公开(公告)号：USD606064S1

公开(公告)日：2009-12-15

申请号：US29339187

申请日：2009-06-25

Applicant: Jung-pin Chen ,  Shu-chen Lin ,  Shan-yao Chen

Designer： Jung-pin Chen ,  Shu-chen Lin ,  Shan-yao Chen

公开(公告)号：US06498226B2

公开(公告)日：2002-12-24

申请号：US09848525

申请日：2001-05-03

Applicant: Kung-Lung Cheng ,  Shu-Chen Lin ,  Wen-Ling Lui ,  Chih-Hsiang Lin ,  Wei-Ling Lin ,  Woan-Shiow Tzeng

Inventor： Kung-Lung Cheng ,  Shu-Chen Lin ,  Wen-Ling Lui ,  Chih-Hsiang Lin ,  Wei-Ling Lin ,  Woan-Shiow Tzeng

IPC: C08G7310

CPC classification number: C08G73/10 ,  G02F1/133723 ,  G03F7/037 ,  G03F7/0387

Abstract: This invention provides cycloaliphatic polyimide having the following formula (I): wherein 1 and n are integers from 4 to 7; m is an integer from 0 to 2; p is an integer from 1 to 8; polycyclic aliphatic compound R reprents C1-8 cycloalkyl, cycloalkenyl, cycloalkynyl, norbornenyl, decalinyl, adamantanyl, or cubanyl. That cycloaliphatic polyimide can be a through transparent film, their thermal stability is over 430° C. and dielectric constant is about 2.7.

Abstract translation: 本发明提供具有下式（I）的脂环族聚酰亚胺：其中1和n为4-7的整数; m为0〜2的整数; p是1至8的整数; 多环脂肪族化合物R排斥C 1-8环烷基，环烯基，环炔基，降冰片烯基，十氢化萘基，金刚烷基或十六烷基。 该脂环族聚酰亚胺可以是透明膜，它们的热稳定性高于430℃，介电常数约为2.7。

公开(公告)号：US06313314B1

公开(公告)日：2001-11-06

申请号：US09634466

申请日：2000-08-07

Applicant: Kung-Lung Cheng ,  Shu-Chen Lin ,  Woan-Shiow Tzeng ,  Se-Tsun Hong

Inventor： Kung-Lung Cheng ,  Shu-Chen Lin ,  Woan-Shiow Tzeng ,  Se-Tsun Hong

IPC: C07D207452

CPC classification number: C07D207/452

Abstract: The present invention provides a novel method for the preparation of N-azidosulfonyl-arylimides, which are known as photo-initiators. At the outset, substitution reaction of 4-acetamidobenzenesulfonyl halide with MN3 (M denotes hydrogen or alkaline metal) provides the corresponding azide. After de-protection to remove the actyl group, aminoarylsulfonyl azide is extracted with organic solvent, and the extract is directly used for addition reaction with maleic anhydride without concentration. Finally, end products are obtained by dehydration of the addition products using acetic anhydride/metal acetate, followed by re-crystallization in alcohol solvent. The end products are obtained in purer form and greater yield than that in conventional methods.

Abstract translation: 本发明提供了一种制备N-叠氮基磺酰基 - 芳基酰亚胺的新方法，其被称为光引发剂。 首先，4-乙酰氨基苯磺酰卤与MN3的取代反应（M表示氢或碱金属）提供相应的叠氮化物。 脱保护后除去actyl基团，氨基芳基磺酰基叠氮化物用有机溶剂萃取，提取物直接用于马来酸酐的加成反应而不浓缩。 最后，通过使用乙酸酐/金属乙酸酯脱水加成产物，然后在醇溶剂中重结晶获得最终产物。 与常规方法相比，最终产品以更纯的形式获得并且产率更高。

公开(公告)号：US08540919B2

公开(公告)日：2013-09-24

申请号：US13064111

申请日：2011-03-07

Applicant: Shu-Chen Lin

Inventor： Shu-Chen Lin

IPC: B29C45/14 ,  B06B1/02

CPC classification number: B29C45/14795 ,  B29C2045/14155 ,  B29C2045/14803 ,  B29L2031/3481 ,  G01D11/245

Abstract: A manufacturing method of housing of electronic device comprises following steps: providing a metal member; forming a plurality of micro anchored apertures on a surface of the metal member; placing the metal member in a plastic injection mold, wherein the plastic injection mold is set at a first temperature; and providing a molten plastic material in the plastic injection mold for integrating with the surface of the metal member with an injection molding manner, wherein the plastic injection mold is set at a second temperature, and the second temperature is higher than the first temperature.

Abstract translation: 电子设备的外壳的制造方法包括以下步骤：提供金属构件; 在所述金属构件的表面上形成多个微锚定孔; 将金属构件放置在塑料注射模具中，其中塑料注射模具设置在第一温度; 以及在所述塑料注射模具中提供熔融塑性材料，用于与所述金属构件的表面一体地注塑成型，其中所述塑料注射模具被设定在第二温度，并且所述第二温度高于所述第一温度。

公开(公告)号：US20130187265A1

公开(公告)日：2013-07-25

申请号：US13353380

申请日：2012-01-19

Applicant: Cheng-Hung Shih ,  Shu-Chen Lin ,  Yung-Wei Hsieh ,  Jun-Yu Yeh

Inventor： Cheng-Hung Shih ,  Shu-Chen Lin ,  Yung-Wei Hsieh ,  Jun-Yu Yeh

IPC: H01L23/485

CPC classification number: H01L24/11 ,  H01L21/4853 ,  H01L23/3171 ,  H01L23/49811 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/10126 ,  H01L2224/10156 ,  H01L2224/1147 ,  H01L2224/1182 ,  H01L2224/13147 ,  H01L2224/13562 ,  H01L2224/1369 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor structure comprises a carrier, a plurality of under bump metallurgy layers, a plurality of copper containing bumps and an organic barrier layer, wherein the carrier comprises a protective layer and a plurality of conductive pads, mentioned protective layer comprises a plurality of openings, the conductive pads exposed by the openings, mentioned under bump metallurgy layers being formed on the conductive pads, mentioned copper containing bumps being formed on the under bump metallurgy layers, each of the copper containing bumps comprises a top surface and a ring surface in connection with the top surface, mentioned organic barrier layer having a first coverage portion, and mentioned first coverage portion covers the top surface and the ring surface of each of the copper containing bumps.

Abstract translation: 半导体结构包括载体，多个凸块下金属层，多个含铜凸起和有机阻挡层，其中所述载体包括保护层和多个导电焊盘，所述保护层包括多个开口， 通过开口暴露的导电焊盘，所述凹凸不平的冶金层形成在导电焊盘上，所述含铜凸起形成在凸块下的冶金层上，每个含铜凸块包括顶表面和与 具有第一覆盖部分的上表面的有机阻挡层和所述第一覆盖部分覆盖每个含铜凸块的顶表面和环表面。

公开(公告)号：USD685360S1

公开(公告)日：2013-07-02

申请号：US29409036

申请日：2011-12-20

Applicant: Shan-Yao Chen ,  Shu-Chen Lin ,  Jung-Pin Chen

Designer： Shan-Yao Chen ,  Shu-Chen Lin ,  Jung-Pin Chen

公开(公告)号：US08362000B2

公开(公告)日：2013-01-29

申请号：US12765420

申请日：2010-04-22

Applicant: Haiyan Bian ,  Kristen Chevalier ,  Jose Clemente ,  Pete Connolly ,  Chris Flores ,  Shu-Chen Lin ,  Li Liu ,  John Mabus ,  Mark Macielag ,  Mark McDonnell ,  Philip Pitis ,  Yue-Mei Zhang ,  Sui-Po Zhang ,  Bin Zhu

Inventor： Haiyan Bian ,  Kristen Chevalier ,  Jose Clemente ,  Pete Connolly ,  Chris Flores ,  Shu-Chen Lin ,  Li Liu ,  John Mabus ,  Mark Macielag ,  Mark McDonnell ,  Philip Pitis ,  Yue-Mei Zhang ,  Sui-Po Zhang ,  Bin Zhu

IPC: A61K31/496 ,  A61K31/5377 ,  C07D205/04 ,  C07D401/12 ,  C07D403/04 ,  C07D409/06 ,  C07D413/12

CPC classification number: C07D403/10 ,  C07D205/04 ,  C07D401/10 ,  C07D401/12 ,  C07D401/14 ,  C07D403/04 ,  C07D403/06 ,  C07D403/12 ,  C07D403/14 ,  C07D405/12 ,  C07D409/06 ,  C07D409/12 ,  C07D409/14 ,  C07D417/06 ,  C07D417/12 ,  C07D417/14 ,  C07D471/04 ,  C07D491/048 ,  C07D495/04

Abstract: Disclosed are compounds, compositions and methods for treating various diseases, syndromes, conditions and disorders, including pain. Such compounds are represented by Formula (I) as follows: wherein Y, Z, R1, and s are defined herein.

公开(公告)号：US08272864B2

公开(公告)日：2012-09-25

申请号：US12801771

申请日：2010-06-24

Applicant: Shu-Chen Lin

Inventor： Shu-Chen Lin

IPC: B29C45/73

CPC classification number: B29C45/73 ,  B29C33/06 ,  B29C2035/0811

Abstract: An injection mold having pre-heating device, the pre-heating device, and method for pre-heating injection mold are provided. The pre-heating device includes a high frequency coil member and a transportation device having a Z axle servo motor, a Z axle linear sliding rail, an annular transportation belt and a lifting rack. The annular transportation belt is driven by the Z axle servo motor. The high frequency coil member is hung on the lifting rack. The lifting rack is moveably connected to the Z axle linear sliding rail, coupled to the annular transportation belt and is driven by the annular transportation belt to perform an ascent or descent movement along the Z axle linear sliding rail.

Abstract translation: 提供了具有预热装置的注射模具，预热装置和用于预热注射模具的方法。 预热装置包括高频线圈构件和具有Z轴伺服电动机，Z轴线性滑轨，环形输送带和提升架的运输装置。 环形输送带由Z轴伺服电机驱动。 高频线圈构件悬挂在起重架上。 起重架可移动地连接到Z轴线性滑轨，联接到环形输送带，并由环形输送带驱动，以沿着Z轴线性滑轨进行上升或下降运动。

公开(公告)号：US20120202824A1

公开(公告)日：2012-08-09

申请号：US13451652

申请日：2012-04-20

Applicant: Peter J. CONNOLLY ,  Shu-Chen Lin ,  Mark J. Macielag ,  Yue-Mei Zhang

Inventor： Peter J. CONNOLLY ,  Shu-Chen Lin ,  Mark J. Macielag ,  Yue-Mei Zhang

IPC: A61K31/497 ,  A61P25/24 ,  A61P25/16 ,  A61P25/30 ,  A61P11/00 ,  A61P1/04 ,  A61P13/00 ,  A61P15/00 ,  A61P1/12 ,  A61P9/00 ,  A61P25/00 ,  A61P25/32

CPC classification number: C07D401/14 ,  C07D403/14

Abstract: Disclosed are compounds, compositions and methods for treating various diseases, syndromes, conditions and disorders, including pain. Such compounds are represented by Formula I as follows: wherein R1, R2, R3, L, X, and Y are defined herein.

Abstract translation: 公开了用于治疗各种疾病，综合征，病症和障碍（包括疼痛）的化合物，组合物和方法。 这样的化合物由式I表示如下：其中R1，R2，R3，L，X和Y如本文所定义。

公开(公告)号：US20120101081A1

公开(公告)日：2012-04-26

申请号：US13277734

申请日：2011-10-20

Applicant: Yue-Mei Zhang ,  Peter J. Connolly ,  Shu-Chen Lin ,  Mark J. MacIelag

Inventor： Yue-Mei Zhang ,  Peter J. Connolly ,  Shu-Chen Lin ,  Mark J. MacIelag

IPC: A61K31/4725 ,  A61P25/00 ,  C07D403/14 ,  C07D417/14 ,  C07D403/12

CPC classification number: A61K31/4025 ,  A61K31/404 ,  A61K31/416 ,  A61K31/427 ,  A61K31/428 ,  A61K31/4725 ,  A61K31/506 ,  A61K31/517 ,  C07D403/12 ,  C07D405/14 ,  C07D409/14 ,  C07D417/14

Abstract: Disclosed are compounds, compositions and methods for treating various diseases, syndromes, conditions and disorders, including pain. Such compounds, and enantiomers, diastereomers, and pharmaceutically acceptable salts thereof, are represented by Formula (I) as follows: wherein Y, Z, and R1, and R2 are defined herein.

Abstract translation: 公开了用于治疗各种疾病，综合征，病症和障碍（包括疼痛）的化合物，组合物和方法。 这样的化合物和对映异构体，非对映异构体及其药学上可接受的盐由式（I）表示如下：其中Y，Z和R 1和R 2在本文中定义。