公开(公告)号：US10410949B2

公开(公告)日：2019-09-10

申请号：US15709493

申请日：2017-09-20

Applicant: Infineon Technologies AG ,  HYUNDAI Motor Company ,  Kia Motor Corporation

Inventor： Andreas Grassmann ,  Juergen Hoegerl ,  Kiyoung Jang ,  Ivan Nikitin

IPC: H01L23/495 ,  H01L23/367 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/373 ,  H01L23/433 ,  H01L23/00 ,  H01L25/18

Abstract: A package comprising at least one electronic chip, a first heat removal body thermally coupled to a first main surface of the at least one electronic chip and configured for removing thermal energy from the at least one electronic chip, an encapsulant encapsulating at least part of the at least one electronic chip, and part of the first heat removal body, wherein at least part of a surface of the first heat removal body is roughened.

公开(公告)号：US10373890B1

公开(公告)日：2019-08-06

申请号：US15948747

申请日：2018-04-09

Applicant: Infineon Technologies AG

Inventor： Juergen Hoegerl ,  Andreas Grassmann

IPC: H01L23/31 ,  H01L23/373 ,  H01L23/473 ,  H01L23/367 ,  H01L23/495 ,  H02M1/08

Abstract: In some examples, a device includes a high-side switch, a first high-side conductive element electrically connected to a first load terminal of the high-side switch, and a second high-side conductive element electrically connected to a second load terminal of the high-side switch. The device also includes a layer of cooling material encapsulating the high-side switch, the first high-side conductive element, and the second high-side conductive element. The device further includes a low-side switch, a first low-side conductive element electrically connected to a first load terminal of the low-side switch, and a second low-side conductive element electrically connected to a second load terminal of the low-side switch. The layer of cooling material encapsulates the low-side switch, the first low-side conductive element, and the second low-side conductive element.

公开(公告)号：US20190157192A1

公开(公告)日：2019-05-23

申请号：US16238973

申请日：2019-01-03

Applicant: Infineon Technologies AG

Inventor： Andreas Grassmann ,  Juergen Hoegerl ,  Angela Kessler ,  Ivan Nikitin

IPC: H01L23/495 ,  H01L23/373 ,  H01L21/48 ,  H01L23/00

Abstract: A package comprising at least one electronic chip, a first heat removal body on which the at least one electronic chip is mounted by a first interconnection, a second heat removal body mounted on or above the at least one electronic chip by a second interconnection, and an encapsulant encapsulating at least part of the at least one electronic chip, part of the first heat removal body and part of the second heat removal body, wherein the first interconnection is configured to have another melting temperature than the second interconnection.

公开(公告)号：US10128165B2

公开(公告)日：2018-11-13

申请号：US15796771

申请日：2017-10-28

Applicant: Infineon Technologies AG

Inventor： Wolfram Hable ,  Andreas Grassmann ,  Juergen Hoegerl ,  Eduard Knauer ,  Michael Ledutke

IPC: H01L23/28 ,  H01L23/367 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/373 ,  H01L23/498 ,  H01L23/00 ,  H01L25/07 ,  H01L25/18 ,  H01L25/00 ,  B60L11/18 ,  H02M7/00

Abstract: A package comprising at least one electronic chip, an encapsulant encapsulating at least part of the at least one electronic chip, a first electrically conductive contact structure extending partially within and partially outside of the encapsulant and being electrically coupled with at least one first terminal of at least one of the at least one electronic chip, and a second electrically conductive contact structure extending partially within and partially outside of the encapsulant and being electrically coupled with at least one second terminal of at least one of the at least one electronic chip, wherein at least a portion of the first electrically conductive contact structure and at least a portion of the second electrically conductive contact structure within the encapsulant are spaced in a direction between two opposing main surfaces of the package.

公开(公告)号：US09721863B2

公开(公告)日：2017-08-01

申请号：US15082387

申请日：2016-03-28

Applicant: Infineon Technologies AG

Inventor： Andreas Grassmann ,  Juergen Hoegerl

IPC: H01L25/00 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498

CPC classification number: H01L23/3114 ,  H01L23/3121 ,  H01L23/49517 ,  H01L23/49562 ,  H01L23/49844

Abstract: An electronic module includes a circuit board, having a carrier layer, the carrier layer having a plurality of recess areas in a main surface thereof, and a plurality of electronic sub-modules, each one of the sub-modules being disposed in one of the recess areas and each one of the sub-modules having a carrier, a semiconductor chip disposed on the carrier, and an encapsulation material disposed on the carrier and on the semiconductor chip.

公开(公告)号：US20170096066A1

公开(公告)日：2017-04-06

申请号：US15246047

申请日：2016-08-24

Applicant: Hyundai Motor Company ,  Kia Motors Corporation ,  Infineon Technologies AG

Inventor： Hyun-Koo Lee ,  Andreas Grassmann

IPC: B60L1/02 ,  B60K6/20 ,  H02M7/44 ,  H05K7/20 ,  B60L11/18 ,  B60L11/02

CPC classification number: B60L1/02 ,  B60K6/20 ,  B60L50/61 ,  B60L2240/525 ,  B60Y2200/92 ,  H01L2224/33 ,  H02M7/44 ,  H05K7/209 ,  Y02T10/6217 ,  Y02T10/7077 ,  Y10S903/903

Abstract: A hybrid vehicle including a hybrid power control unit (HPCU) is provided. The HPCU includes a power module having chips disposed therein, each of which generates heat during operation, a coolers that cools the heat from the power module. Additionally chip soldering interface material (SIM)s that bond the chips and the power module are provided to form interior solder layers. Further, a cooler Soldering Interface Material (SIM)s bonds the power module and the coolers to form an exterior solder layers. Consequently, improvements in cooling performance and a reduction in cost are achieved, without a variation in applied thickness and a pump-out phenomenon caused when using a TIM having low thermal conductivity.

公开(公告)号：US09275926B2

公开(公告)日：2016-03-01

申请号：US13886284

申请日：2013-05-03

Applicant: Infineon Technologies AG

Inventor： Wolfram Hable ,  Andreas Grassmann ,  Frank Winter ,  Ottmar Geitner ,  Alexander Schwarz ,  Alexander Herbrandt ,  Lothar Koenig ,  Andre Uhlemann

IPC: H01L23/34 ,  H01L21/50 ,  H01L23/00 ,  H01L23/373 ,  H01L23/433 ,  H01L23/467 ,  H01L23/473 ,  H01L25/07

CPC classification number: H01L23/34 ,  H01L21/50 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/467 ,  H01L23/473 ,  H01L24/33 ,  H01L24/36 ,  H01L24/40 ,  H01L25/072 ,  H01L2224/40137 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099 ,  H01L2224/37599

Abstract: According to an exemplary embodiment, a power module is provided which comprises a semiconductor chip, a bonding substrate comprising an electrically conductive sheet and an electric insulator sheet which is directly attached to the electrically conductive sheet and which is thermally coupled to the semiconductor chip, and an array of cooling structures directly attached to the electrically conductive sheet and configured for removing heat from the semiconductor chip when interacting with cooling fluid.

Abstract translation: 根据示例性实施例，提供了一种功率模块，其包括半导体芯片，包括导电片的接合衬底和直接附接到导电片并且热耦合到半导体芯片的电绝缘片，以及 直接连接到导电片的冷却结构的阵列，并被配置为当与冷却流体相互作用时从半导体芯片移除热量。

公开(公告)号：US20160014916A1

公开(公告)日：2016-01-14

申请号：US14795348

申请日：2015-07-09

Applicant: Infineon Technologies AG

Inventor： Udo Ausserlechner ,  Andreas Grassmann

IPC: H05K5/00 ,  H01L23/367 ,  G01R31/28 ,  H01L25/10 ,  H05K1/18 ,  H05K1/02 ,  H01L23/473

CPC classification number: H05K5/0065 ,  G01R19/0092 ,  G01R31/2644 ,  G01R31/2884 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/473 ,  H01L23/49811 ,  H01L23/62 ,  H01L25/07 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/49171 ,  H05K1/0203 ,  H05K1/0296 ,  H05K1/053 ,  H05K1/181 ,  H05K2201/10151 ,  H05K2201/10287 ,  H05K2201/10416 ,  H01L2924/00014

Abstract: A power semiconductor module includes a power electronics substrate having a first surface, a second surface opposite the first surface, a first longitudinal side, a second longitudinal side opposite the first longitudinal side, a module frame, which is arranged to enclose the power electronics substrate, at least one power terminal which is arranged at the first longitudinal side and extends through the module frame, a further terminal, which is arranged at the second longitudinal side and extends through the module frame, at least one power semiconductor component which is arranged on the first surface of the power electronics substrate and is electrically connected to at least one power terminal, and at least one current sensor which is designed to measure a current in a power terminal. The at least one current sensor is arranged on the power terminal and has a signal output connected to the further terminal.

Abstract translation: 功率半导体模块包括电力电子基板，其具有第一表面，与第一表面相对的第二表面，第一纵向侧，与第一纵向侧相对的第二纵向侧，模块框架，其布置成封闭电力电子基板 至少一个功率端子，其布置在第一纵向侧并延伸穿过模块框架;另一个端子，其布置在第二纵向侧并延伸穿过模块框架;至少一个功率半导体部件，其布置在 电力电子基板的第一表面，并且电连接到至少一个电源端子，以及设计成测量电力端子中的电流的至少一个电流传感器。 所述至少一个电流传感器布置在所述电源端子上，并且具有连接到所述另一端子的信号输出。