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公开(公告)号:US20230297695A1
公开(公告)日:2023-09-21
申请号:US18179893
申请日:2023-03-07
Inventor: Thierry Biniguer , Benjamin Baratte
CPC classification number: G06F21/602 , G06F21/79
Abstract: In an embodiment a method includes receiving, by a first circuit of a device, a first identifier from a second circuit, generating, by the first circuit, at least one key based on the first identifier, a second identifier of the first circuit and a first key, storing, by the first circuit, the at least one key in a memory of the device, transmitting, by the first circuit, the at least one key to the second circuit and removing, by the first circuit, the at least one key from the memory, wherein the at least one key is generated by the first circuit in response to a request for communication with the second circuit, and wherein the first circuit executes one or more cryptographic operations based on the at least one key.
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公开(公告)号:US11736148B2
公开(公告)日:2023-08-22
申请号:US17385122
申请日:2021-07-26
Inventor: Marc Houdebine , Kosta Kovacic , Florent Sibille
CPC classification number: H04B5/0056 , H04L7/0331 , H04L7/04
Abstract: An embodiment device comprises a phase locked loop and a frequency locked loop having in common the same controlled oscillator. The device is firstly placed in the card emulation mode at the beginning of a communication between the contactless communication device and a contactless reader, the firstly placing comprising synchronizing within the contactless device, an ALM carrier frequency with a reader carrier frequency by operating at least the phase locked loop, and upon reception by the contactless communication device of an indication sent by the reader indicating a further communication in a peer to peer mode with the reader, the device is secondly placed in the peer to peer mode, the secondly placing including deactivating the phase locked loop and operating the frequency locked loop with a reference clock signal and a frequency set point depending on the reader carrier frequency and the frequency of the reference clock signal.
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公开(公告)号:US11698296B2
公开(公告)日:2023-07-11
申请号:US17024202
申请日:2020-09-17
Applicant: STMicroelectronics (Crolles 2) SAS , STMicroelectronics SA
Inventor: Stephane Monfray , Olivier Le Neel , Frederic Boeuf
IPC: G01J1/04 , H01L31/0232 , G01J1/44 , G02B5/18 , H01L31/101
CPC classification number: G01J1/0411 , G01J1/44 , G02B5/1828 , G02B5/1857 , H01L31/02327 , H01L31/1013 , G01J2001/444
Abstract: A light sensor includes a semiconductor substrate supporting a number of pixels. Each pixel includes a photoconversion zone extending in the substrate between a front face and a back face of the substrate. An optical diffraction grating is arranged over the back face of the substrate at a position facing the photoconversion zone of the pixel. For at least two different pixels of the light sensor, the optical diffraction gratings have different pitches. Additionally, the optical grating of each pixel is surrounded by an opaque wall configured to absorb at operating wavelengths of the sensor.
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公开(公告)号:US11677431B2
公开(公告)日:2023-06-13
申请号:US16951726
申请日:2020-11-18
Applicant: STMicroelectronics SA
Inventor: Jocelyn Roux
CPC classification number: H04B1/40 , H03F3/19 , H03F2200/451
Abstract: The invention relates to a radio frequency assembly comprising a radio frequency circuit comprising at least one group of N≥2 amplifiers (A1, A2) disposed in series on a substrate (1), said assembly comprising a package (2) wherein the substrate (1) is disposed, each amplifier comprising a local grounding point (b1, b2, b3) and a local feed point (a1, a2, a3), said common grounding points being connected to a common ground (GND) outside the package (2), said common feed points being connected to a common power supply (VDD) outside the package, said assembly comprising at least N−1 parallel LC circuits disposed between the common power supply (VDD) and the local feed point (a2, a3) of an amplifier (A2) so as to attenuate the current loops between two amplifiers in series.
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公开(公告)号:US20230152126A1
公开(公告)日:2023-05-18
申请号:US18155531
申请日:2023-01-17
Applicant: STMicroelectronics (Rousset) SAS , STMicroelectronics SA , STMicroelectronics (Grenoble 2) SAS
Inventor: Laurent Beyly , Oliver Richard , Kenichi OKU
CPC classification number: G01D5/24 , H03K17/962 , H03K2217/9607
Abstract: An embodiment of the present disclosure relates to a method of detection of a touch contact by a sensor including a first step of comparison of a voltage with a first voltage threshold; and a second step of comparison of the voltage with a second voltage threshold, the second step being implemented if the first voltage threshold has been reached within a duration shorter than a first duration threshold, the second voltage threshold being higher than the first voltage threshold.
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公开(公告)号:US20230141388A1
公开(公告)日:2023-05-11
申请号:US17983972
申请日:2022-11-09
Applicant: STMicroelectronics (Crolles 2) SAS , STMicroelectronics SA
Inventor: Charlotte BEYLIER , Mauricio GARCIA SUAREZ , Pascal URARD , Guillaume LANDIE
Abstract: The present description concerns a method that includes the compression, by a processor, of an image comprising first patterns by transforming the image into a first representation formed of two-point elements. The method also includes the execution, by a neural network, of an inference operation on the first representation to generate a second representation formed of two-point elements. The method further includes the generation of a lithographic mask based on the decompression of the second representation.
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517.
公开(公告)号:US20230095645A1
公开(公告)日:2023-03-30
申请号:US17940742
申请日:2022-09-08
Applicant: STMicroelectronics SA
Inventor: Pol Perrin
Abstract: The method for processing a matrix of pixels each containing an original red, green, blue, or infrared component, comprises at least one interpolation of an interpolated component different from the original component of a pixel of interest from the components of a group of pixels neighboring the pixel of interest. The interpolation comprises: a calculation of the sum of the components of reference pixels weighted by a respectively assigned weight, the reference pixels being pixels of the group having the same original component as the interpolated component, an evaluation of the spatial uniformity of an environment, within the group of each reference pixel, a calculation of the weights assigned to the reference pixels at values which are normalized and proportional to the respective spatial uniformity.
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公开(公告)号:US20230067052A1
公开(公告)日:2023-03-02
申请号:US17822375
申请日:2022-08-25
Applicant: STMICROELECTRONICS SA
Inventor: Lionel Vogt
IPC: H03K5/00
Abstract: In an embodiment a radiofrequency doubler includes a first transistor and a second transistor connected in parallel between a first differential output and a first terminal of a current source configured to provide a bias current, a second terminal of the current source being connected to a first supply potential, a third transistor connected between the first terminal of the current source and a second differential output, a circuit configured to apply an AC component of a first differential input and a first DC voltage to a gate of the first transistor, apply an AC component of a second differential input and the first DC voltage to a gate of the second transistor and apply a second DC voltage to a gate of the third transistor, and a feedback loop configured to control the first voltage or the second voltage from a difference between DC components of the first and second differential outputs so as to equalize the DC components.
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公开(公告)号:US11569021B2
公开(公告)日:2023-01-31
申请号:US16275091
申请日:2019-02-13
Applicant: STMicroelectronics SA
Inventor: Vincent Knopik
IPC: H01Q1/36 , H01F27/28 , H01L23/522 , H03H7/42 , H01F27/29 , H01F38/14 , H01F41/04 , H01F41/10 , H01Q1/24 , H01Q1/48 , H01Q1/50 , H01Q7/00
Abstract: A transformer of the symmetric-asymmetric type includes comprising a primary inductive circuit and a secondary inductive circuit formed in a same plane by respective interleaved and stacked metal tracks. A first crossing region includes a pair of connection plates facing one another, with each connection plate having a rectangular shape that is wider than the metal tracks, and diagonally connected to tracks of the secondary inductive circuit.
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520.
公开(公告)号:US20220384419A1
公开(公告)日:2022-12-01
申请号:US17748311
申请日:2022-05-19
Applicant: STMicroelectronics SA
Inventor: Philippe GALY
Abstract: An integrated circuit is formed by a semiconductor part with a semiconductor substrate and an interconnection part including levels of metals. An electrostatic-discharge sensor includes a semiconductor structure in the semiconductor part and a network of metal antennas in the interconnection part. The electrostatic-discharge sensor has at least one pair of two nodes having one of a resistive link or a capacitive link or a PN-junction link in the semiconductor structure. The antennas of the network of antennas coupled to the nodes of the least one pair of two nodes exhibit an asymmetry in one or more of shape and size.
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