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    COMPOSITION FOR FORMING ORGANIC HARD MASK LAYER FOR USE IN LITHOGRAPHY CONTAINING POLYMER HAVING ACRYLAMIDE STRUCTURE
    3.
    发明申请
    COMPOSITION FOR FORMING ORGANIC HARD MASK LAYER FOR USE IN LITHOGRAPHY CONTAINING POLYMER HAVING ACRYLAMIDE STRUCTURE 有权
    用于形成含有丙烯酰胺结构的聚合物的地层的有机硬掩模层的组合物

    公开(公告)号：US20140106570A1

    公开(公告)日：2014-04-17

    申请号：US14116157

    申请日：2012-05-18

    申请人： Yasunobu Someya ,  Yuki Usui ,  Masakazu Kato ,  Tetsuya Shinjo ,  Keisuke Hashimoto ,  Ryo Karasawa

    发明人： Yasunobu Someya ,  Yuki Usui ,  Masakazu Kato ,  Tetsuya Shinjo ,  Keisuke Hashimoto ,  Ryo Karasawa

    IPC分类号： H01L21/308

    CPC分类号： H01L21/3081 ,  G03F7/091 ,  G03F7/094

    摘要： Whereas, conventionally, ashing had been used at the time of removal, the present invention provides a material for forming an organic hard mask that can be removed by an alkaline aqueous solution, and thus can be expected to reduce damage to the substrate at the time of the removal. A composition for forming an organic hard mask layer comprising: a polymer (A) including a structural unit of Formula (1) and a structural unit of Formula (2); a crosslinkable compound (B) including at least two of blocked isocyanate groups, methylol groups, or C1-5 alkoxymethyl groups; and a solvent (C), wherein an organic hard mask layer obtained from the composition for forming an organic hard mask layer is used at the lowest layer in a lithography process using a multi-layer film, wherein R1 to R4 have the same definition as ones in the specification.

    摘要翻译： 通常，在去除时使用灰化，本发明提供了一种用于形成可由碱性水溶液除去的有机硬掩模的材料，因此可以预期在此时减少对基材的损伤 的删除。 一种形成有机硬掩模层的组合物，包括：包含式（1）的结构单元和式（2）的结构单元的聚合物（A） 包含至少两个封端异氰酸酯基团，羟甲基或C 1-5烷氧基甲基的交联性化合物（B） 和溶剂（C），其中在使用多层膜的光刻工艺中，在最下层使用由用于形成有机硬掩模层的组合物获得的有机硬掩模层，其中R1至R4具有与 在规范中。

    PHOTOSENSITIVE ORGANIC PARTICLES
    4.
    发明申请
    PHOTOSENSITIVE ORGANIC PARTICLES 有权
    光敏有机颗粒

    公开(公告)号：US20140045119A1

    公开(公告)日：2014-02-13

    申请号：US14111021

    申请日：2012-04-11

    申请人： Takahiro Kishioka ,  Makiko Umezaki ,  Shigeo Kimura ,  Hirokazu Nishimaki ,  Tomoya Ohashi ,  Yuki Usui

    发明人： Takahiro Kishioka ,  Makiko Umezaki ,  Shigeo Kimura ,  Hirokazu Nishimaki ,  Tomoya Ohashi ,  Yuki Usui

    IPC分类号： G03F7/004 ,  G03F7/20

    CPC分类号： G03F7/20 ,  C08F220/20 ,  C08F220/30 ,  C08F220/54 ,  C08F220/56 ,  C08F220/58 ,  G03F7/004 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0048 ,  G03F7/038 ,  G03F7/0382 ,  G03F7/0388 ,  G03F7/32

    摘要： A material forms a pattern by applying a photosensitive composition to a base material and drying to form a photosensitive coating and performing exposure and development, and a method for forming the pattern. A photosensitive composition includes water-soluble organic particles, and a solvent, wherein the solvent is a poor solvent for the water-soluble organic particles. Preferably, the water-soluble organic particles of the photosensitive composition includes a polymer which contains a unit structure (A) for forming organic particles, a unit structure (B) for forming interparticle crosslinkage, and a unit structure (C) for imparting dispersibility, and the photosensitive composition further includes a photoacid generator. In addition, the water-soluble organic particles of the photosensitive composition includes a polymer which contains the unit structure (A) for forming organic particles, the unit structure (B) for forming interparticle crosslinkage, the unit structure (C) for imparting dispersibility, and a unit structure (D) having a photoacid generating group.

    摘要翻译： 材料通过将光敏组合物施加到基材上并干燥以形成感光涂层并进行曝光和显影，形成图案，以及形成图案的方法。 光敏组合物包括水溶性有机颗粒和溶剂，其中溶剂是水溶性有机颗粒的不良溶剂。 优选地，感光性组合物的水溶性有机颗粒包括含有形成有机颗粒的单元结构（A），用于形成颗粒间交联的单元结构（B）和赋予分散性的单元结构（C））的聚合物， 并且光敏组合物还包括光致酸产生剂。 另外，感光性组合物的水溶性有机粒子包含含有形成有机粒子的单元结构（A），用于形成粒子间交联的单元结构（B），赋予分散性的单位结构（C） 和具有光酸产生基团的单元结构（D）。

    COMPRESSED FIBER STRUCTURAL MATERIAL AND METHOD FOR PRODUCING THE SAME
    6.
    发明申请
    COMPRESSED FIBER STRUCTURAL MATERIAL AND METHOD FOR PRODUCING THE SAME 有权
    压缩纤维结构材料及其制造方法

    公开(公告)号：US20140336779A1

    公开(公告)日：2014-11-13

    申请号：US14345668

    申请日：2012-03-09

    申请人： Noboru Nakayama ,  Masaomi Horita ,  Naoki Izawa ,  Hiroto Tamai ,  Naoto Saito ,  Yuki Usui ,  Nobuhide Ogihara

    发明人： Noboru Nakayama ,  Masaomi Horita ,  Naoki Izawa ,  Hiroto Tamai ,  Naoto Saito ,  Yuki Usui ,  Nobuhide Ogihara

    IPC分类号： A61F2/28

    CPC分类号： A61F2/28 ,  A61F2002/2835 ,  A61F2310/00023 ,  A61F2310/00425 ,  A61L27/04 ,  B22F3/002 ,  C22C49/11 ,  C22F1/183

    摘要： Provided is a method for easily producing a lamellar compressed fiber structural material which has mechanical characteristics close to those of in vivo bone and which is capable of easily increasing osteoblast even when a difference in strength exists. In order to solve the issues, the method for producing compressed fiber structural material 1, includes: a step of preparing biocompatible fiber 14 having an average diameter of 5 μm-50 μm and an aspect ratio of 20-500; and a step of molding compressed fiber structural material 1 by cold pressing/shearing biocompatible fiber 14, compressed fiber structural material 1 having an average pore diameter that is in the range of 60 μm-100 μm inclusive and a void fraction that is in the range of 25%-50% inclusive, both obtained by measurement in accordance with the mercury penetration method. Further, it is preferable for the cold pressing/shearing is performed by controlling a compressive pressure in the range of 200 MPa-2000 MPa, a shearing stroke length in the range of 0.2 mm-5 mm and a shearing velocity in the range of 0.5 mm/min-5 mm/min.

    摘要翻译： 本发明提供一种容易制造层状压缩纤维结构材料的方法，其具有接近体内骨的机械特性，并且即使存在强度差也能够容易地增加成骨细胞。 为了解决这些问题，制造压缩纤维结构材料1的方法包括：制备平均直径为5μm〜50μm，长径比为20-500的生物相容性纤维14的工序; 以及通过冷压/剪切生物相容性纤维14成型压缩纤维结构材料1的步骤，平均孔径在60μm-100μm范围内的压缩纤维结构材料1和在该范围内的空隙率 为25％-50％，均为根据汞渗透法测量得到的。 此外，优选通过将压缩压力控制在200MPa〜2000MPa，剪切行程长度在0.2mm-5mm范围内，剪切速度在0.5的范围内进行冷压/剪切 mm / min-5mm / min。

    MONOLAYER OR MULTILAYER FORMING COMPOSITION
    7.
    发明申请
    MONOLAYER OR MULTILAYER FORMING COMPOSITION 有权
    单层或多层成型组合物

    公开(公告)号：US20130216956A1

    公开(公告)日：2013-08-22

    申请号：US13879125

    申请日：2011-10-07

    申请人： Takahiro Kishioka ,  Daisuke Sakuma ,  Shigeo Kimura ,  Hirokazu Nishimaki ,  Tomoya Ohashi ,  Yuki Usui

    发明人： Takahiro Kishioka ,  Daisuke Sakuma ,  Shigeo Kimura ,  Hirokazu Nishimaki ,  Tomoya Ohashi ,  Yuki Usui

    IPC分类号： G03F7/075 ,  G03F7/20

    CPC分类号： G03F7/0752 ,  C07F7/1804 ,  C08G77/28 ,  C09D183/08 ,  G03F7/0751 ,  G03F7/165 ,  G03F7/20 ,  G03F7/30

    摘要： There is provided a composition for forming a monolayer or a multilayer on the substrate. A composition for forming a monolayer or a multilayer containing a silane compound of Formula (1A) or Formula (1B): [where R1s are independently a methyl group or an ethyl group; Xs are independently a C1-10 linking group; and Zs are independently a C1-10 alkyl group or a phenyl group optionally having a substituent, where X optionally contains at least one oxygen atom or sulfur atom in the main chain thereof, and when Z is an alkyl group, at least one hydrogen atom of the alkyl group is optionally substituted with a fluorine atom] and an organic solvent.

    摘要翻译： 提供了在基材上形成单层或多层的组合物。 用于形成单层的组合物或含有式（1A）或式（1B）的硅烷化合物的多层：[其中R 1独立地是甲基或乙基; X独立地为C1-10连接基团; 并且Z独立地为C1-10烷基或任选具有取代基的苯基，其中X任选地在其主链中含有至少一个氧原子或硫原子，当Z为烷基时，至少一个氢原子 的烷基任选被氟原子取代]和有机溶剂。

    PHOTOSENSITIVE RESIST UNDERLAYER FILM FORMING COMPOSITION
    8.
    发明申请
    PHOTOSENSITIVE RESIST UNDERLAYER FILM FORMING COMPOSITION 有权
    光敏电阻膜形成组合物

    公开(公告)号：US20110311915A1

    公开(公告)日：2011-12-22

    申请号：US12817648

    申请日：2010-06-17

    申请人： Shigeo Kimura ,  Hirokazu Nishimaki ,  Tomoya Ohashi ,  Yuki Usui ,  Takahiro Kishioka

    发明人： Shigeo Kimura ,  Hirokazu Nishimaki ,  Tomoya Ohashi ,  Yuki Usui ,  Takahiro Kishioka

    IPC分类号： G03F7/004 ,  G03F7/20

    CPC分类号： G03F7/0046 ,  G03F7/0045 ,  G03F7/0392 ,  G03F7/091 ,  G03F7/095

    摘要： A resist underlayer film forming composition used in a lithography process includes: a polymer (A) containing a unit structure having a hydroxy group, a unit structure having a carboxy group, or combination thereof; a crosslinkable compound (B) having at least two vinyl ether groups; a photoacid generator (C); a C4-20 fluoroalkylcarboxylic acid or a salt of the fluoroalkylcarboxylic acid (D); and a solvent (E). The polymer (A) includes a unit structure selected from unit structures of Formula (1), Formula (2), and Formula (3);

    摘要翻译： 在光刻工艺中使用的抗蚀剂下层膜成膜组合物包括：含有具有羟基的单元结构的聚合物（A），具有羧基的单元结构或其组合; 具有至少两个乙烯基醚基团的交联性化合物（B） 光致酸发生器（C）; C4-20氟代烷基羧酸或氟烷基羧酸（D）的盐; 和溶剂（E）。 聚合物（A）包括选自式（1），式（2）和式（3）的单元结构的单元结构;