公开(公告)号：US20250007430A1

公开(公告)日：2025-01-02

申请号：US18745528

申请日：2024-06-17

Applicant: STMICROELECTRONICS INTERNATIONAL N.V.

Inventor： Dietmar MENDEN ,  Christian BJOERNSEN

IPC: H02P5/68 ,  B60R16/023 ,  H02K11/215 ,  H02P7/03 ,  H02P7/29

Abstract: The present disclosure relates to a motor control device comprising: a motor driver electronic circuit configured to be electrically coupled to at least one motor and to drive the at least one motor; a control electronic circuit electrically coupled to the motor driver electronic circuit, and configured to control the motor driver electronic circuit and to be electrically coupled to a motor position sensor; wherein the control electronic circuit further comprises a CAN type transceiver configured to directly communicate with at least one main ECU, which is external to the motor control device, using a commander and responder CAN type communication protocol, the control electronic circuit being configured to act as a responder node during a communication with the main ECU.

公开(公告)号：US20250006725A1

公开(公告)日：2025-01-02

申请号：US18744291

申请日：2024-06-14

Applicant: STMicroelectronics International N.V.

Inventor： Varun KUMAR

IPC: H01L27/02 ,  H01L21/8249

Abstract: The present disclosure is directed to an input/output (I/O) interface that includes a set of complementary metal-oxide semiconductor (CMOS) transistors in a P-type substrate. A first N-type region is in the substrate and a second N-type region in the substrate spaced from the first N-type region, the second N-type region being a deep-NWELL (DNW). A first heavily doped P-type region is between the first and second N-type regions, the first heavily doped P-type region is coupled to ground. A second heavily doped P-type region in the first N-type region, the second heavily doped P-type region and is coupled to an output terminal. A first heavily doped N-type region is in the first N-type region, the first heavily doped N-type region is coupled to a floating-Well (FW) terminal. A second heavily is doped N-type region in the second N-type region. A resistor is coupled to the DNW and the resistor is coupled to a voltage supply terminal.

公开(公告)号：US20240429935A1

公开(公告)日：2024-12-26

申请号：US18742445

申请日：2024-06-13

Applicant: STMicroelectronics International N.V.

Inventor： Sandrine Ollivry ,  Jean-Francois Link

IPC: H03M1/12

Abstract: An analog-to-digital converter is clocked by a converter clock signal. A first clock signal has a frequency multiple of the frequency of the converter clock signal. A timer, which is clocked with the rhythm of the first clock signal, has a timing period multiple of the period of the converter clock signal. A processor is configured to control the converter based on the timing signal delivered by the timer, and has a first operating mode in which it is further configured to clock the timer synchronously with the converter clock signal and to deliver based on the timing signal, a periodic first conversion control signal of the converter, having a period multiple of the period of the converter clock signal and a constant first phase difference with the converter clock signal.

公开(公告)号：US20240426908A1

公开(公告)日：2024-12-26

申请号：US18742474

申请日：2024-06-13

Applicant: STMicroelectronics International N.V.

Inventor： Andrea Floridia ,  Michelangelo Massimo Maria Grosso

IPC: G01R31/3185

Abstract: A scan-testable integrated circuit includes a logic circuit configured to receive test mode control signals, a signal interface configured to receive scan-in, scan enable and scan clock signals, and produce a scan-out signal, and a scan register including a plurality of scan cells coupled to the signal interface to receive the scan enable and scan clock signals. Additional scan cells are coupled to the signal interface, and configured to receive and propagate the scan-in signal when the scan enable signal is asserted. Data retention cells are coupled to respective ones of the additional scan cells and to the logic circuit, and configured to provide as output the values stored in the respective additional scan cells to produce the test mode control signals when the scan enable signal is de-asserted, and configured to prevent the test mode control signals from changing value when the scan enable signal is asserted.

公开(公告)号：US20240426868A1

公开(公告)日：2024-12-26

申请号：US18738990

申请日：2024-06-10

Applicant: STMicroelectronics International N.V.

Inventor： Francesco RIZZINI ,  Gabriele GATTERE

IPC: G01P15/125 ,  G01P21/00

Abstract: A MEMS sensor comprising a semiconductor body and a mass elastically coupled to the semiconductor body for oscillating with respect to the semiconductor body in a oscillation direction in response to a force acting on the mass in the oscillation direction, the force being caused by an acceleration applied to the MEMS sensor. The mass and the semiconductor body define at least one measurement structure with parallel-plate electrodes, which is configured to measure capacitively a position of the mass that is indicative of the acceleration applied to the MEMS sensor. The mass and the semiconductor body further define a calibration structure with comb-finger electrodes that is electrically controllable, in a calibration mode of the MEMS sensor, to bring about electrostatically a displacement of the mass with respect to the semiconductor body in the oscillation direction.

公开(公告)号：US20240421176A1

公开(公告)日：2024-12-19

申请号：US18734573

申请日：2024-06-05

Applicant: STMicroelectronics International N.V.

Inventor： Florian Perminjat ,  Vincent Beix ,  Yandong Mao ,  Karine Saxod

IPC: H01L27/146

Abstract: An optical package comprising a support substrate including first electrical contacts, a cap fixed to the support substrate by adhesive and comprising second electrical contacts connected to the first electrical contacts by a soldering material, a separation structure disposed between the soldering material and the adhesive

公开(公告)号：US20240419525A1

公开(公告)日：2024-12-19

申请号：US18678878

申请日：2024-05-30

Applicant: STMicroelectronics International N.V.

Inventor： Mohamed Ali Moussa ,  Francois De Rochebouet

IPC: G06F11/07 ,  G06F17/16

Abstract: A method implemented by computer for generating a model for anomaly detection in a system includes obtaining a learning data matrix corresponding to a normal operation of the system, decomposing the learning data matrix into singular values of the matrix of learning data, calculating a new base, defining a maximum Mahalanobis distance threshold representing a limit of the normal operation of the system, and defining an anomaly detection model from the new base and from the maximum Mahalanobis distance threshold.

公开(公告)号：US12170120B2

公开(公告)日：2024-12-17

申请号：US18227545

申请日：2023-07-28

Applicant: STMicroelectronics International N.V.

Inventor： Hitesh Chawla ,  Tanuj Kumar ,  Bhupender Singh ,  Harsh Rawat ,  Kedar Janardan Dhori ,  Manuj Ayodhyawasi ,  Nitin Chawla ,  Promod Kumar

IPC: G11C29/00 ,  G11C29/12 ,  G11C29/36

Abstract: The memory array of a memory includes sub-arrays with memory cells arranged in a row-column matrix where each row includes a word line and each sub-array column includes a local bit line. A row decoder circuit supports two modes of memory circuit operation: a first mode where only one word line in the memory array is actuated during a memory read and a second mode where one word line per sub-array are simultaneously actuated during the memory read. An input/output circuit for each column includes inputs to the local bit lines of the sub-arrays, a column data output coupled to the bit line inputs, and a sub-array data output coupled to each bit line input. Both BIST and ATPG testing of the input/output circuit are supported. For BIST testing, multiple data paths between the bit line inputs and the column data output are selectively controlled to provide complete circuit testing.

公开(公告)号：US20240413178A1

公开(公告)日：2024-12-12

申请号：US18674220

申请日：2024-05-24

Applicant: STMICROELECTRONICS INTERNATIONAL N.V.

Inventor： Rita KUO

IPC: H01L27/146 ,  H01L23/00

Abstract: A glassless wafer-level optical sensor semiconductor package is provided. A method of manufacturing a glassless wafer-level optical sensor package of an example includes: forming one or more dams at least partially surrounding one or more optical sensors on a wafer; supporting the wafer on a carrier substrate via the one or more dams; forming a wafer-level optical sensor integrated circuit for each of the one or more optical sensors on the wafer by: performing a through-silicon via process on the wafer; forming an isolation layer on the wafer; and performing a passivation operation on the wafer; removing the wafer from the carrier substrate; and singulating each wafer-level optical sensor integrated circuit.

公开(公告)号：US12165680B1

公开(公告)日：2024-12-10

申请号：US18538724

申请日：2023-12-13

Applicant: STMicroelectronics International N.V.

Inventor： Enrico Sentieri ,  Paolo Pulici ,  Enrico Mammei ,  Michele Bartolini ,  Matteo Tonelli

IPC: G11B5/60

Abstract: A method for determining a fly height includes measuring a first differential voltage between a first head of a disk drive and a reference voltage with a first front end circuit, converting the first differential voltage to a first analog current signal with the first front end circuit, and converting the first analog current signal to a second differential voltage with a first back end circuit. The first front end circuit is coupled with the first head. The first back end circuit is coupled with the first front end circuit. The method further includes determining a first capacitance between the first head and a first disk of the disk drive based on the second differential voltage and determining the fly height between the first head and the first disk using the first capacitance.