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公开(公告)号:US20060208091A1
公开(公告)日:2006-09-21
申请号:US10550559
申请日:2004-09-24
申请人: Hirotaka Nishizawa , Kenji Osawa , Hideo Koike , Junichiro Osako , Tamaki Wada
发明人: Hirotaka Nishizawa , Kenji Osawa , Hideo Koike , Junichiro Osako , Tamaki Wada
IPC分类号: G06K19/06
CPC分类号: G06F13/4081 , G06K19/077 , G06K19/07732
摘要: A semiconductor device includes external interface terminals and processing circuits, and it is fed with an operating power source when detachably set in a host equipment. Power source feeding terminals (VCC, VSS) among the external interface terminals are long enough to keep touching the corresponding terminals of the host equipment for, at least, a predetermined time period since the separation of an extraction detecting terminal among the external interface terminals, from the corresponding terminal of the host equipment, and they are formed to be longer in the extraction direction of the semiconductor device than the extraction detecting terminal. These power source feeding terminals are a power source terminal and a ground terminal, and any power source compensating capacitor is not connected between the power source terminal and the ground terminal. Since a time period required till the cutoff of the power source can be easily ensured, a capacitor for compensating the operating power source at the power source cutoff which occurs midway of an operation is not necessitated.
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公开(公告)号:US20060033191A1
公开(公告)日:2006-02-16
申请号:US11203969
申请日:2005-08-16
申请人: Tamaki Wada , Hirotaka Nishizawa , Masachika Masuda , Kenji Osawa , Junichiro Osako , Satoshi Hatakeyama , Haruji Ishihara , Kazuo Yoshizaki , Kazunori Furusawa
发明人: Tamaki Wada , Hirotaka Nishizawa , Masachika Masuda , Kenji Osawa , Junichiro Osako , Satoshi Hatakeyama , Haruji Ishihara , Kazuo Yoshizaki , Kazunori Furusawa
IPC分类号: H01L23/02
CPC分类号: G06K19/077 , G06K19/07732 , G06K19/07737 , G06K19/07739 , G06K19/07743 , G11C5/04 , H01L23/5388 , H01L24/45 , H01L24/48 , H01L24/97 , H01L25/18 , H01L2224/05554 , H01L2224/05599 , H01L2224/45144 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/10161 , H01L2924/14 , H01L2924/181 , H05K5/026 , H05K5/0282 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要: On an adapter mounting portion 3a having a projecting cross section which is formed on a cap 3 of a small-sized memory card 1, a recessed portion of an adapter 2 side is fitted so that both parts are formed as an integral unit in a replaceable manner. Accordingly, the small-sized memory card 1 can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card 1 can be used also in equipment which is designed to cope with the existing memory cards.
摘要翻译: 在具有形成在小型存储卡1的盖3上的突出横截面的适配器安装部分3a上,适配器2侧的凹部装配成两个部分作为整体单元形成在 可更换的方式。 因此,小型存储卡1可以保持与现有存储卡的尺寸兼容性,由此小尺寸存储卡1也可以用于被设计为处理现有存储卡的设备中。
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公开(公告)号:US20050280131A1
公开(公告)日:2005-12-22
申请号:US11204047
申请日:2005-08-16
申请人: Tamaki Wada , Hirotaka Nishizawa , Masachika Masuda , Kenji Osawa , Junichiro Osako , Satoshi Hatakeyama , Haruji Ishihara , Kazuo Yoshizaki , Kazunori Furusawa
发明人: Tamaki Wada , Hirotaka Nishizawa , Masachika Masuda , Kenji Osawa , Junichiro Osako , Satoshi Hatakeyama , Haruji Ishihara , Kazuo Yoshizaki , Kazunori Furusawa
IPC分类号: G06K19/077 , G11C5/00 , H01L23/02 , H05K5/02 , H05K7/02 , H05K7/06 , H05K7/08 , H05K7/10 , H05K7/12
CPC分类号: G06K19/077 , G06K19/07732 , G06K19/07737 , G06K19/07739 , G06K19/07743 , G11C5/04 , H01L23/5388 , H01L24/45 , H01L24/48 , H01L24/97 , H01L25/18 , H01L2224/05554 , H01L2224/05599 , H01L2224/45144 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/10161 , H01L2924/14 , H01L2924/181 , H05K5/026 , H05K5/0282 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要: On an adapter mounting portion 3a having a projecting cross section which is formed on a cap 3 of a small-sized memory card 1, a recessed portion of an adapter 2 side is fitted so that both parts are formed as an integral unit in a replaceable manner. Accordingly, the small-sized memory card 1 can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card 1 can be used also in equipment which is designed to cope with the existing memory cards.
摘要翻译: 在具有形成在小型存储卡1的盖3上的突出横截面的适配器安装部分3a上,适配器2侧的凹部装配成两个部分作为整体单元形成在 可更换的方式。 因此,小型存储卡1可以保持与现有存储卡的尺寸兼容性,由此小型存储卡1也可以用于被设计为处理现有存储卡的设备中。
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公开(公告)号:US20070150633A1
公开(公告)日:2007-06-28
申请号:US11681046
申请日:2007-03-01
CPC分类号: G06K19/07732 , G06K19/0719 , G06K19/07733 , G06K19/07741 , G06K19/07743 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H05K1/0268 , H05K1/117 , H01L2924/00014 , H01L2924/00
摘要: An IC card and card adapters are designed so that the IC card of a specific standard (e.g., MMC standard) is compatible with IC cards and terminals of other standards (e.g., MS card standard and USB terminal standard). In the IC card (MMC), a controller IC, which is connected to a flash memory, includes a voltage pull-down detector, a mode controller, a USB-mode interface controller, a MS-mode interface controller, and an MMC/SD-mode interface controller. The card adapters suffice to have component parts which are easy in formation and low in cost such as wiring lines and resistors. The voltage pull-down detector of the IC card detects the voltage pull-down caused by the resistors, and the mode controller selects the USB-mode interface controller, MS-mode interface controller or MMC/SD-mode interface controller so that the IC card becomes compatible with the corresponding IC card standard.
摘要翻译: IC卡和卡适配器被设计成使得特定标准(例如,MMC标准)的IC卡与IC卡和其他标准的终端(例如,MS卡标准和USB终端标准)兼容。 在IC卡(MMC)中,连接到闪速存储器的控制器IC包括电压下拉检测器,模式控制器,USB模式接口控制器,MS模式接口控制器和MMC / SD模式接口控制器。 卡适配器足以具有易于形成的部件,成本低廉,例如布线和电阻器。 IC卡的电压下拉检测器检测由电阻引起的电压下拉,模式控制器选择USB模式接口控制器,MS模式接口控制器或MMC / SD模式接口控制器,使IC 卡与相应的IC卡标准兼容。
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公开(公告)号:US20060220202A1
公开(公告)日:2006-10-05
申请号:US11423755
申请日:2006-06-13
IPC分类号: H01L23/02
CPC分类号: H05K3/284 , B29C45/14647 , B29C45/14655 , B29C45/1657 , B29C45/1671 , B29C2045/1673 , H01L21/563 , H01L21/565 , H01L23/3121 , H01L23/3135 , H01L23/49855 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2924/01014 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H05K1/117 , H05K2201/10159 , H05K2203/1316 , H05K2203/1572 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an external connection terminal at a back surface thereof; a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via a interconnect; and the sealing portion made of thermosetting resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. The present invention makes it possible to heighten the strength of IC cards and at the same time, to reduce the manufacturing cost and improve the reliability.
摘要翻译: 将IC体装载到由热固性树脂材料制成的壳体2上,并用由热固性树脂材料制成的密封部分密封,从而制造IC卡。 IC体包括:在其背面形成有外部连接端子的布线基板; 半导体芯片,其负载在所述布线基板的表面上,并且经由互连电连接到所述外部连接端子; 以及由热固性树脂材料制成的密封部分以覆盖半导体芯片和接合线。 密封部形成为使外部连接端子露出。 本发明可以提高IC卡的强度,同时降低制造成本,提高可靠性。
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公开(公告)号:US07615855B2
公开(公告)日:2009-11-10
申请号:US12116190
申请日:2008-05-06
CPC分类号: H05K3/284 , B29C45/14647 , B29C45/14655 , B29C45/1657 , B29C45/1671 , B29C2045/1673 , H01L21/563 , H01L21/565 , H01L23/3121 , H01L23/3135 , H01L23/49855 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2924/01014 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H05K1/117 , H05K2201/10159 , H05K2203/1316 , H05K2203/1572 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an external connection terminal at a back surface thereof; a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via a interconnect; and the sealing portion made of thermosetting resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. The present invention makes it possible to heighten the strength of IC cards and at the same time, to reduce the manufacturing cost and improve the reliability.
摘要翻译: 将IC体装载到由热固性树脂材料制成的壳体2上,并用由热固性树脂材料制成的密封部分密封,从而制造IC卡。 IC体包括:在其背面形成有外部连接端子的布线基板; 半导体芯片,其负载在所述布线基板的表面上,并且经由互连电连接到所述外部连接端子; 以及由热固性树脂材料制成的密封部分以覆盖半导体芯片和接合线。 密封部形成为使外部连接端子露出。 本发明可以提高IC卡的强度,同时降低制造成本,提高可靠性。
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公开(公告)号:US20060054711A1
公开(公告)日:2006-03-16
申请号:US11264010
申请日:2005-11-02
IPC分类号: G06K19/06
CPC分类号: H05K3/284 , B29C45/14647 , B29C45/14655 , B29C45/1657 , B29C45/1671 , B29C2045/1673 , H01L21/563 , H01L21/565 , H01L23/3121 , H01L23/3135 , H01L23/49855 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2924/01014 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H05K1/117 , H05K2201/10159 , H05K2203/1316 , H05K2203/1572 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an external connection terminal at a back surface thereof; a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via a interconnect; and the sealing portion made of thermosetting resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. The present invention makes it possible to heighten the strength of IC cards and at the same time, to reduce the manufacturing cost and improve the reliability.
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公开(公告)号:US07382045B2
公开(公告)日:2008-06-03
申请号:US11423755
申请日:2006-06-13
CPC分类号: H05K3/284 , B29C45/14647 , B29C45/14655 , B29C45/1657 , B29C45/1671 , B29C2045/1673 , H01L21/563 , H01L21/565 , H01L23/3121 , H01L23/3135 , H01L23/49855 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2924/01014 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H05K1/117 , H05K2201/10159 , H05K2203/1316 , H05K2203/1572 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an external connection terminal at a back surface thereof; a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via a interconnect; and the sealing portion made of thermosetting resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. The present invention makes it possible to heighten the strength of IC cards and at the same time, to reduce the manufacturing cost and improve the reliability.
摘要翻译: 将IC体装载到由热固性树脂材料制成的壳体2上并用由热固性树脂材料制成的密封部分密封以一体化,由此制造IC卡。 IC体包括:在其背面形成有外部连接端子的布线基板; 半导体芯片,其负载在所述布线基板的表面上,并且经由互连电连接到所述外部连接端子; 以及由热固性树脂材料制成的密封部分以覆盖半导体芯片和接合线。 密封部形成为使外部连接端子露出。 本发明可以提高IC卡的强度,同时降低制造成本,提高可靠性。
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公开(公告)号:US06988668B2
公开(公告)日:2006-01-24
申请号:US10668229
申请日:2003-09-24
CPC分类号: H05K3/284 , B29C45/14647 , B29C45/14655 , B29C45/1657 , B29C45/1671 , B29C2045/1673 , H01L21/563 , H01L21/565 , H01L23/3121 , H01L23/3135 , H01L23/49855 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2924/01014 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H05K1/117 , H05K2201/10159 , H05K2203/1316 , H05K2203/1572 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: An IC body is loaded on a case made of a thermoplastic resin material and sealed to the case with a sealing portion made of thermoplastic resin material, whereby an IC card is manufactured. The IC body includes a wiring substrate formed with an external connection terminal at a back surface thereof, a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via an interconnect, and a sealing portion made of thermoplastic resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. Thus, making it possible to increase the strength of IC cards and, at the same time, to reduce the manufacturing cost and improve the reliability.
摘要翻译: 将IC体装载在由热塑性树脂材料制成的壳体上,并用由热塑性树脂材料制成的密封部分密封到壳体上,由此制造IC卡。 IC体包括在其背面形成有外部连接端子的布线基板,负载在布线基板的表面上并通过布线电连接到外部连接端子的半导体芯片,以及由热塑性树脂制成的密封部 材料,以覆盖半导体芯片和接合线。 密封部形成为使外部连接端子露出。 因此,能够提高IC卡的强度,同时降低制造成本,提高可靠性。
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公开(公告)号:US07823793B2
公开(公告)日:2010-11-02
申请号:US12261993
申请日:2008-10-30
IPC分类号: G06K19/06
CPC分类号: G06K19/07732 , G06K19/0719 , G06K19/07733 , G06K19/07741 , G06K19/07743 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H05K1/0268 , H05K1/117 , H01L2924/00014 , H01L2924/00
摘要: An IC card and card adapters are designed so that the IC card of a specific standard (e.g., MMC standard) is compatible with IC cards and terminals of other standards (e.g., MS card standard and USB terminal standard). In the IC card (MMC), a controller IC, which is connected to a flash memory, includes a voltage pull-down detector, a mode controller, a USB-mode interface controller, a MS-mode interface controller, and an MMC/SD-mode interface controller. The card adapters suffice to have component parts which are easy in formation and low in cost such as wiring lines and resistors. The voltage pull-down detector of the IC card detects the voltage pull-down caused by the resistors, and the mode controller selects the USB-mode interface controller, MS-mode interface controller or MMC/SD-mode interface controller so that the IC card becomes compatible with the corresponding IC card standard.
摘要翻译: IC卡和卡适配器被设计成使得特定标准(例如,MMC标准)的IC卡与IC卡和其他标准的终端(例如,MS卡标准和USB终端标准)兼容。 在IC卡(MMC)中,连接到闪速存储器的控制器IC包括电压下拉检测器,模式控制器,USB模式接口控制器,MS模式接口控制器和MMC / SD模式接口控制器。 卡适配器足以具有易于形成的部件,成本低廉,例如布线和电阻器。 IC卡的电压下拉检测器检测由电阻引起的电压下拉,模式控制器选择USB模式接口控制器,MS模式接口控制器或MMC / SD模式接口控制器,使IC 卡与相应的IC卡标准兼容。
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