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    Devices with optical ports in fan-out configurations
    53.
    发明授权
    Devices with optical ports in fan-out configurations 有权

    公开(公告)号：US10120148B2

    公开(公告)日：2018-11-06

    申请号：US15340968

    申请日：2016-11-01

    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

    Inventor： Sagi Mathai ,  Michael Renne Ty Tan ,  Paul Kessler Rosenberg

    IPC: G02B6/12 ,  G02B6/42 ,  G02B6/34

    Abstract: Examples herein relate to devices with optical ports in fan-out configurations. An electrical device may have a substrate with an electrical port on a first face of the substrate and a plurality of optical ports on a second face of the substrate. The plurality of optical ports may be positioned in a fan-out configuration on the second face of the substrate. The electrical device may also have an integrated circuit with an electrical connection and a plurality of optical connections. A first face of the integrated circuit may be coupled to the substrate. The electrical connection of the integrated circuit may be communicatively coupled to the electrical port of the substrate, and the plurality of optical connections may be communicated coupled to the plurality of optical ports of the substrate.

    POLARIZATION DIVERSE RING RESONATOR RECEIVERS
    54.
    发明申请
    POLARIZATION DIVERSE RING RESONATOR RECEIVERS 审中-公开

    公开(公告)号：US20180275348A1

    公开(公告)日：2018-09-27

    申请号：US15781531

    申请日：2015-12-11

    Applicant: Hewlett Packard Enterprise Development LP

    Inventor： Joaquin Matres ,  Wayne Victor Sorin ,  Sagi Mathai ,  Lars Heige Thylen ,  Michael Renne Ty Tan ,  Marco Fiorentino

    IPC: G02B6/293 ,  H04B10/60

    Abstract: In the examples provided herein, a system includes a loop waveguide; and a grating coupler formed on the loop waveguide to couple light impinging on the grating coupler having a first polarization into the loop waveguide in a first direction, and to couple light having a second polarization, orthogonal to the first polarization, into the loop waveguide in a second direction. The system also includes a ring resonator positioned near the loop waveguide tuned to have a resonant wavelength at a first wavelength to couple light at the first wavelength out of the loop waveguide into the ring resonator. An output waveguide positioned near the ring resonator couples light out of the ring resonator into the output waveguide; and a photodetector detects light propagating out of a first end and a second end of the output waveguide.

    Interposer registration elements
    57.
    发明授权
    Interposer registration elements 有权

    公开(公告)号：US09921377B2

    公开(公告)日：2018-03-20

    申请号：US15325086

    申请日：2014-07-31

    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

    Inventor： Paul K Rosenberg ,  Sagi V Mathai ,  Michael Renne Ty Tan

    IPC: G02B6/36 ,  G02B6/42 ,  H01L23/00

    CPC classification number: G02B6/4228 ,  G02B6/3652 ,  G02B6/4231 ,  G02B6/4274 ,  H01L23/12 ,  H01L23/48 ,  H01L24/97

    Abstract: A substrate comprises multiple interposers. Each interposer includes interposer elements, where an optical device is coupled to at least some of the interposer elements; two passages formed through the interposer, where each passage is registered with respect to the interposer elements; two blind holes formed in a surface of the interposer, where each blind hole is concentric with a different passage; two annular troughs formed in the surface, each concentric with a different passage, and an annular area separates the annular troughs from an outer diameter of the corresponding concentric passage; and two spherical registration elements, where each registration element is positioned on uncured adhesive on one of the annular areas, where the passages enable a vacuum to be drawn through such that the registration elements are pulled toward the surface of the interposer to self-align to the inner diameter of the blind holes.

    Solder-aligned optical socket with interposer reference and methods of assembly thereof
    60.
    发明授权
    Solder-aligned optical socket with interposer reference and methods of assembly thereof 有权

    公开(公告)号：US11275222B2

    公开(公告)日：2022-03-15

    申请号：US16863610

    申请日：2020-04-30

    Applicant: Hewlett Packard Enterprise Development LP

    Inventor： Paul Kessler Rosenberg ,  Sagi Varghese Mathai ,  Kevin B. Leigh ,  Michael Renne Ty Tan

    IPC: H04B10/00 ,  G02B6/42

    Abstract: Optoelectronic systems and methods of assembly thereof are described herein according to the present disclosure. An example of an optoelectronic described herein includes a substrate and an interposer coupled to the substrate including one or more optical emitters and one or more photodetectors to be mounted thereto. The interposer is fabricated with one or more mechanical datums located on the interposer with respect to flip chip pads to position and couple the optical emitters and photodetectors to the interposer. The optoelectronic system also includes an optical connector and an optical socket that includes one or more mechanical datums corresponding to the mechanical datums of the interposer. The optical socket is configured to align the optical connector with the optical emitters and the photodetectors when the optical socket is coupled to the substrate and the optical connector is received within the optical socket. The mechanical datums of the optical socket contact respective mechanical datums of the interposer when the optical socket is coupled to the substrate.

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