS element. The device further includes a second film provided on the first film, a third film provided on the substrate, and including a first region and a second region outside the first region, the first region and the second region being different from each other in height from the substrate. The height from the substrate of the first region of the third film is lower than the height from the substrate of the second region of the third film.

Abstract translation: 根据一个实施例，公开了一种MEMS器件。 该器件包括衬底，设置在衬底上的MEMS元件，具有多个通孔的第一膜。 第一膜和衬底形成包含MEMS元件的空腔。 所述装置还包括设置在所述第一膜上的第二膜，设置在所述基板上的第三膜，并且在所述第一区域的外侧包括第一区域和第二区域，所述第一区域和所述第二区域的高度彼此不同 底物。 从第三膜的第一区域的基板的高度低于从第三膜的第二区域的基板的高度。

公开(公告)号：US09112058B2

公开(公告)日：2015-08-18

申请号：US13229338

申请日：2011-09-09

Applicant: Zhenan Bao ,  Benjamin Chee-Keong Tee ,  Stefan Christian Bernhardt Mannsfeld ,  Justin P. Opatkiewicz

Inventor： Zhenan Bao ,  Benjamin Chee-Keong Tee ,  Stefan Christian Bernhardt Mannsfeld ,  Justin P. Opatkiewicz

IPC: G06F3/045 ,  G06F3/041 ,  H03K17/94 ,  H01G7/00 ,  H01L29/84 ,  G01L1/14 ,  H01L51/00 ,  H01L51/05

CPC classification number: G01L1/146 ,  G01L1/148 ,  G06F3/0412 ,  G06F3/0414 ,  G06F3/044 ,  G06F2203/04102 ,  G06F2203/04103 ,  G06F2203/04107 ,  H01L29/84 ,  H01L51/0055 ,  H01L51/0541 ,  Y10T29/49002 ,  Y10T156/10

Abstract: Input devices are provided. In accordance with an example embodiment, an input device includes an interface layer that flexes in response to pressure, a plurality of sense electrodes, a dielectric between the sense electrodes and the interface layer, and interconnecting circuitry. The dielectric compresses or expands in response to movement of the interface layer, and exhibits dielectric characteristics that vary based upon a state of compression of the dielectric. The interconnecting circuitry is coupled to the sense electrodes and provides an output indicative of both the position of each sense electrode and an electric characteristic at each sense electrode that provides an indication of pressure applied to the dielectric adjacent the respective sense electrodes.

Abstract translation: 提供输入设备。 根据示例实施例，输入装置包括响应于压力而弯曲的界面层，多个感测电极，感测电极和界面层之间的电介质以及互连电路。 电介质根据界面层的移动而压缩或膨胀，并且表现出基于电介质的压缩状态而变化的介电特性。 互连电路耦合到感测电极并且提供指示每个感测电极的位置和每个感测电极处的电特性的输出，其提供施加到相邻感测电极附近的电介质的压力的指示。

公开(公告)号：US20150135860A1

公开(公告)日：2015-05-21

申请号：US14539640

申请日：2014-11-12

Applicant: STMicroelectronics S.r.l.

Inventor： Sebastiano Conti ,  Daniele Prati ,  Domenico Giusti

IPC: G01L1/14

CPC classification number: G01L1/142 ,  G01L1/148

Abstract: A MEMS force sensor has: a substrate; a fixed electrode coupled to the substrate; and a mobile electrode suspended above the substrate at the fixed electrode to define a sensing capacitor, the mobile electrode being designed to undergo deformation due to application of a force to be detected. A dielectric material region is set on the fixed electrode and spaced apart by an air gap from the mobile electrode, in resting conditions. The mobile electrode comes to bear upon the dielectric material region upon application of a minimum detectable value of the force, so that a contact surface between the mobile electrode and the dielectric material region increases, in particular in a substantially linear way, as the force increases.

Abstract translation: MEMS力传感器具有：基板; 耦合到所述衬底的固定电极; 以及在所述固定电极处悬置在所述基板上方的移动电极，以限定感测电容器，所述移动电极被设计为由于施加要检测的力而发生变形。 在静止状态下，介电材料区域设置在固定电极上并与气动间隙隔开间隔开。 通过施加力的最小可检测值，移动电极承受电介质材料区域，使得当力增加时，移动电极和电介质材料区域之间的接触表面尤其以基本线性的方式增加 。

公开(公告)号：US08841735B2

公开(公告)日：2014-09-23

申请号：US13728699

申请日：2012-12-27

Applicant: Wacom Co., Ltd.

Inventor： Toshihiko Horie ,  Hidetaka Takiguchi

IPC: H01L29/84 ,  G01L9/12 ,  G01L9/00 ,  G01L1/14

CPC classification number: H01L29/84 ,  G01L1/148 ,  G01L9/0073 ,  G01L9/12 ,  G06F3/03545

Abstract: A capacitive pressure sensing semiconductor device is provided, which has pressure resistance against pressure applied by a pressing member and can detect the pressure surely and efficiently. The pressure sensing semiconductor device includes a pressure detecting part, which detects pressure as a change in capacitance, and a package that receives the pressure detecting part within. The pressure detecting part includes a first electrode and a second electrode disposed to oppose the first electrode, with a determined distance therebetween. Capacitance is formed between the first electrode and the second electrode, and changes according to a change in said distance caused by pressure transmitted to the first electrode by a pressing member. The package also includes a pressure transmitting member that transmits, to the first electrode of the pressure detecting part, the pressure applied by the pressing member.

Abstract translation: 提供一种电容式压力感测半导体器件，其具有抵抗由加压构件施加的压力的耐压性，并且可以有效地检测压力。 压力感测半导体器件包括：压力检测部，其检测作为电容变化的压力;以及接收压力检测部的封装。 压力检测部分包括第一电极和与第一电极相对设置的第二电极，其间具有确定的距离。 在第一电极和第二电极之间形成电容，并且根据由按压部件传递到第一电极的压力引起的所述距离的变化而变化。 该包装还包括压力传递部件，其将压力检测部件的第一电极传递到由按压部件施加的压力。

公开(公告)号：US20140230576A1

公开(公告)日：2014-08-21

申请号：US14347421

申请日：2012-09-20

Applicant: Femtotools AG

Inventor： Felix Beyeler ,  Simon Muntwyler ,  Wolfgang Dietze

IPC: G01L1/14

CPC classification number: G01L1/148 ,  G01L5/0057 ,  G01L5/165

Abstract: Most mechanical tests (compression testing, tensile testing, flexure testing, shear testing) of samples in the sub-mm size scale are performed under the observation with an optical microscope or a scanning electron microscope. However, the following problems exist with prior art force sensors as e.g they cannot be used for in-plane mechanical testing (a- and b-direction) of a sample; they cannot be used for vertical testing (c-direction) of a sample. In order to overcome the before mentioned drawbacks the invention comprises the following basic working principle: A force is applied to the probe (2) at the probe tip (1) of the sensor. The force is transmitted by the sensor probe (2) to the movable body (3) of the sensor. The movable body is elastically suspended by four folded flexures (4), which transduce the force into a deflection dx. This deflection is measured by an array of capacitor electrodes, called capacitive comb drive (6).

Abstract translation: 在使用光学显微镜或扫描电子显微镜的观察下进行大小尺寸刻度的样品的大多数机械试验（压缩试验，拉伸试验，挠曲试验，剪切试验）。 然而，现有技术的力传感器存在以下问题，例如它们不能用于样品的面内机械测试（a-和b-方向）; 它们不能用于样品的垂直测试（c方向）。 为了克服上述缺点，本发明包括以下基本工作原理：在传感器的探针尖端（1）处向探针（2）施加力。 传感器探针（2）将力传递到传感器的可移动体（3）。 可移动体通过四个折叠的挠曲件（4）弹性地悬挂，其将力转换成偏转dx。 该偏转通过称为电容梳驱动器（6）的电容器电极阵列来测量。

公开(公告)号：US20140026670A1

公开(公告)日：2014-01-30

申请号：US13953571

申请日：2013-07-29

Applicant: STMicroelectronics (Rousset) SAS

Inventor： Pascal Fornara ,  Christian Rivero

IPC: G01L1/00 ,  H01L29/66

CPC classification number: G01R31/2872 ,  G01L1/00 ,  G01L1/005 ,  G01L1/148 ,  G01L1/225 ,  G01L1/2293 ,  G01L11/00 ,  G01L25/00 ,  G01R31/2884 ,  H01L27/06 ,  H01L29/66007

Abstract: A method for manufacturing an integrated circuit includes forming in a substrate a measuring circuit sensitive to mechanical stresses and configured to supply a measurement signal representative of mechanical stresses exerted on the measuring circuit. The measuring circuit is positioned such that the measurement signal is also representative of mechanical stresses exerted on a functional circuit of the integrated circuit. A method of using the integrated circuit includes determining from the measurement signal the value of a parameter of the functional circuit predicted to mitigate an impact of the variation in mechanical stresses on the operation of the functional circuit, and supplying the functional circuit with the determined value of the parameter.

Abstract translation: 一种用于制造集成电路的方法包括在基板上形成对机械应力敏感的测量电路，并且被配置为提供表示施加在测量电路上的机械应力的测量信号。 测量电路被定位成使得测量信号也代表施加在集成电路的功能电路上的机械应力。 使用集成电路的方法包括从测量信号确定预测的功能电路的参数的值，以减轻机械应力的变化对功能电路的操作的影响，以及向功能电路提供确定的值 的参数。

公开(公告)号：US08601885B2

公开(公告)日：2013-12-10

申请号：US13147935

申请日：2010-02-11

Applicant: Gilles Delapierre ,  Patrice Rey

Inventor： Gilles Delapierre ,  Patrice Rey

IPC: G01L1/22

CPC classification number: G01L5/162 ,  G01L1/148 ,  G01L1/18 ,  G01L1/2293 ,  G01L5/165 ,  G01L5/167

Abstract: A triaxial force sensor including: a deformable membrane; a detector detecting a deformation of the membrane configured to carry out a triaxial detection of the force to be detected; and an adhesion mechanism disposed at least at one of the principal faces of the deformable membrane, configured to secure the one of the principal faces of the deformable membrane to at least one elastomer material to be acted upon by the force to be detected, and distributed uniformly at a whole of the surface of the one of the principal faces of the deformable membrane, the deformable membrane being disposed between a cavity and the elastomer material.

Abstract translation: 一种三轴力传感器，包括：可变形膜; 检测器，检测被配置为执行待检测的力的三轴检测的膜的变形; 以及粘附机构，其至少设置在所述可变形膜的至少一个所述主面上，所述粘合机构构造成将所述可变形膜的所述主面中的所述一个面固定到待被检测的力作用的至少一种弹性体材料上，并且分布 在可变形膜的一个主面的整个表面上均匀地形成可变形膜，该可变形膜设置在空腔和弹性体材料之间。

公开(公告)号：US20120062245A1

公开(公告)日：2012-03-15

申请号：US13229324

申请日：2011-09-09

Applicant: Zhenan Bao ,  Stefan Christian Bernhardt Mannsfeld ,  Jason Locklin ,  Benjamin Chee-Keong Tee

Inventor： Zhenan Bao ,  Stefan Christian Bernhardt Mannsfeld ,  Jason Locklin ,  Benjamin Chee-Keong Tee

IPC: G01R27/26 ,  H05K13/00 ,  H01L29/84

CPC classification number: G01L1/146 ,  G01L1/148 ,  G06F3/0412 ,  G06F3/0414 ,  G06F3/044 ,  G06F2203/04102 ,  G06F2203/04103 ,  G06F2203/04107 ,  H01L29/84 ,  H01L51/0055 ,  H01L51/0541 ,  Y10T29/49002 ,  Y10T156/10

Abstract: Sensors, sensing arrangements and devices, and related methods are provided. In accordance with an example embodiment, an impedance-based sensor includes a flexible dielectric material and generates an output based on pressure applied to the dielectric material and a resulting compression thereof. In certain embodiments, the dielectric material includes a plurality of regions separated by gaps and configured to elastically deform and recover in response to applied pressure.

Abstract translation: 提供了传感器，感测装置和设备以及相关方法。 根据示例实施例，基于阻抗的传感器包括柔性电介质材料，并且基于施加到电介质材料的压力产生输出，并且由此产生压缩。 在某些实施例中，电介质材料包括由间隙分开并被构造为响应于所施加的压力弹性变形和恢复的多个区域。