摘要:
A headgear holding apparatus including a base structure attached to a sewing machine such that the base structure is movable in a first direction, a rotatable structure supported by the base structure such that the rotatable structure is rotatable about a first axis line parallel to the first direction, a headgear holder which has a part-cylindrical outer surface for holding an inner surface of a headgear, the holder being detachably attached to the rotatable structure such that the part-cylindrical outer surface thereof is rotated when the rotatable structure is rotated, a headgear support member which is attached to the base structure, has a curved outer surface, and extends near a sewing position where a sewing needle of the sewing machine is reciprocated, the curved outer surface supporting the inner surface of the headgear when the holder is rotated, and two or more guide rollers attached to the base structure such that the rollers are provided on both sides of the headgear support member in a second direction perpendicular to the first direction, extend parallel to the first direction, and are rotatable about respective second axis lines parallel to the first axis line, the rollers being located at respective positions where an outer circumferential surface of a contact portion of each of the rollers contacts an inner surface of an intermediate annular portion of the headgear.
摘要:
A needle bar stopper is provided in a sewing machine having a main shaft and a needle bar which moves vertically upon reception of a driving force from the main shaft. The needle bar stopper comprises a transmission prohibiting unit, including a needle bar stopping solenoid, which prohibits transmission of the driving force from the main shaft to the needle bar and a braking unit, including a needle bar stopping solenoid, which applies a braking force to the needle bar when transmission of the driving force is prohibited by the transmission prohibiting unit. The needle bar stopper can stop the needle bar reliably by use of the braking unit.
摘要:
A thermosetting resin composition comprising (A) a thermosetting polyimide and (B) a bismaleimide and showing a modulus of elasticity of 10.sup.7 to 10.sup.2 dyne/cm.sup.2 during heat curing thereof is suitable for forming an adhesive film used in a thin film wiring board having excellent heat resistance and high reliability.
摘要翻译:包含(A)热固性聚酰亚胺和(B)双马来酰亚胺并且在其热固化期间显示出107至102达因/ cm 2的弹性模量的热固性树脂组合物适用于形成具有优异的薄膜布线板中使用的粘合剂膜 耐热性和高可靠性。
摘要:
A copper-based oxidation catalyst comprising a substrate of copper or copper alloy and regions of a metal composed mainly of a group VIII element in close contact with the substrate, the surface of the substrate being partly exposed to the outside, has a high catalytic activity on the carbonyl oxidation reaction and is effective as a catalyst for electroless plating, a fuel cell electrode material, a catalyst for treating waste water or waste liquor or an oxidation reaction catalyst.
摘要:
A process is provided for the formation of a conductive circuit pattern on a base metal formed on a substrate. On the base metal, a plating resist is first provided in a pattern corresponding to the circuit to be formed and a circuit pattern is then formed by plating. The plating resist is treated with a stripper and then with a stripping residue remover to cut off chemical bonds in the resist by a dehydrating decomposition reaction. The base metal is treated with an etchant for the base metal, whereby any resist residue still remaining after the treatment with the stripping residue remover is removed and the base metal are etched at areas which were covered by the plating resist.
摘要:
A process for producing a film carrier having a superior lead strength, which comprises removing from a film carrier body of a two-layer structure consisting of a metal conductor layer and an organic resin insulating layer snch as a polyimide resin layer, a definite portion of the organic resin insulating layer, or alternatively removing from a film carrier body of a three-layer structure consisting of a metal conductor layer, an organic resin insulating layer and an adhesive layer therebetween, definite portions of the organic resin insulating layer and the adhesive layer, by means of a cutting machine, to form an opening part, and also cutting a portion of the metal conductor layer under the opening part, to reduce the thickness of the metal conductor layer.
摘要:
The procedure of the present invention may be applied to mold a composite material having a predetermined configuration. The first step of the present procedure is to form the dimples of the core in accordance with a super-plasticizing molding procedure, so that the dimples may exhibit a height higher than that in its final configuration which corresponds with the above-described predetermined configuration, and its top surface is formed in a convexed configuration. Then, pressure is applied to the core to flatten it by forcibly deforming it prior to or at the moment of jointing the skins of the predetermined configuration, so that the dimples may come into contact with the internal surface of the skin at their top surfaces. Thereafter or simultaneously with this operation, the skins of the predetermined configuration are jointed. The composite material formed exhibits an increased operational reliability and an improved dimensional precision in its configuration, without causing the dimples top surface to be out of contact due to a design allowance.