Abstract:
Programmable memory devices include a memory cell having an associated bit line. A buffer circuit couples the bit line to a data line. The buffer circuit has a sense node coupled to the bit line and includes a latch circuit having a latch node coupled to the data line. A control circuit resets the latch node between a program operation of the memory cell and its corresponding program-verify operation. The memory devices may be NAND-type flash memory devices and the memory cell may be one of a string of memory cells connected in series between the bit line and a common source line. A transistor may couple the data line to the latch node and a transistor may couple the latch node to the sense node. Methods of operating the same are also provided.
Abstract:
Disclosed is a non-volatile semiconductor memory device including a circuit for controlling potentials of select lines and word lines in accordance with bit line setup, string select line setup, program and discharge periods of a program cycle. The control circuit biases a string select line to a power supply voltage during the bit line setup period in the program cycle, and to a voltage between the power supply voltage and ground voltage during the string select line setup and the program periods. According to the string select line control scheme, program disturb due to a noise voltage induced at a string select line when a program voltage is applied to a word line adjacent to the string select line is prevented.
Abstract:
A method of programming a non-volatile semiconductor memory device is provided. The method includes a bitline setup step, a well bias setup step, a program step, and a discharge step. In the bitline setup step, either a ground or power supply voltage is supplied respectively to bitlines according to data bits stored in page buffers, and a pocket P-well area is biased with the ground voltage. In the well bias setup step, the ground voltage applied to the pocket P-well area is cut off to make the second well area attain a floating state. Under such a condition, the pocket P-well area is biased with a coupling voltage, which is lower than the ground voltage, through a coupling capacitance between the pocket P-well area and a common source line, or a coupling capacitance between the pocket P-well area and an N-well area. In the program step, a program voltage is supplied to selected wordlines and a pass voltage is supplied to unselected wordlines, with the floating second well area biased with the coupling voltage. Therefore, the pocket P-well area is biased with a negative voltage through the capacitance coupling.
Abstract:
Two pairs of pyroelectric devices are each mounted on a cone-shaped substrate to precisely control their alignment. Each cone-shaped substrate is a part of a sensor module which also supports an attenuator, along with a transistor and a resistor chip associated with each pyroelectric device of the pair. The sensor module is provided with a silicon filter through which infrared radiation is transmitted to the pair of pyroelectric devices. Each module is mounted in an inner space formed by two hemispherical lenses which serve to direct light to the module. Two such hemispherical lens-sensor modules are provided in a precise optical arrangement designed to operate in conjunction with associated circuitry in order to detect infrared radiation from any of six distinguishable zones. Applications of such a device include for example cameras and air conditioning systems.
Abstract:
An object detector for an air conditioner has a signal detection input unit in which a light block is provided between a pair of Fresnel lenses spaced in parallel by a predetermined distance on a printed circuit board, thereby defining substantially three detection areas. The signal detection input unit detects the number, locations and movement distance of persons present indoor from a received signal, and outputs a signal representative of the information. Then, a command for the operation of an air conditioner is issued according to the information signal, thereby enabling the optimum operation of the air conditioner under circumstances.
Abstract:
A method and a circuit for repairing defect by substituting a redundant memory cell for a defective memory cell in the semiconductor memory device. The circuit comprises charging nodes connected parallel to a number of electrical fuses; a device for outputting a storage signal of a defective address in response to an external control signal; a device for providing current to the charging node in response to the storage signal of the defective address; a redundant sense amplifier for outputting a redundant block driving signal to substitute a defective address in response to a logic level of the charging node; and a controller for decoding an address signal provided from the outside of the memory device so that a current path is formed in a selected fuse and the fuse is blew by current provided from the charging node, the controller being activated by the storage signal of the defective address.
Abstract:
A light emitting structure includes a first hole injection layer, a first organic light emitting layer, a charge generation layer, a second hole injection layer, a second organic light emitting layer, an electron transfer layer, and a blocking member. The light emitting structure has first, second, and third sub-pixel regions. The first organic light emitting layer may be on the first hole injection layer. The charge generation layer may be on the first organic light emitting layer. The second hole injection layer may be on the charge generation layer. The second organic light emitting layer may be on the second hole injection layer. The electron transfer layer may be on the second organic light emitting layer. The blocking member may be at at least one of the first to the third sub-pixel regions.
Abstract:
The present invention relates to an organic light emitting device including a substrate, an insulating layer disposed on the substrate, a first electrode disposed on the insulating layer, an organic light emitting member disposed on the first electrode, and a second electrode disposed on the organic light emitting member. The insulating layer includes a furrow corresponding to at least one edge of the first electrode, and at least a portion of the second electrode is disposed in the furrow.
Abstract:
In a method of testing an object, a first test pattern for testing a first device in the object may be set in a tester. A second test pattern for testing a second device in the object may be set in a test head electrically connected between the tester and the object. The first test pattern may be provided to the first device through the test head and the second test pattern may be provided to the second device by the test head to simultaneously test the first device and the second device. Thus, the first device and the second device different from each other may be simultaneously tested without changing test conditions in the tester, so that a time for testing the object may be reduced.
Abstract:
A method of fabricating a semiconductor device includes preparing a semiconductor wafer having a top surface and a bottom surface. The semiconductor wafer is loaded onto a wafer chuck, and the bottom surface of the loaded semiconductor wafer faces the wafer chuck. A groove is formed in the top surface of the loaded semiconductor wafer by irradiating a second laser onto the top surface, and a reforming region is formed in the loaded semiconductor wafer under the groove by irradiating a first laser through wafer chuck and bottom surface of the semiconductor wafer into a region in which the first laser is focused. The semiconductor wafer is unloaded from the wafer chuck. The bottom surface of the semiconductor wafer is ground to decrease a thickness of the semiconductor wafer. The semiconductor wafer is separated along the groove and the reforming region, thereby forming a plurality of unit chips.