中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

57 records (took 0.029 seconds)

    Enclosure with inner tamper-respondent sensor(s) and physical security element(s)
    51.
    发明授权
    Enclosure with inner tamper-respondent sensor(s) and physical security element(s) 有权

    公开(公告)号：US09913416B2

    公开(公告)日：2018-03-06

    申请号：US14941872

    申请日：2015-11-16

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Michael J. Fisher ,  David C. Long ,  Michael T. Peets ,  Thomas Weiss

    IPC: H05K3/02 ,  H05K13/00 ,  H05K3/10

    CPC classification number: H05K13/00 ,  H05K3/10 ,  H05K5/0208

    Abstract: Methods of fabricating tamper-respondent assemblies are provided which include an electronic enclosure, a tamper-respondent electronic circuit structure, and at least one security element. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner surface. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure, and the at least one security element overlies and physically secures in place, at least in part, the tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure. In enhanced embodiments, the electronic enclosure is secured to a multilayer circuit board which includes an embedded tamper-respondent sensor, and together, the tamper-respondent sensor covering the inner surface of the electronic enclosure and the embedded tamper-respondent sensor within the multilayer circuit board define a secure volume about the electronic component(s).

    Tamper-respondent assemblies with enclosure-to-board protection
    55.
    发明授权
    Tamper-respondent assemblies with enclosure-to-board protection 有权
    防篡改组件具有外壳到板保护

    公开(公告)号：US09554477B1

    公开(公告)日：2017-01-24

    申请号：US14974036

    申请日：2015-12-18

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： William L. Brodsky ,  James A. Busby ,  Edward N. Cohen ,  Silvio Dragone ,  Michael J. Fisher ,  David C. Long ,  Michael T. Peets ,  William Santiago-Fernandez ,  Thomas Weiss

    IPC: G08B21/00 ,  H05K5/02 ,  H05K1/02 ,  H05K1/18

    CPC classification number: H05K1/0275 ,  G08B13/128 ,  H05K1/0216 ,  H05K1/112 ,  H05K1/181 ,  H05K3/22 ,  H05K5/0208 ,  H05K2201/10151 ,  H05K2201/10265 ,  H05K2201/10371

    Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.

    Abstract translation: 提供了防篡改组件和制造方法，其中包含电路板保护的外壳。 防篡改组件包括电路板和安装到电路板的电子外壳，并且便于将至少一个电子部件封闭在安全的容积内。 篡改答复电子电路结构有助于定义安全量，篡改受理电子电路结构包括篡改答复电路。 提供粘合剂以部分地将电子外壳固定到电路板。 粘合剂至少部分地接触篡改响应电路，使得电子外壳与电路板的尝试分离导致粘合剂破坏篡改响应电路，便于检测篡改的监视电路的分离 通讯电子电路结构。

    LIQUID COOLED COMPLIANT HEAT SINK AND RELATED METHOD
    57.
    发明申请
    LIQUID COOLED COMPLIANT HEAT SINK AND RELATED METHOD 审中-公开
    液体冷却合适的散热器及相关方法

    公开(公告)号：US20160064306A1

    公开(公告)日：2016-03-03

    申请号：US14936902

    申请日：2015-11-10

    Applicant: International Business Machines Corporation

    Inventor： Raschid J. Bezama ,  David C. Long ,  Govindarajan Natarajan ,  Thomas Weiss

    IPC: H01L23/473

    CPC classification number: H01L23/4735 ,  F28D15/00 ,  F28F13/00 ,  F28F2013/006 ,  H01L23/3733 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.

    Abstract translation: 本发明提供一种散热器及其使用方法，用于冷却集成电路（IC）芯片。 散热器包括歧管块，充满液体的冷却系统和固定到歧管块的柔性箔，并且由闭环冷却系统中的液体支撑。 由箔片后面的液体提供的压力导致箔片弯曲并符合IC芯片表面中的非平面性，从而减少了气隙并增加了IC芯片与散热片之间的热耦合。

Patent Agency Ranking