公开(公告)号：US07388771B2

公开(公告)日：2008-06-17

申请号：US11552464

申请日：2006-10-24

申请人： ChiaHua Ho ,  Erh-Kun Lai ,  Kuang Yeu Hsieh

发明人： ChiaHua Ho ,  Erh-Kun Lai ,  Kuang Yeu Hsieh

IPC分类号： G11C11/00

CPC分类号： G11C17/165 ,  B82Y10/00 ,  G11C11/5664 ,  G11C11/5678 ,  G11C11/5685 ,  G11C13/0004 ,  G11C13/0007 ,  G11C13/0014 ,  G11C13/0016 ,  G11C13/0069 ,  G11C17/16 ,  G11C2213/31 ,  G11C2213/32 ,  G11C2213/77

摘要： A method is described for operating a bistable resistance random access memory having two memory layer stacks that are aligned in series is disclosed. The bistable resistance random access memory comprises two memory layer stacks per memory cell, the bistable resistance random access memory operates in four logic states, a logic “00” state, a logic “01” state, a logic “10” state and a logic “11” state. The relationship between the four different logic states can be represented mathematically by the two variables n and f and a resistance R. The logic “0” state is represented by a mathematical expression (1+f)R. The logic “1” state is represented by a mathematical expression (n+f)R. The logic “2” state is represented by a mathematical expression (1+nf)R. The logic “3” state is represented by a mathematical expression n(1+f)R.

摘要翻译： 描述了一种用于操作具有串联排列的两个存储层堆叠的双稳态电阻随机存取存储器的方法。 双稳态电阻随机存取存储器包括每个存储单元的两个存储层堆栈，双稳态电阻随机存取存储器以四个逻辑状态，逻辑“00”状态，逻辑“01”状态，逻辑“10”状态和逻辑 “11”状态。 四个不同逻辑状态之间的关系可以由两个变量n和f以及电阻R在数学上表示。逻辑“0”状态由数学表达式（1 + f）R表示。 逻辑“1”状态由数学表达式（n + f）R表示。 逻辑“2”状态由数学表达式（1 + nf）R表示。 逻辑“3”状态由数学表达式n（1 + f）R表示。

公开(公告)号：US20080116440A1

公开(公告)日：2008-05-22

申请号：US11560723

申请日：2006-11-16

申请人： ChiaHua Ho ,  Erh-Kun Lai ,  Kuang Yeu Hsieh

发明人： ChiaHua Ho ,  Erh-Kun Lai ,  Kuang Yeu Hsieh

IPC分类号： H01L47/00

CPC分类号： H01L45/1608 ,  H01L45/04 ,  H01L45/06 ,  H01L45/12 ,  H01L45/1233 ,  H01L45/144 ,  H01L45/146 ,  H01L45/1625

摘要： A bistable resistance random access memory is described for enhancing the data retention in a resistance random access memory member. A dielectric member, e.g. the bottom dielectric member, underlies the resistance random access memory member which improves the SET/RESET window in the retention of information. The deposition of the bottom dielectric member is carried out by a plasma-enhanced chemical vapor deposition or by high-density-plasma chemical vapor deposition. One suitable material for constructing the bottom dielectric member is a silicon oxide. The bistable resistance random access memory includes a bottom dielectric member disposed between a resistance random access member and a bottom electrode or bottom contact plug. Additional layers including a bit line, a top contact plug, and a top electrode disposed over the top surface of the resistance random access memory member. Sides of the top electrode and the resistance random access memory member are substantially aligned with each other.

摘要翻译： 描述了双稳态电阻随机存取存储器，用于增强电阻随机存取存储器件中的数据保持。 电介质构件，例如 底部电介质构件位于电阻随机存取存储器构件的下方，其改善了保留信息中的SET / RESET窗口。 底部电介质构件的沉积通过等离子体增强化学气相沉积或通过高密度 - 等离子体化学气相沉积来进行。 用于构造底部电介质构件的一种合适的材料是氧化硅。 双稳态随机存取存储器包括设置在电阻随机存取构件和底部电极或底部接触插塞之间的底部电介质构件。 附加层包括位线，顶部接触插塞和设置在电阻随机存取存储器构件顶表面上的顶部电极。 顶部电极和电阻随机存取存储器构件的侧面基本上彼此对准。

公开(公告)号：US20080099826A1

公开(公告)日：2008-05-01

申请号：US11588830

申请日：2006-10-27

申请人： Erh-Kun Lai ,  Yen-Hao Shih ,  Tzu-Hsuan Hsu ,  Shih-Chih Lee ,  Jung-Yu Hsieh ,  Kuang-Yeu Hsieh

发明人： Erh-Kun Lai ,  Yen-Hao Shih ,  Tzu-Hsuan Hsu ,  Shih-Chih Lee ,  Jung-Yu Hsieh ,  Kuang-Yeu Hsieh

IPC分类号： H01L29/792

CPC分类号： H01L21/28282 ,  G11C16/0466 ,  H01L29/513 ,  H01L29/66833 ,  H01L29/792

摘要： Memory cells including a semiconductor layer having at least two source/drain regions disposed below a surface of the semiconductor layer and separated by a channel region; a lower insulating layer disposed above the channel region; a charge storage layer disposed above the lower insulating layer; an upper insulating multi-layer structure disposed above the charge storage layer, wherein the upper insulating multi-layer structure comprises a polysilicon material layer interposed between a first dielectric layer and a second dielectric layer; and a gate disposed above the upper insulating multi-layer structure are described along with arrays thereof and methods of operation.

摘要翻译： 存储单元包括具有至少两个源极/漏极区域的半导体层，所述源极/漏极区域设置在半导体层的表面下方并被沟道区域分隔开; 设置在通道区域上方的下绝缘层; 电荷存储层，其设置在所述下绝缘层的上方; 上部绝缘多层结构，其设置在所述电荷存储层上方，其中所述上部绝缘多层结构包括介于第一介电层和第二介电层之间的多晶硅材料层; 并且设置在上绝缘多层结构上方的栅极及其阵列及其操作方法。

公开(公告)号：US20080094873A1

公开(公告)日：2008-04-24

申请号：US11552032

申请日：2006-10-23

申请人： Erh-Kun Lai ,  ChiaHua Ho ,  Kuang Yeu Hsieh

发明人： Erh-Kun Lai ,  ChiaHua Ho ,  Kuang Yeu Hsieh

IPC分类号： G11C11/00

CPC分类号： G11C13/0007 ,  B82Y10/00 ,  G11C11/5664 ,  G11C11/5678 ,  G11C11/5685 ,  G11C13/0004 ,  G11C13/0014 ,  G11C13/0016 ,  G11C2213/31 ,  G11C2213/32 ,  G11C2213/34 ,  G11C2213/79 ,  H01L27/2463 ,  H01L45/04 ,  H01L45/06 ,  H01L45/122 ,  H01L45/144 ,  H01L45/146 ,  H01L45/1633

摘要： A memory device that selectably exhibits first and second logic levels. A first conductive material has a first surface with a first memory layer formed thereon, and a second conductive material has a second surface with a second memory layer formed thereon. A connective conductive layer joins the first and second memory layers and places the same in electrical contact. The structure is designed so that the first memory layer has a cross-sectional area less than that of the second memory layer.

摘要翻译： 可选择地显示第一和第二逻辑电平的存储器件。 第一导电材料具有形成在其上的第一存储层的第一表面，并且第二导电材料具有形成在其上的第二存储层的第二表面。 连接导电层连接第一和第二存储层并将其放置在电接触中。 该结构被设计成使得第一存储层的横截面积小于第二存储层的横截面面积。

公开(公告)号：US20070281420A1

公开(公告)日：2007-12-06

申请号：US11421042

申请日：2006-05-30

申请人： Erh-Kun Lai ,  ChiaHua Ho ,  Kuang Yeu Hsieh

发明人： Erh-Kun Lai ,  ChiaHua Ho ,  Kuang Yeu Hsieh

IPC分类号： H01L21/8242

CPC分类号： H01L45/04 ,  H01L27/2436 ,  H01L45/06 ,  H01L45/1226 ,  H01L45/14 ,  H01L45/144 ,  H01L45/146 ,  H01L45/147 ,  H01L45/1625 ,  H01L45/1675 ,  Y10S438/90

摘要： A memory device has a sidewall insulating member with a sidewall insulating member length according to a first spacer layer thickness. A first electrode formed from a second spacer layer having a first electrode length according to a thickness of a second spacer layer and a second electrode formed from the second spacer layer having a second electrode length according to the thickness of the second spacer layer are formed on sidewalls of the sidewall insulating member. A bridge of memory material having a bridge width extends from a top surface of the first electrode to a top surface of the second electrode across a top surface of the sidewall insulating member, wherein the bridge comprises memory material.

摘要翻译： 存储器件具有侧壁绝缘构件，其具有根据第一间隔层厚度的侧壁绝缘构件长度。 由具有根据第二间隔层的厚度的第一电极长度和根据第二间隔层的厚度具有第二电极长度的由第二间隔层形成的第二电极的第二间隔层形成的第一电极形成在 侧壁绝缘部件的侧壁。 具有桥接宽度的记忆材料桥由第一电极的顶表面延伸穿过侧壁绝缘构件的顶表面延伸到第二电极的顶表面，其中桥包括记忆材料。

公开(公告)号：US08704205B2

公开(公告)日：2014-04-22

申请号：US13594353

申请日：2012-08-24

申请人： Shih-Hung Chen ,  Hang-Ting Lue ,  Kuang-Yeu Hsieh ,  Erh-Kun Lai ,  Yen-Hao Shih

发明人： Shih-Hung Chen ,  Hang-Ting Lue ,  Kuang-Yeu Hsieh ,  Erh-Kun Lai ,  Yen-Hao Shih

IPC分类号： H01L47/00

CPC分类号： H01L27/11582 ,  H01L27/11548 ,  H01L27/11556 ,  H01L27/11575

摘要： A semiconductor structure with improved capacitance of bit lines includes a substrate, a stacked memory structure, a plurality of bit lines, a first stair contact structure, a first group of transistor structures and a first conductive line. The first stair contact structure is formed on the substrate and includes conductive planes and insulating planes stacked alternately. The conductive planes are separated from each other by the insulating planes for connecting the bit lines to the stacked memory structure by stairs. The first group of transistor structures is formed in a first bulk area where the bit lines pass through and then connect to the conductive planes. The first group of transistor structures has a first gate around the first bulk area. The first conductive line is connected to the first gate to control the voltage applied to the first gate.

摘要翻译： 具有改善的位线电容的半导体结构包括衬底，堆叠存储器结构，多个位线，第一阶梯接触结构，第一组晶体管结构和第一导电线。 第一阶梯接触结构形成在基板上，并且包括交替堆叠的导电平面和绝缘面。 导电平面通过用于通过楼梯将位线连接到堆叠的存储器结构的绝缘平面彼此分离。 第一组晶体管结构形成在第一体积区域中，其中位线通过，然后连接到导电平面。 第一组晶体管结构在第一体积区域周围具有第一栅极。 第一导线连接到第一栅极以控制施加到第一栅极的电压。

公开(公告)号：US08067762B2

公开(公告)日：2011-11-29

申请号：US11560723

申请日：2006-11-16

申请人： ChiaHua Ho ,  Erh-Kun Lai ,  Kuang Yeu Hsieh

发明人： ChiaHua Ho ,  Erh-Kun Lai ,  Kuang Yeu Hsieh

IPC分类号： H01L29/02 ,  H01L47/00

CPC分类号： H01L45/1608 ,  H01L45/04 ,  H01L45/06 ,  H01L45/12 ,  H01L45/1233 ,  H01L45/144 ,  H01L45/146 ,  H01L45/1625

摘要： A bistable resistance random access memory is described for enhancing the data retention in a resistance random access memory member. A dielectric member, e.g. the bottom dielectric member, underlies the resistance random access memory member which improves the SET/RESET window in the retention of information. The deposition of the bottom dielectric member is carried out by a plasma-enhanced chemical vapor deposition or by high-density-plasma chemical vapor deposition. One suitable material for constructing the bottom dielectric member is a silicon oxide. The bistable resistance random access memory includes a bottom dielectric member disposed between a resistance random access member and a bottom electrode or bottom contact plug. Additional layers including a bit line, a top contact plug, and a top electrode disposed over the top surface of the resistance random access memory member. Sides of the top electrode and the resistance random access memory member are substantially aligned with each other.

摘要翻译： 描述了双稳态电阻随机存取存储器，用于增强电阻随机存取存储器件中的数据保持。 电介质构件，例如 底部电介质构件位于电阻随机存取存储器构件的下方，其改善了保留信息中的SET / RESET窗口。 底部电介质构件的沉积通过等离子体增强化学气相沉积或通过高密度 - 等离子体化学气相沉积来进行。 用于构造底部电介质构件的一种合适的材料是氧化硅。 双稳态随机存取存储器包括设置在电阻随机存取构件和底部电极或底部接触插塞之间的底部电介质构件。 附加层包括位线，顶部接触插塞和设置在电阻随机存取存储器构件顶表面上的顶部电极。 顶部电极和电阻随机存取存储器构件的侧面基本上彼此对准。

公开(公告)号：US08022489B2

公开(公告)日：2011-09-20

申请号：US11134155

申请日：2005-05-20

申请人： Hang-Ting Lue ,  Erh-Kun Lai ,  Kuang Yeu Hsieh

发明人： Hang-Ting Lue ,  Erh-Kun Lai ,  Kuang Yeu Hsieh

IPC分类号： H01L29/788 ,  H01L27/108 ,  H01L27/11 ,  H01L27/112

CPC分类号： H01L27/115 ,  G11C16/0408 ,  H01L21/28273 ,  H01L27/11521 ,  H01L29/42324 ,  H01L29/515

摘要： An air tunnel floating gate memory cell includes an air tunnel defined over a substrate. A first polysilicon layer (floating gate) is defined over the air tunnel. An oxide layer is disposed over the first polysilicon layer such that the oxide layer caps the first polysilicon layer and defines the sidewalls of the air tunnel. A second polysilicon layer, functioning as a word line, is defined over the oxide layer. A method for making an air tunnel floating gate memory cell is also disclosed. A sacrificial layer is formed over a substrate. A first polysilicon layer is formed over the sacrificial layer. An oxide layer is deposited over the first polysilicon layer such that the oxide layer caps the first polysilicon layer and defines the sidewalls of the sacrificial layer. A hot phosphoric acid (H3PO4) dip is used to etch away the sacrificial layer to form an air tunnel.

摘要翻译： 空气隧道浮动栅极存储单元包括限定在衬底上的空气通道。 在空气隧道上定义第一多晶硅层（浮栅）。 氧化物层设置在第一多晶硅层上，使得氧化物层覆盖第一多晶硅层并限定空气通道的侧壁。 用作字线的第二多晶硅层被定义在氧化物层上。 还公开了一种制造空气通道浮动栅极存储单元的方法。 在衬底上形成牺牲层。 在牺牲层上形成第一多晶硅层。 在第一多晶硅层上沉积氧化物层，使得氧化物层覆盖第一多晶硅层并限定牺牲层的侧壁。 使用热磷酸（H 3 PO 4）浸渍来蚀刻掉牺牲层以形成空气通道。

公开(公告)号：US20110189819A1

公开(公告)日：2011-08-04

申请号：US13083450

申请日：2011-04-08

申请人： Wei-Chih Chien ,  Kuo-Pin Chang ,  Erh-Kun Lai ,  Kuang Yeu Hsieh

发明人： Wei-Chih Chien ,  Kuo-Pin Chang ,  Erh-Kun Lai ,  Kuang Yeu Hsieh

IPC分类号： H01L21/8239

CPC分类号： H01L45/04 ,  H01L45/085 ,  H01L45/12 ,  H01L45/1233 ,  H01L45/144 ,  H01L45/146 ,  H01L45/147 ,  H01L45/148 ,  H01L45/1625 ,  H01L45/1633 ,  Y10S438/90

摘要： A memory device comprises first and second electrodes with a memory element and a buffer layer located between and electrically coupled to them. The memory element comprises one or more metal oxygen compounds. The buffer layer comprises at least one of an oxide and a nitride. Another memory device comprises first and second electrodes with a memory element and a buffer layer, having a thickness of less than 50 Å, located between and electrically coupled to them. The memory comprises one or more metal oxygen compounds. An example of a method of fabricating a memory device includes forming first and second electrodes. A memory, located between and electrically coupled to the first and the second electrodes, is formed; the memory comprises one or more metal oxygen compounds and the buffer layer comprises at least one of an oxide and a nitride.

摘要翻译： 存储器件包括具有存储元件的第一和第二电极以及位于它们之间并与之电耦合的缓冲层。 记忆元件包括一种或多种金属氧化合物。 缓冲层包括氧化物和氮化物中的至少一种。 另一个存储器件包括具有存储元件和缓冲层的第一和第二电极，其厚度小于50，位于它们之间并与之电耦合。 记忆体包括一种或多种金属氧化合物。 制造存储器件的方法的一个例子包括形成第一和第二电极。 形成位于第一和第二电极之间并电耦合到第一和第二电极的存储器; 存储器包括一种或多种金属氧化合物，并且缓冲层包括氧化物和氮化物中的至少一种。

公开(公告)号：US07943920B2

公开(公告)日：2011-05-17

申请号：US12836304

申请日：2010-07-14

申请人： Wei-Chih Chien ,  Kuo-Pin Chang ,  Erh-Kun Lai ,  Kuang Yeu Hsieh

发明人： Wei-Chih Chien ,  Kuo-Pin Chang ,  Erh-Kun Lai ,  Kuang Yeu Hsieh

IPC分类号： H01L29/04

CPC分类号： H01L45/04 ,  H01L45/085 ,  H01L45/12 ,  H01L45/1233 ,  H01L45/144 ,  H01L45/146 ,  H01L45/147 ,  H01L45/148 ,  H01L45/1625 ,  H01L45/1633 ,  Y10S438/90

摘要： A memory device comprises first and second electrodes with a memory element and a buffer layer located between and electrically coupled to them. The memory element comprises one or more metal oxygen compounds. The buffer layer comprises at least one of an oxide and a nitride. Another memory device comprises first and second electrodes with a memory element and a buffer layer, having a thickness of less than 50 Å, located between and electrically coupled to them. The memory comprises one or more metal oxygen compounds. An example of a method of fabricating a memory device includes forming first and second electrodes. A memory, located between and electrically coupled to the first and the second electrodes, is formed; the memory comprises one or more metal oxygen compounds and the buffer layer comprises at least one of an oxide and a nitride.

摘要翻译： 存储器件包括具有存储元件的第一和第二电极以及位于它们之间并与之电耦合的缓冲层。 记忆元件包括一种或多种金属氧化合物。 缓冲层包括氧化物和氮化物中的至少一种。 另一个存储器件包括具有存储元件和缓冲层的第一和第二电极，其厚度小于50，位于它们之间并与之电耦合。 记忆体包括一种或多种金属氧化合物。 制造存储器件的方法的一个例子包括形成第一和第二电极。 形成位于第一和第二电极之间并电耦合到第一和第二电极的存储器; 存储器包括一种或多种金属氧化合物，并且缓冲层包括氧化物和氮化物中的至少一种。