公开(公告)号：US5927256A

公开(公告)日：1999-07-27

申请号：US893302

申请日：1997-07-15

申请人： Koji Morita ,  Takayuki Demura

发明人： Koji Morita ,  Takayuki Demura

IPC分类号： F02M25/07

CPC分类号： F02M26/57 ,  F02M26/14

摘要： A flow control device comprising an EGR control valve arranged in an EGR passage. The pressure control chamber of the EGR control valve is connected to a pressure control valve in a conduit, and a volume chamber is arranged in the conduit. The vibration of the valve body and the diaphragm of the EGR valve is prevented by the reflecting wave of the pressure wave which is produced in the pressure control chamber due to such vibrations.

摘要翻译： 一种流量控制装置，包括配置在EGR通路内的EGR控制阀。 EGR控制阀的压力控制室连接到管道中的压力控制阀，并且容积室布置在管道中。 由于这种振动，压力控制室产生的压力波的反射波阻止了阀体和EGR阀的振动膜的振动。

公开(公告)号：US4692951A

公开(公告)日：1987-09-15

申请号：US791155

申请日：1985-10-24

申请人： Masaru Taki ,  Hiroshi Okada ,  Seijiro Kawamura ,  Akio Kusumoto ,  Koji Morita ,  Takao Ikenaga ,  Toshifumi Shigematsu ,  Masami Iida

发明人： Masaru Taki ,  Hiroshi Okada ,  Seijiro Kawamura ,  Akio Kusumoto ,  Koji Morita ,  Takao Ikenaga ,  Toshifumi Shigematsu ,  Masami Iida

IPC分类号： E03D5/10 ,  E03D9/00 ,  E03D9/052 ,  E03D9/08 ,  A47K4/00 ,  E03D9/04

CPC分类号： E03D9/002 ,  E03D5/10 ,  E03D9/052 ,  E03D9/08 ,  E03D2201/30

摘要： This invention relates to a sanitary facility room to be installed in a computer room or a clean room found in a manufacturing factory for a semiconductor element wherein the water supplying means is operated by a control part received a sensed signal from the sensing means by a sensing operation of the sensing means for a human body, a cleaning water is supplied to the sanitary device to form water films at the inner surface of the sanitary device and to perform an automatic cleaning of the sanitary device.

摘要翻译： 本发明涉及一种将安装在计算机室或洁净室中的卫生设施室，该制造厂位于半导体元件制造厂，其中，供水装置由控制部分操作，通过感测从感测装置接收感测信号 操作用于人体的感测装置，清洁水​​被供应到卫生设备，以在卫生设备的内表面上形成水膜并且执行卫生设备的自动清洁。

公开(公告)号：US09078365B2

公开(公告)日：2015-07-07

申请号：US12298168

申请日：2007-04-26

申请人： Koji Morita ,  Shin Takanezawa ,  Kazunaga Sakai ,  Yuusuke Kondou

发明人： Koji Morita ,  Shin Takanezawa ,  Kazunaga Sakai ,  Yuusuke Kondou

IPC分类号： C08L71/12 ,  C08G59/26 ,  H05K1/03 ,  C08J5/24

CPC分类号： H05K1/0326 ,  C08G59/26 ,  C08J5/24 ,  H05K2201/068 ,  Y10T442/20

摘要： Disclosed is a resin composition which is advantageous not only in that the resin composition can be produced at low cost, but also in that it is unlikely to thermally expand, and a prepreg, a laminate, and a wiring board formed using the resin composition. The resin composition comprises an insulating resin having an aromatic ring, wherein the insulating resin having an aromatic ring has a molecular weight between crosslinking sites of 300 to 1,000 on the stage after the production of the laminate, as determined from an elastic shear modulus of the insulating resin measured at a temperature of Tg or higher.

摘要翻译： 公开了一种树脂组合物，不仅有利于以低成本生产树脂组合物，而且不利于热膨胀，而且可以使用树脂组合物形成预浸料，层压体和布线板。 该树脂组合物包括具有芳环的绝缘树脂，其中具有芳环的绝缘树脂在层合体制备之后的台上的交联点之间的分子量为300至1,000，由弹性剪切模量 在Tg或更高的温度下测量的绝缘树脂。

公开(公告)号：US08642694B2

公开(公告)日：2014-02-04

申请号：US12713569

申请日：2010-02-26

申请人： Koji Morita ,  Hirofumi Yamashita ,  Hitomi Ohara ,  Shiro Kobayashi ,  Masahiko Ishii

发明人： Koji Morita ,  Hirofumi Yamashita ,  Hitomi Ohara ,  Shiro Kobayashi ,  Masahiko Ishii

IPC分类号： C08L67/04 ,  C08G63/08 ,  C08G63/02 ,  C08G63/06

CPC分类号： C08L67/04 ,  C08F220/06 ,  C08F220/14 ,  C08F220/18 ,  C08F2220/1825 ,  C08F2220/281 ,  C08L33/066 ,  C08L33/068 ,  C08L2666/04 ,  C08L2666/02

摘要： There are provided: a bio-based coating composition which is a bio-based ingredient coating composition in consideration of environment and does not need any expensive ingredient and is also excellent in hydrolysis resistance; and an article coated with the coating composition. The bio-based coating composition is characterized by comprising the following film-forming ingredients: a lactic acid polymer (A) which contains a polyfunctional compound having a hydroxyl group and/or a carboxyl group in a functionality of not less than 3 and lactic acid as essential monomer ingredients and has a specific SP value; and a resin (B) which contains a hydroxyl group and/or a carboxyl group and has a specific SP value; wherein the difference (ΔSP) between the SP values of the lactic acid polymer (A) and the resin (B) is in the range of 0.2 to 4.0. The coated article is characterized by being obtained by being coated with the aforementioned coating composition.

摘要翻译： 提供：生物基涂料组合物，考虑到环境是生物基成分涂料组合物，不需要任何昂贵的成分，并且耐水解性也优异; 和涂覆有涂料组合物的制品。 生物基涂料组合物的特征在于包含以下成膜成分：含有官能度不低于3的具有羟基和/或羧基的多官能化合物的乳酸聚合物（A）和乳酸 作为必需单体成分，具有特定的SP值; 和含有羟基和/或羧基并具有特定SP值的树脂（B）; 其中，乳酸聚合物（A）和树脂（B）的SP值之差（DeltaSP）在0.2〜4.0的范围内。 涂层制品的特征在于通过涂覆上述涂料组合物获得。

公开(公告)号：US20130226436A1

公开(公告)日：2013-08-29

申请号：US13260003

申请日：2010-11-17

申请人： Koji Morita

发明人： Koji Morita

IPC分类号： F02D41/02

CPC分类号： F02D41/0235 ,  F02D19/084 ,  F02D19/087 ,  F02D19/088 ,  F02D41/1454 ,  F02D41/1473 ,  F02D41/182 ,  F02D41/187 ,  F02D2041/147 ,  Y02T10/36

摘要： When alcohol mixing fuel is supplied to an internal combustion engine, an intake air flow rate is detected and a basic amplitude amount α of an upstream target air-fuel ratio abyfr corresponding to this detected intake air flow rate is calculated. Next, alcohol concentration in the fuel (in more detail, ethanol concentration Cetha) and a cooling water temperature (or an intake air temperature) are detected, hydrogen concentration Ch in a mixing exhaust gas is calculated based on the detected ethanol concentration Cetha and the detected cooling water temperature (or the detected intake air temperature) amplitude gain β corresponding to the calculated hydrogen concentration is calculated and finally, an amplitude amount (α×β) of the upstream target air-fuel ratio is calculated.

摘要翻译： 当将混合燃料的燃料供应到内燃机时，检测进气流量，并且计算与该检测到的进气流量相对应的上游目标空燃比abyfr的基本振幅量α。 接下来，检测燃料中的酒精浓度（更详细地，乙醇浓度Cetha）和冷却水温度（或进气温度），基于检测到的乙醇浓度Cetha计算混合排气中的氢浓度Ch 计算与计算出的氢浓度相对应的检测到的冷却水温度（或检测到的进气温度）振幅增益β，最后计算上游目标空燃比的振幅量（α×β）。

公开(公告)号：US08374377B2

公开(公告)日：2013-02-12

申请号：US12764207

申请日：2010-04-21

申请人： Mamoru Yamaguchi ,  Koji Morita

发明人： Mamoru Yamaguchi ,  Koji Morita

IPC分类号： H04R1/02 ,  H04R1/00 ,  H04R11/02

CPC分类号： H04R1/025 ,  B60R11/0217 ,  H04R2499/13

摘要： A speaker apparatus in accordance with the present invention is for use with a vehicle having a compartment and is to be mounted to the vehicle. The speaker apparatus includes: an interior member including a hole edge that defines an attachment hole; a speaker unit configured to be placed in the attachment hole, the speaker unit including a limiting member; and a speaker grille configured to be attached in the attachment hole from an inside of the compartment, the speaker grille including a claw-fixing portion that is bendable and is configured to be engaged with the hole edge. Accompanying the engagement of the claw-fixing portion with the hole edge, the speaker grille is fixed to the interior member. Accompanying the placement of the speaker unit in the attachment hole, the limiting member is positioned in a bending space for the claw-fixing portion and thereby prevents disengagement of the claw-fixing portion from the hole edge.

摘要翻译： 根据本发明的扬声器装置用于具有隔间的车辆并且将被安装到车辆上。 扬声器装置包括：内部构件，其包括限定附接孔的孔边缘; 配置成放置在所述安装孔中的扬声器单元，所述扬声器单元包括限制构件; 以及扬声器格栅，其构造成从所述隔间的内部附接在所述安装孔中，所述扬声器格栅包括可弯曲并被配置为与所述孔边缘接合的爪固定部。 伴随着爪固定部与孔边缘的接合，扬声器格栅固定在内部构件上。 伴随着扬声器单元在安装孔中的放置，限位构件位于用于爪固定部的弯曲空间中，从而防止爪固定部从孔边缘脱离。

公开(公告)号：US20100071271A1

公开(公告)日：2010-03-25

申请号：US12443545

申请日：2007-10-19

申请人： Shinji Soma ,  Koji Morita ,  Tomohiro Inagaki ,  Takayuki Moroto ,  Kazuhiko Sugita ,  Tomoyasu Imai ,  Yasuji Kunihiro

发明人： Shinji Soma ,  Koji Morita ,  Tomohiro Inagaki ,  Takayuki Moroto ,  Kazuhiko Sugita ,  Tomoyasu Imai ,  Yasuji Kunihiro

IPC分类号： B24D18/00 ,  B24D5/06 ,  B24D5/10

CPC分类号： B24D3/14 ,  B24D5/06 ,  B24D5/10 ,  B24D18/0009 ,  B24D99/005

摘要： A grinding wheel is manufactured such that (a) any one of particles for an abrasive grain layer and particles for a substrate layer are put into the press-mold die, and other particles are put onto the particles in the press-mold die, and then the substrate layer and the abrasive grain layer are integrally press-molded to form a non-baked grinding chip with an arcuate shape; (b) depressions are formed on the abrasive grain layer of the non-baked grinding chip; (c) the grinding chip on which the depressions are formed is baked; and (d) the plurality of baked-grinding chips are adhered to a core of the grinding wheel.

摘要翻译： 制造砂轮，使得（a）将用于磨粒层的颗粒和用于基材层的颗粒中的任一种放入压模模具中，并将其它颗粒放在压模模中的颗粒上， 然后将基材层和磨粒层整体加压成型，形成具有弓形形状的非烘烤研磨片; （b）在非烘烤研磨片的磨粒层上形成凹部; （c）烘烤形成凹部的研磨片; 和（d）多个烘烤磨碎片粘附到砂轮的芯部。

公开(公告)号：US07273043B2

公开(公告)日：2007-09-25

申请号：US11715972

申请日：2007-03-09

申请人： Shigeo Okubo ,  Zenichiro Mashiki ,  Nobuyuki Shibagaki ,  Hiroyuki Nomura ,  Yoshiyuki Shogenji ,  Kenichi Kinose ,  Takuji Matsubara ,  Yusuke Nakayama ,  Yukihiro Sonoda ,  Koji Morita

发明人： Shigeo Okubo ,  Zenichiro Mashiki ,  Nobuyuki Shibagaki ,  Hiroyuki Nomura ,  Yoshiyuki Shogenji ,  Kenichi Kinose ,  Takuji Matsubara ,  Yusuke Nakayama ,  Yukihiro Sonoda ,  Koji Morita

IPC分类号： F02M33/04 ,  F02M33/02

CPC分类号： F02D41/0042 ,  F02D41/3023 ,  F02D41/3094 ,  F02M63/029 ,  F02M69/046

摘要： When an injection sharing ratio r is neither 0 nor 1, an engine ECU executes a program including a step of calculating a purge reduction amount of an in-cylinder injector as fpg×r and calculating a purge reduction amount of an intake manifold injector as fpg×(1−r) when performing purge processing according to a current fuel injection sharing ratio of the injectors, and a step of calculating a correction fuel injection amount of the in-cylinder injector by raising the fuel injection amount to a minimum fuel injection amount, and calculating a correction fuel injection amount of the intake manifold injector by subtracting the raised amount from the fuel injection amount of the intake manifold injector when the fuel injection amount of the in-cylinder injector calculated by using the purge reduction amount is lower than the minimum injection amount.

摘要翻译： 当喷射共享比r既不是0也不是1时，发动机ECU执行包括将缸内喷射器的吹扫减少量计算为fpgxr并计算进气歧管喷射器的吹扫减少量的步骤的程序，如fpgx（1 -r），以及根据喷射器的当前燃料喷射分配比进行吹扫处理的步骤，以及通过将燃料喷射量上升到最小燃料喷射量来计算缸内喷射器的校正燃料喷射量的步骤，并且计算 当通过使用吹扫减少量计算的缸内喷油器的燃料喷射量低于最小喷射量时，通过从进气歧管喷油器的燃料喷射量中减去上升量的进气歧管喷射器的校正燃料喷射量 。

公开(公告)号：US07075036B2

公开(公告)日：2006-07-11

申请号：US10479960

申请日：2002-06-07

申请人： Shinichi Ogimoto ,  Koji Morita

发明人： Shinichi Ogimoto ,  Koji Morita

IPC分类号： H01L21/603

CPC分类号： B23K20/023 ,  B23K2101/40 ,  B23K2101/42

摘要： An electronic part compression bonding apparatus includes a compression bonding unit which bonds the electronic parts onto the substrate by thermocompression, a pressure supply unit, a pressure control unit which controls pressure, a heating unit which heats the compression bonding unit, a temperature control unit, and a thermocompression bonding control unit which controls the pressure control unit and the heating unit based on thermocompression bonding condition data in which at least one of pressure and heating temperature is variably set during a process from start until completion of a thermocompression bonding operation of the electronic parts. In the thermocompression bonding condition data, the pressure is set to a first pressure in a first stage in a process of the thermocompression bonding operation and a second pressure, which is lower than the first pressure, in a second stage that follows the first stage.

摘要翻译： 电子部件压接装置包括通过热压将电子部件接合到基板上的压接单元，压力供给单元，控制压力的压力控制单元，加压压接单元的加热单元，温度控制单元， 以及热压接合控制单元，其基于热压接条件数据来控制压力控制单元和加热单元，其中在从电子器件的热压接操作的开始到完成的处理期间可变地设置压力和加热温度中的至少一个 部分。 在热压接条件数据中，在第一阶段的第二阶段中，在热压接操作的过程中的第一阶段将压力设定为第一压力，而在第一阶段之后的第二阶段将压力设定为低于第一压力的第二压力。

公开(公告)号：US20050255270A1

公开(公告)日：2005-11-17

申请号：US11165345

申请日：2005-06-24

申请人： Shin Takanezawa ,  Koji Morita ,  Takako Watanabe ,  Toshihisa Kumakura ,  Hiroyuki Fukai ,  Hiroaki Fujita

发明人： Shin Takanezawa ,  Koji Morita ,  Takako Watanabe ,  Toshihisa Kumakura ,  Hiroyuki Fukai ,  Hiroaki Fujita

IPC分类号： B32B27/38 ,  C08G59/62 ,  C08K5/53 ,  C08L63/04 ,  H05K1/00 ,  H05K3/46 ,  B65D1/00

CPC分类号： H05K3/4676 ,  H05K3/4644 ,  H05K2201/0209 ,  H05K2201/0212 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T428/1376 ,  Y10T428/236 ,  Y10T428/24157 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/2839 ,  Y10T428/287 ,  Y10T428/2887 ,  Y10T428/31511 ,  Y10T428/31515

摘要： Directed to an insulating resin composition which comprises (A) a novolak epoxy resin having a biphenyl structure, (B) carboxylic acid-modified acrylonitrile butadiene rubber particles, (C) a triazine ring-containing cresol novolak phenolic resin, (D) a phenolic hydroxyl group-containing phosphorus compound, and (E) inorganic filler, an insulating film having a support using the same, a multilayer wiring board, and a process for producing a multilayer wiring board.