公开(公告)号：US07304491B2

公开(公告)日：2007-12-04

申请号：US11516328

申请日：2006-09-06

Applicant: Warren M. Farnworth ,  Mark Tuttle

Inventor： Warren M. Farnworth ,  Mark Tuttle

IPC: G01R31/26

CPC classification number: G01R31/2886

Abstract: An interconnect for testing semiconductor components includes interconnect contacts configured for bonding to, and then separation from component contacts on the components. The interconnect can be utilized with a method that includes the steps of bonding the interconnect to the component to form bonded electrical connections, applying test signals through the bonded electrical connections, and then separating the interconnect from the component. The bonding step can be performed using metallurgical bonding, and the separating step can be performed using solder-wettable and solder non-wettable metal layers on the interconnect or the component. During the separating step the solder-wettable layers are dissolved, reducing adhesion of the bonded electrical connections, and permitting separation of the component and interconnect.

公开(公告)号：US20070127303A1

公开(公告)日：2007-06-07

申请号：US11626256

申请日：2007-01-23

Applicant: Mirmajid Seyyedy ,  Mark Tuttle ,  Glen Hush

Inventor： Mirmajid Seyyedy ,  Mark Tuttle ,  Glen Hush

IPC: G11C17/18

CPC classification number: H01L27/222 ,  G11C11/005 ,  G11C11/15 ,  G11C17/16 ,  G11C17/165 ,  H01L23/5252 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An MRAM device having a plurality of MRAM cells formed of a fixed magnetic layer, a second soft magnetic layer and a dielectric layer interposed between the fixed magnetic layer and the soft magnetic layer. The MRAM cells are all formed simultaneously and at least some of the MRAM cells are designed to function as antifuse devices whereby the application of a selected electrical potential can short the antifuse device to thereby affect the functionality of the MRAM device.

Abstract translation: 具有由固定磁性层形成的多个MRAM单元的MRAM器件，第二软磁性层和介于该固定磁性层与软磁性层之间的电介质层。 MRAM单元都是同时形成的，并且至少一些MRAM单元被设计为用作反熔丝器件，由此施加所选择的电位可以使反熔丝器件短路从而影响MRAM器件的功能。

公开(公告)号：US20070126459A1

公开(公告)日：2007-06-07

申请号：US11698678

申请日：2007-01-26

Applicant: Warren Farnworth ,  Mark Tuttle

Inventor： Warren Farnworth ,  Mark Tuttle

IPC: G01R31/26

CPC classification number: G01R31/2886

Abstract: A method for testing a semiconductor component includes the steps of bonding an interconnect to the component to form bonded electrical connections, applying test signals through the bonded electrical connections, and then separating the interconnect from the component. The bonding step can be performed using metallurgical bonding, and the separating step can be performed using solder-wettable and solder non-wettable metal layers on the interconnect or the component. During the separating step the solder-wettable layers are dissolved, reducing adhesion of the bonded electrical connections, and permitting separation of the component and interconnect. The interconnect includes interconnect contacts configured for bonding to, and then separation from component contacts on the components. A system includes the interconnect, an alignment system for aligning the substrate to the interconnect, a bonding system for bonding the component to the interconnect, and a heating system for heating the component and the interconnect for separation.

公开(公告)号：US20070007345A1

公开(公告)日：2007-01-11

申请号：US11519246

申请日：2006-09-11

Applicant: Mark Tuttle

Inventor： Mark Tuttle

IPC: G06K7/00

CPC classification number: G06K7/0008 ,  G06K19/07749 ,  G06K19/07771 ,  G06K19/07786

Abstract: The present invention provides electronic communication devices, methods of forming electrical communication devices, and communications methods. An electronic communication device adapted to receive electronic signals includes: a housing comprising a substrate and an encapsulant; an integrated circuit provided within the housing and comprising transponder circuitry operable to communicate an identification signal responsive to receiving a polling signal; an antenna provided within the housing and being coupled with the transponder circuitry; and a ground plane provided within the housing and being spaced from the antenna and configured to shield some of the electronic signals from the antenna and reflect others of the electronic signals towards the antenna. A method of forming an electronic signal communication device includes providing a substrate having a support surface; providing a conductive layer adjacent at least a portion of the support surface; providing a dielectric layer over the conductive layer; providing an antenna over the dielectric layer; coupling an integrated circuit with the antenna; and encapsulating the antenna, the dielectric layer, and the integrated circuit using a flowable encapsulant.

Abstract translation: 本发明提供电子通信设备，形成电通信设备的方法和通信方法。 适于接收电子信号的电子通信设备包括：壳体，包括衬底和密封剂; 设置在所述外壳内的集成电路，包括响应于接收到轮询信号而传送识别信号的应答器电路; 设置在壳体内并与应答器电路耦合的天线; 以及设置在壳体内并与天线间隔开并被配置为将一些电子信号与天线隔离并将其它电子信号反射向天线的接地平面。 一种形成电子信号通信装置的方法包括提供具有支撑表面的基板; 提供邻近所述支撑表面的至少一部分的导电层; 在所述导电层上提供介电层; 在电介质层上提供天线; 将集成电路与天线耦合; 并使用可流动的密封剂封装天线，电介质层和集成电路。

公开(公告)号：US20060168802A1

公开(公告)日：2006-08-03

申请号：US11334038

申请日：2006-01-17

Applicant: Mark Tuttle

Inventor： Mark Tuttle

IPC: H01R43/00 ,  G08B13/14 ,  G01R31/28 ,  H01Q17/00

CPC classification number: G06K19/0716 ,  G06K19/0723 ,  G06K19/07345 ,  G06K19/07749 ,  H01H2231/05 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q21/28 ,  Y10T29/49004 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49117

Abstract: A wireless identification device including a housing; circuitry in the housing configured to provide a signal to identify the device in response to an interrogation signal; and a selectively actuated switch supported by the housing and controlling whether the circuitry identifies the device. A method of manufacturing a wireless identification device, the method comprising configuring circuitry to provide a signal to identify the device in response to an interrogation signal; coupling the circuitry to a push-on/push-off switch supported by the housing and controlling whether the circuitry provides the signal to identify the device; and encasing the circuitry in a housing such that the switch is actuable from outside the housing by touching a portion of the housing.

Abstract translation: 一种无线识别装置，包括壳体; 外壳中的电路被配置为响应于询问信号提供信号以识别设备; 以及由壳体支撑的选择性致动的开关，并且控制电路是否识别该装置。 一种制造无线识别装置的方法，所述方法包括配置电路以响应于询问信号提供信号以识别所述装置; 将电路耦合到由壳体支持的推/推开关开关，并控制电路是否提供信号以识别装置; 并且将电路封装在壳体中，使得开关可以通过触摸壳体的一部分从壳体外部致动。

公开(公告)号：US06924168B2

公开(公告)日：2005-08-02

申请号：US10003116

申请日：2001-12-06

Applicant: Mark Tuttle

Inventor： Mark Tuttle

IPC: H01L23/552 ,  H01L23/58 ,  H05K1/02 ,  H01L21/00 ,  H05K1/14

CPC classification number: H05K1/0233 ,  H01L23/552 ,  H01L23/585 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01025 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/3025 ,  H01L2224/0401

Abstract: A method and apparatus which provide one or more electromagnetic shield layers for integrated circuit chips containing electromagnetic circuit elements are disclosed. The shield layers may be in contact with the integrated circuit chip, including magnetic memory structures such as MRAMs, or in a flip-chip carrier, or both. A printed circuit board which supports the chip may also have one or more shield layers.

Abstract translation: 公开了一种为包含电磁电路元件的集成电路芯片提供一个或多个电磁屏蔽层的方法和装置。 屏蔽层可以与集成电路芯片接触，包括诸如MRAM的磁存储器结构，或者在倒装芯片载体中，或者两者。 支撑芯片的印刷电路板也可以具有一个或多个屏蔽层。

公开(公告)号：US20050133118A1

公开(公告)日：2005-06-23

申请号：US11060794

申请日：2005-02-18

Applicant: Mark Tuttle ,  Ronald Weimer

Inventor： Mark Tuttle ,  Ronald Weimer

IPC: H01F41/30 ,  H01F1/00 ,  C21D1/04 ,  G11B5/33

CPC classification number: B82Y25/00 ,  B82Y40/00 ,  H01F1/0009 ,  H01F41/304

Abstract: A device for magnetically annealing magnetoresistive elements formed on wafers includes a heated chuck and a delivery mechanism for individually placing the wafers individually on the chuck one at a time. A coil is adjacent to the chuck and generates a magnetic field after the wafer is heated to a Néel temperature of an anti-ferromagnetic layer. A control system regulates the temperature of the heated chuck, the strength of the magnetic field, and a time period during which each chuck is heated to control the annealing process. The annealed elements are incorporated in the fabrication of magnetic memory devices.

Abstract translation: 用于磁性退火在晶片上形成的磁阻元件的装置包括加热的卡盘和用于将晶片单独地单独地放置在卡盘上的输送机构。 线圈与卡盘相邻，并且在将晶片加热到反铁磁层的Néel温度之后产生磁场。 控制系统调节加热卡盘的温度，磁场的强度以及加热每个卡盘以控制退火过程的时间段。 退火元件被结合在磁存储器件的制造中。

公开(公告)号：US20050110889A1

公开(公告)日：2005-05-26

申请号：US10723363

申请日：2003-11-26

Applicant: Mark Tuttle ,  William Hiatt

Inventor： Mark Tuttle ,  William Hiatt

IPC: H01L23/02 ,  H01L27/14 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/0232 ,  H04N5/225 ,  H04N5/335

CPC classification number: H01L27/14625 ,  B33Y80/00 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14687 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/48227 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A microelectronic imager comprising an imaging unit and an optics unit attached to the imaging unit, and methods for packaging microelectronic imagers. In one embodiment, the imaging unit can include (a) a microelectronic die with an image sensor and a plurality of external contacts electrically coupled to the image sensor and (b) a first referencing element fixed to the imaging unit. The optics unit can include an optic member and a second referencing element fixed to the optics unit. The second referencing element is seated with the first referencing element at a fixed, preset position in which the optic member is situated at a desired location relative to the image sensor.

Abstract translation: 一种包括成像单元和附接到成像单元的光学单元的微电子成像器，以及用于封装微电子成像器的方法。 在一个实施例中，成像单元可以包括（a）具有图像传感器和电耦合到图像传感器的多个外部触点的微电子管芯和（b）固定到成像单元的第一参考元件。 光学单元可以包括光学构件和固定到光学单元的第二参考元件。 第二参考元件与第一参考元件一起固定在固定的预设位置，在该位置，光学元件位于相对于图像传感器的期望位置处。

公开(公告)号：US06625040B1

公开(公告)日：2003-09-23

申请号：US09653558

申请日：2000-08-31

Applicant: Mark Tuttle

Inventor： Mark Tuttle

IPC: H05K900

CPC classification number: H05K1/0233 ,  G11C5/04 ,  G11C11/14

Abstract: A method and packaging device which provide a magnetically permeable shield for integrated circuits containing magnetic field sensitive circuit elements are disclosed. One or more magnetic shields are provided on, or embedded within, a printed circuit board and additional shielding elements are provided over the printed circuit board.

Abstract translation: 公开了一种为包含磁场敏感电路元件的集成电路提供导磁屏蔽的方法和封装装置。 一个或多个磁屏蔽设置在印刷电路板上或嵌入印刷电路板中，并且在印刷电路板上设置附加的屏蔽元件。

公开(公告)号：US4515906A

公开(公告)日：1985-05-07

申请号：US470371

申请日：1983-02-28

Applicant: Dwayne Friesen ,  Walter C. Babcock ,  Mark Tuttle

Inventor： Dwayne Friesen ,  Walter C. Babcock ,  Mark Tuttle

IPC: C08L101/00 ,  B01D69/02 ,  B01J41/00 ,  B01J45/00 ,  B01J47/00 ,  B01J47/12 ,  C08J5/20 ,  C08J5/22 ,  C08L1/00 ,  C08L27/00 ,  C08L33/00 ,  C08L33/02 ,  C08L67/00 ,  C08L77/00 ,  C08L81/06

CPC classification number: B01D69/141 ,  B01D67/0088 ,  B01J45/00 ,  B01J47/12 ,  C22B3/42 ,  B01D2325/022 ,  Y02P10/234

Abstract: Novel ion-exchange media are disclosed, the media comprising polymeric anisotropic microporous supports containing polymeric ion-exchange or ion-complexing materials. The supports are anisotropic, having small exterior pores and larger interior pores, and are preferably in the form of beads, fibers and sheets.

Abstract translation: 公开了新型离子交换介质，该介质包含含有聚合物离子交换或离子络合材料的聚合物各向异性微孔载体。 载体是各向异性的，具有小的外部孔和较大的内部孔，并且优选为珠粒，纤维和片材的形式。