TILT EVENT DETECTION DEVICE, SYSTEM AND METHOD
    573.
    发明申请

    公开(公告)号:US20190242704A1

    公开(公告)日:2019-08-08

    申请号:US15889891

    申请日:2018-02-06

    CPC classification number: G01C9/06 G01P15/18 G06F13/24

    Abstract: A sensor includes an accelerometer, which, in operation, generates accelerometer data, and digital signal processing circuitry. The digital signal processing circuitry, in operation, generates, based on the generated accelerometer data, a value indicative of a cosine of an angle between an acceleration vector associated with current accelerometer data and a reference acceleration vector, compares the generated value indicative of the cosine of the angle between the vector associated with current accelerometer data and the reference acceleration vector with one or more thresholds and generates a tilt signal based on the comparison of the generated value indicative of the cosine of the angle between the vector associated with current accelerometer data and the reference acceleration vector with the one or more thresholds. The tilt signal may be used as an interrupt signal to an application processor.

    Switch Circuit, Corresponding Device and Method

    公开(公告)号:US20190238130A1

    公开(公告)日:2019-08-01

    申请号:US16261267

    申请日:2019-01-29

    Abstract: A bi-directional switch circuit includes first and second transistors having their control electrodes coupled at a first common node and the current paths coupled at a second common node in an anti-series arrangement. First and second electrical paths coupled between the first common node and the first and second transistors, respectively, include first and second switches switchable between a conductive state and a non-conductive state. A third electrical path between the first and second common nodes includes a third switch switchable between a conductive state and a non-conductive state. The third switch is coupled with the first and second switches by a logical network configured to switch the third switch to the conductive state with the first and second switches switched to the non-conductive state, and to the non-conductive state with either one of the first and second switches switched to the conductive state.

    Switching Circuit, Corresponding Device and Method

    公开(公告)号:US20190238094A1

    公开(公告)日:2019-08-01

    申请号:US16261236

    申请日:2019-01-29

    Abstract: A switching circuit includes a switching circuit stage configured to supply a load via filter networks. Control circuitry is provided to control alternate switching sequences of transistors in the half-bridges of the switching circuit stage. A current flow line is provided between the output nodes of the half-bridges including an inductance between two switches. First and second capacitances are coupled with the output nodes of the half-bridges. The control circuitry switches first and second switches to the conductive state at intervals in the alternate switching sequences of the transistors in the half-bridges between switching the first pair of transistors to a non-conductive state and switching the second pair of transistors to a conductive state.

    MICROELECTROMECHANICAL PIEZORESISTIVE PRESSURE SENSOR WITH SELF-TEST CAPABILITY AND CORRESPONDING MANUFACTURING PROCESS

    公开(公告)号:US20190219468A1

    公开(公告)日:2019-07-18

    申请号:US16248415

    申请日:2019-01-15

    CPC classification number: G01L27/002 G01L9/0054 G01L27/007

    Abstract: A microelectromechanical pressure sensor includes a monolithic body of semiconductor material having a front surface. A sensing structure is integrated in the monolithic body and has a buried cavity completely contained within the monolithic body at the front surface. A sensing membrane is suspended above the buried cavity and is formed by a surface portion of the monolithic body. Sensing elements of a piezoresistive type are arranged in the sensing membrane to detect a deformation of the sensing membrane as a result of a pressure. The pressure sensor is further provided with a self-test structure integrated within the monolithic body to cause application of a testing deformation of the sensing membrane in order to verify proper operation of the sensing structure.

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