摘要:
The present invention provides a method of forming a semiconductor device having a metal gate. A substrate is provided and a gate dielectric and a work function metal layer are formed thereon, wherein the work function metal layer is on the gate dielectric layer. Then, a top barrier layer is formed on the work function metal layer. The step of forming the top barrier layer includes increasing a concentration of a boundary protection material in the top barrier layer. Lastly, a metal layer is formed on the top barrier layer. The present invention further provides a semiconductor device having a metal gate.
摘要:
A distributive cache accessing device for accelerating to boot remote diskless computers mounted in a diskless computer equipped with WAN-bootable hardware, such as an iSCSI host bus adapter (HBA), allows to access data required to boot the diskless computers or run application programs thereon from an iSCSI target or other diskless computers having the distributive cache accessing device via a network. The retrieved iSCSI data blocks are temporarily stored in the local distributive cache accessing device. If any other diskless computer requests for the iSCSI data blocks, the temporarily stored iSCSI data blocks can be accessible to the diskless computer. Given installation of large number of diskless computers, the network traffic of the iSCSI target is alleviated and booting remote diskless computer is accelerated.
摘要:
Failure and repair information collected during self-testing of arrays in an integrated circuit is stored in a centralized array in the integrated circuit. In that way, a centralized array can be read out to provide failure and repair information on the arrays in the integrated circuit rather than having to read from each array. In addition, the failure and repair information may also be stored in the array under test for certain of the arrays.
摘要:
An input device model testing system is provided for testing an input device model that is placed on a working plane. The input device model testing system includes image pickup devices for capturing the input device model and the working plane, a microphone for receiving the clicking sound of the input device model, a computer screen for displaying the working plane image, and a computer host. The computer host includes a model image analyzing program and a working plane image analyzing program. The working plane image and the model image are respectively analyzed by the model image analyzing program and the working plane image analyzing program, so that associated user input instructions are executed.
摘要:
In general, in one aspect, the disclosure describes a method to detect a transaction and direct non transactional memory (TM) user functions within the transaction. The non TM user functions are treated as TM functions and added to the TM list.
摘要:
The present invention provides a 3D visual intelligent simulation monitoring system and a simulation display method thereof, comprising a plurality of monitoring devices and at least one central control device. The monitoring devices capture video screens and generate a plurality of image signals to the central control device. A signal receiving unit of the central control device receives the image signals of the monitoring devices and transmits to an operational simulation unit, and the operational simulation unit operates the image signals with a location data and a geographic data incorporatively and generates at least one 3D simulation image. Thereby monitoring personnel can directly monitor with the 3D simulation image of the central control device, thus achieving comprehensive viewing and perfect monitoring, and functions of responding and manipulating at the first instant through the central control device.
摘要:
A mechanism is described for facilitating using of a shared local memory for register spilling/filling relating to graphics processors at computing devices. A method of embodiments, as described herein, includes reserving one or more spaces of a shared local memory (SLM) to perform one or more of spilling and filling relating to registers associated with a graphics processor of a computing device.
摘要:
This invention provides an image capturing lens system comprising three non-cemented lens elements with refractive power: a first lens element with positive refractive power having a convex object-side surface, and both the object-side and image-side surfaces being aspheric; a plastic second lens element with negative refractive power having a concave object-side surface and a convex image-side surface, and both the object-side and image-side surfaces being aspheric; and a plastic third lens element having a convex object-side surface and a concave image-side surface, and both the object-side and image-side surfaces being aspheric. By such arrangement, the space of the image capturing lens system can be allocated much more properly and thereby an image capturing lens system with shorter total track length can be obtained while retaining superior image quality.
摘要:
A method for filling a trench with a metal layer is disclosed. A deposition apparatus having a plurality of supporting pins is provided. A substrate and a dielectric layer disposed thereon are provided. The dielectric layer has a trench. A first deposition process is performed immediately after the substrate is placed on the supporting pins to form a metal layer in the trench, wherein during the first deposition process a temperature of the substrate is gradually increased to reach a predetermined temperature. When the temperature of the substrate reaches the predetermined temperature, a second deposition process is performed to completely fill the trench with the metal layer. The present invention further provides a semiconductor device having an aluminum layer with a reflectivity greater than 1, wherein the semiconductor device is formed by using the method.
摘要:
A method of reducing manufacturing defects of semiconductor wafers during a back-grinding process. The method includes receiving a semiconductor wafer on a chuck table, wherein said chuck table has a surface upon which a front side of the wafer is placed, and wherein said chuck table has one or more holes in surface and one or more sensors placed in said one or more holes. The method further includes grinding at least a portion of a back side of the semiconductor wafer. The method further includes monitoring a parameter, while grinding, measured by the one or more sensors and adjusting the grinding based at least on the monitored parameter.