Cassette for storing a plurality of electronic component chips
    51.
    发明授权
    Cassette for storing a plurality of electronic component chips 失效
    用于存储多个电子部件芯片的盒

    公开(公告)号:US4889229A

    公开(公告)日:1989-12-26

    申请号:US184112

    申请日:1988-04-20

    摘要: A cassette for storing a plurality of electronic component chips employed for providing the plurality of electronic component chips to an apparatus for supplying electronic component chips comprises a plurality of electronic component chips; a case for storing the plurality of electronic component chips, which is provided with first and second outer wall surfaces adjacently intersecting with each other and an outlet formed in the first outer wall surface, the case also being for discharging the electronic component chips; and an openable closure for closing the outlet. The closure is formed by a flexible plate. The case has a guide portion for slidably guiding the closure over a portion along the first outer wall surface, and a portion along the second outer wall surface. The closure is guided by the guide portion to open and close the outlet, while one end portion thereof is positioned along the second outer wall surface whether the outlet is opened or closed. Such end portion of the closure is provided with a slidable opening/closing operation member, which is exposed on the second outer wall surface.

    Electrodeposition coating composition
    52.
    发明授权
    Electrodeposition coating composition 失效
    电沉积涂料组合物

    公开(公告)号:US4869796A

    公开(公告)日:1989-09-26

    申请号:US81782

    申请日:1987-08-05

    IPC分类号: C09D5/44

    CPC分类号: C09D5/448 Y10S524/901

    摘要: An electrodeposition coating composition comprising (a) a water-dispersible, electrically depositable binder resin and (b) water-insoluble, internally crosslinked polymer microparticles having a particle size from 0.01 to 2 microns, said polymer microparticles bearing on their surfaces physically adhered or covalently bound thereto an amphoionic group of the formula: ##STR1## wherein R represents an unsubstituted or substituted C.sub.1 -C.sub.6 alkylene or phenylene, A is --COOH or --SO.sub.3 H.

    摘要翻译: 一种电沉积涂料组合物,其包含(a)水分散性可电沉积的粘合剂树脂和(b)具有0.01至2微米粒度的水不溶性内部交联的聚合物微粒,所述聚合物微粒在其表面上物理粘附或共价 其结合式为:其中R表示未取代或取代的C 1 -C 6亚烷基或亚苯基,A为-COOH或-SO 3 H。

    Agent for treatment or prevention of diseases associated with activity of neurotrophic factors
    56.
    发明授权
    Agent for treatment or prevention of diseases associated with activity of neurotrophic factors 有权
    用于治疗或预防与神经营养因子活性相关的疾病的药剂

    公开(公告)号:US08829035B2

    公开(公告)日:2014-09-09

    申请号:US13322888

    申请日:2010-05-28

    摘要: A compound depicted by the formula below, or a pharmaceutically acceptable salt or solvate thereof. wherein, R1 represents (1) a C3-6 alkyl group, (2) a C1-6 alkyl group substituted with one or more substituent group(s) selected from those consisting a halogen atom, etc., (3) a C3-10 non-aromatic cyclic hydrocarbon group or a 5- to 6-membered non-aromatic heterocyclic group which respectively is optionally substituted with one or more substituent group(s) selected from those consisting an oxo group, etc., (4) an aromatic cyclic hydrocarbon group substituted with one or more substituent selected from the group consisting halogen atom and C1-4 alkoxy group; X represents NH, O, or S; Y represents CH or N; Z represents N or a C—R2; R2 represents (1) hydrogen atom, (2) a C1-6 alkyl group, a C2-6 alkenyl group or a C2-6 alkynyl group that respectively is optionally substituted with one or more substituent group(s) selected from among those consisting (a) a halogen atom, etc., or (3) a C5-6 non-aromatic cyclic hydrocarbon group or a 5- to 6-membered non-aromatic heterocyclic group optionally substituted; ring A represents a benzene ring optionally substituted; ring B represents a benzene ring optionally substituted.

    摘要翻译: 由下式表示的化合物或其药学上可接受的盐或溶剂化物。 其中,R1表示(1)C3-6烷基,(2)被选自卤原子等的一个或多个取代基取代的C 1-6烷基,(3)C3- 10个非芳族环状烃基或5〜6元非芳族杂环基,其分别任选被一个或多个选自氧代基等的取代基取代,(4)芳族 被一个或多个选自卤素原子和C 1-4烷氧基的取代基取代的环状烃基; X表示NH,O或S; Y表示CH或N; Z表示N或C-R2; R2表示(1)氢原子,(2)分别被一个或多个选自以下的取代基取代的C 1-6烷基,C 2-6烯基或C 2-6炔基: (a)卤素原子等,或(3)任选取代的C5-6非芳香族环状烃基或5〜6元非芳香族杂环基; 环A表示任选取代的苯环; 环B表示任选取代的苯环。

    Transport apparatus and recording apparatus
    58.
    发明授权
    Transport apparatus and recording apparatus 有权
    运输装置和记录装置

    公开(公告)号:US08596779B2

    公开(公告)日:2013-12-03

    申请号:US13042037

    申请日:2011-03-07

    IPC分类号: B41J2/01 B65G13/02 B65G13/00

    CPC分类号: B41J13/076 B41J13/02

    摘要: Provided is a transport apparatus including: a transport roller which is formed in a cylindrical shape such that a pair of facing end portions of a metal sheet is close to each other or abuts on each other, which has a joint provided with a spot welding portion, and in which a high friction layer is formed on a surface thereof to transport a recording medium; and a support portion which supports a portion deviated from the high friction layer of the transport roller so that the transport roller rotates in the circumferential direction.

    摘要翻译: 提供一种输送装置,包括:输送辊,其形成为圆筒状,使得金属板的一对相对端部彼此靠近或彼此靠接,所述接合件设置有点焊部 并且其表面上形成高摩擦层以输送记录介质; 以及支撑部,其支撑偏离输送辊的高摩擦层的部分,使得输送辊沿圆周方向旋转。

    Semiconductor module having semiconductor device mounted on device mounting substrate

    公开(公告)号:US08242598B2

    公开(公告)日:2012-08-14

    申请号:US12696410

    申请日:2010-01-29

    IPC分类号: H01L23/48

    摘要: A semiconductor module includes: an insulating resin layer; a wiring layer which is provided on one main surface of the insulating resin layer and which includes an external connection region; bump electrodes which are electrically connected to the wiring layer and each of which is formed such that it protrudes from the wiring layer toward the insulating resin layer; a semiconductor device which is provided on the other main surface of the insulating resin layer and which includes device electrodes connected to the bump electrode; and a wiring protection layer provided on the wiring layer and the insulating resin layer so as to expose the external connection region. In the semiconductor module, the outer edge portion of the wiring protection layer is in contact with the external edge portion of the semiconductor device such that it shields at least a part of the semiconductor resin layer at the side edge.