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公开(公告)号：US11493970B2
公开(公告)日：2022-11-08
申请号：US17085505
申请日：2020-10-30
发明人： Christopher Kong Yee Chun , Chandan Agarwalla , Dipti Ranjan Pal , Kumar Kanti Ghosh , Matthew Severson , Nilanjan Banerjee , Joshua Stubbs
IPC分类号： G06F1/26 , G06F1/3296 , G06F1/3228 , G06F1/3287
摘要： Dynamic power supply voltage adjustment in a computing device may involve two stages. In a first stage, a first method for adjusting a power supply voltage may be disabled. While the first method remains disabled, a request to adjust the power supply voltage from an initial value to a target value using a second method may be received. The second method may be initiated in response to the request if a time interval has elapsed since a previous request to adjust the power supply voltage. In a second stage, the first method may be enabled when it has been determined that the power supply voltage has reached the target value.
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公开(公告)号：US11476841B2
公开(公告)日：2022-10-18
申请号：US17198515
申请日：2021-03-11
发明人： Liang Dai , Kentaro Yamamoto , Behnam Sedighi
摘要： A D-type flip-flop (DFF) includes an input circuit having a plurality of transistors configured to receive a clock signal and a data signal, a first inverter (INV1) having a pair of transistors, the first inverter configured to receive an input voltage (x) from the input circuit at a first inverter input, the first inverter configured to provide an output voltage (y) to a first inverter output, a second inverter (INV2) coupled to the first inverter (INV1), the second inverter having a second inverter input and a second inverter output, the second inverter input coupled to the first inverter output, a third inverter (INV3) coupled to the second inverter (INV2), the third inverter having a third inverter input and a third inverter output, and a current device coupled to the first inverter output, the current device configured to provide a current at the first inverter output.
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公开(公告)号：US11470782B2
公开(公告)日：2022-10-18
申请号：US16077841
申请日：2017-02-16
摘要： A rotatable pick-up device, which is installed or installable in an agricultural harvesting machine, for harvested crop, having a roller-shaped drum with an outer lateral surface that has an outside diameter, a multiplicity of tine rings that are arranged on the outer lateral surface of the drum and protrude over the outside diameter of the drum, intermediate spaces for receiving strippers provided between adjacent tine rings, and the tine rings have tine segments that, in the mounted state, are arranged entirely above the lateral surface and are manufactured from an elastic plastic. The tine rings and the tine segments have mutually complementary fastening means, by means of which the tine segments can be mounted on the tine ring without the tine ring being removed.
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公开(公告)号：US11459643B2
公开(公告)日：2022-10-04
申请号：US16463634
申请日：2017-11-29
发明人： Xiaoming Dong , Zhonghua Zhang , Cunyao Zhao
IPC分类号： C22C38/02 , B22D11/00 , B22D11/115 , C21D8/10 , C22C38/00 , C22C38/04 , C22C38/06 , C22C38/22 , C22C38/24 , C22C38/26 , C22C38/28 , C22C38/32
摘要： A high-strength and high-toughness tube for perforating gun, having a formulation of chemical elements in percentage by mass as follows: C: 0.15%-0.22%, Si: 0.1%-0.4%, Mn: 0.5%-1%, Cr: 0.3%-0.7%, Mo: 0.3%-0.7%, Nb: 0.01%-0.04%, V: 0.1%-0.2%, Ti: 0.02%-0.05%, B: 0.0015%-0.005%, Al: 0.01%-0.05%, Ca: 0.001%-0.004%, N≤0.008%, and the balance of Fe and other inevitable impurities. Accordingly, further disclosed is a method for manufacturing a high-strength and high-toughness tube for perforating gun. The high-strength and high-toughness tube for perforating gun of the present invention has high strength, good toughness and uniform circumferential strength, and is suitable for application in the field of petroleum exploration and exploitation.
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公开(公告)号：US11452212B2
公开(公告)日：2022-09-20
申请号：US16949203
申请日：2020-10-20
发明人： Mikael Tuominen , Seok Kim Tay , Sally Sun
摘要： A component carrier includes an electrically insulating layer structure, a first electrically conductive layer structure, a second electrically conductive layer structure, and a laser through-hole with an electrically conductive medium filling at least part of the through-hole. The first electrically conductive layer structure covers a first side of the electrically insulating layer structure and has a first window extending through the first electrically conductive layer structure formed by etching using a conformal mask. The second electrically conductive layer structure covers an opposed side of the electrically insulating layer structure and has a second window extending through the second electrically conductive layer structure formed by etching using a conformal mask. The laser through-hole extends through the electrically insulating layer structure. At least a portion of at least one sidewall of the electrically conductive layer structures delimiting the windows is tapered.
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公开(公告)号：US11445601B2
公开(公告)日：2022-09-13
申请号：US17247832
申请日：2020-12-24
发明人： Mikael Tuominen , Seok Kim Tay
IPC分类号： H05K1/02 , H05K1/18 , H01L21/48 , H01L23/31 , H01L23/498
摘要： A component carrier includes a stack having at least one electrically conductive layer structure, a first electrically insulating layer structure and a second electrically insulating layer structure. The first electrically insulating layer structure is made of a material which has first physical properties. The second electrically insulating layer structure is made of another material which has second physical properties differing from the first physical properties. The first electrically insulating layer structure and the second electrically insulating layer structure are at least partially in direct physical contact with each other. A method of manufacturing a component carrier is also disclosed.
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公开(公告)号：US11412622B2
公开(公告)日：2022-08-09
申请号：US16808109
申请日：2020-03-03
发明人： Thomas Kristl , Ewald Moitzi
IPC分类号： H05K1/02 , H05K1/03 , H05K1/09 , H05K1/11 , H05K1/16 , H05K1/18 , H05K3/00 , H05K3/06 , H05K3/10 , H05K3/30 , H05K3/38 , H05K3/42 , H05K3/46 , H01L21/02 , H01L21/44 , H01L21/48 , H01L21/8239 , H01L23/02 , H01L23/34 , H01L23/48 , H01L23/52 , H01L23/46 , H01L23/66 , H01L23/498
摘要： A component carrier includes a stack having an electrically conductive layer structure, with at least one recess, on an electrically insulating layer structure; a dielectric filling medium filling at least part of the at least one recess; and a further electrically insulating layer structure on the electrically conductive layer structure and on the dielectric filling medium. A method of manufacturing a component carrier includes forming a stack having an electrically conductive layer structure, with at least one recess, on an electrically insulating layer structure; at least partially filling the at least one recess by a dielectric filling medium; and thereafter forming a further electrically insulating layer structure on the electrically conductive layer structure and on the dielectric filling medium.
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58.发明授权公开(公告)号：US11409340B2
公开(公告)日：2022-08-09
申请号：US16909933
申请日：2020-06-23
发明人： Jian Shen
摘要： A PCD may include an active heat transfer system configured to transfer heat from the PCD to a docking device. The active heat transfer system may include a thermoelectric cooler, a heat pipe, or other heat transfer elements. The active heat transfer system may, based on temperature measurements, be activated when the PCD is coupled to the docking device.
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公开(公告)号：US11405878B2
公开(公告)日：2022-08-02
申请号：US16529195
申请日：2019-08-01
发明人： Piyush Gupta , Junyi Li
摘要： A method for communication by an edge communication device with a network via a relay communication device includes synchronizing to a network using an initial synchronization signal, associating with a relay communication device, entering a power saving state, awakening from the power saving state, searching for a periodic secondary relay synchronization signal (SRSS) transmitted by the relay communication device using an SRSS search window having a duration longer than a duration of a network search window for searching for the initial synchronization signal, synchronizing to the relay communication device based on the SRSS signal, and transmitting data to the relay communication device based on the synchronizing to enable the relay communication device to relay the data to the network.
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公开(公告)号：US11388824B2
公开(公告)日：2022-07-12
申请号：US16153199
申请日：2018-10-05
IPC分类号： H05K1/09 , H05K1/11 , H05K1/18 , H05K3/46 , H05K3/10 , H05K3/36 , H05K1/02 , B29C64/10 , B33Y99/00 , H05K3/12 , B33Y80/00 , B33Y10/00 , B33Y70/00
摘要： A component carrier and a method for manufacturing a component carrier is described wherein the component carrier includes a carrier body with a plurality of electrically conductive layer structures and/or electrically insulating layer structures and a wiring structure on and/or in the layer structures where the wiring structure is at least partially formed as a three-dimensionally printed structure.
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