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192 条记录 (耗时 0.042 秒)

    Method and apparatus for pattern inspection
    51.
    发明申请
    Method and apparatus for pattern inspection 有权
    图案检查方法和装置

    公开(公告)号：US20100053319A1

    公开(公告)日：2010-03-04

    申请号：US12591179

    申请日：2009-11-12

    申请人： Kaoru Sakai ,  Shunji Maeda ,  Hidetoshi Nishiyama

    发明人： Kaoru Sakai ,  Shunji Maeda ,  Hidetoshi Nishiyama

    IPC分类号： G06K9/00 ,  H04N7/18

    CPC分类号： G06T7/001 ,  G06T2207/30148

    摘要： According to the present invention, for a pattern inspection apparatus that compares images in corresponding areas of two patterns that are identical and that determines an unmatched portion between the images is a defect, a plurality of detection systems and a plurality of corresponding image comparison methods are provided. With this configuration, the affect of uneven brightnesses for a pattern that occurs due to differences in film thicknesses can be reduced, a highly sensitive pattern inspection can be performed, a variety of defects can be revealed, and the pattern inspection apparatus can be applied for processing performed within a wide range. Furthermore, the pattern inspection apparatus also includes a unit for converting the tone of image signals of comparison images for a plurality of different processing units, and when a difference in brightness occurs in the same pattern of the images, a defect can be correctly detected.

    摘要翻译： 根据本发明，对于对相同的两个图案的相应区域中的图像进行比较并且确定图像之间的不匹配部分的图像的图案检查装置是缺陷，多个检测系统和多个对应的图像比较方法是 提供。 利用这种结构，可以降低由于膜厚度差异而产生的图案的不均匀亮度的影响，可以进行高灵敏度图案检查，可以显示各种缺陷，并且图案检查装置可以应用于 在广泛的范围内进行处理。 此外，图案检查装置还包括用于转换多个不同处理单元的比较图像的图像信号的色调的单元，并且当在相同图案中出现亮度差时，可以正确地检测缺陷。

    Method And Apparatus For Reviewing Defects
    52.
    发明申请
    Method And Apparatus For Reviewing Defects 有权
    检查缺陷的方法和装置

    公开(公告)号：US20100019150A1

    公开(公告)日：2010-01-28

    申请号：US12573479

    申请日：2009-10-05

    申请人： Hidetoshi Nishiyama ,  Toshifumi Honda ,  Sachio Uto

    发明人： Hidetoshi Nishiyama ,  Toshifumi Honda ,  Sachio Uto

    IPC分类号： G01N23/00

    CPC分类号： G01N23/225 ,  G02B15/14 ,  G02B21/0016 ,  H01J37/226 ,  H01J37/28 ,  H01J2237/216 ,  H01J2237/2482 ,  H01J2237/2817 ,  H01K3/02

    摘要： A method of inspecting defects of a sample includes a first step for, on a basis of position information of defects on a sample placed on a movable table which is previously detected and obtained by an other inspection system, driving the table so that the defects come into a viewing field of an optical microscope having a focus which is adjusted, a second step for re-detecting the defects to obtain a first detection result, a third step for correcting the position information of defects on a basis of position information of defects re-detected of the first detection result, and a fourth step for reviewing the defects whose position information is corrected to obtain a second detection result. The method includes classifying types of defects on basis of the first detection result and the second detection result.

    摘要翻译： 检查样本缺陷的方法包括：第一步骤，基于放置在可移动台上的样本上的缺陷的位置信息，该样本预先由另一检查系统检测并获得，驱动所述台，使得缺陷到达 进入具有调整焦点的光学显微镜的观察区域，第二步骤，用于重新检测缺陷以获得第一检测结果;第三步骤，基于缺陷的位置信息来校正缺陷的位置信息 - 检测到第一检测结果，以及第四步骤，用于检查其位置信息被校正以获得第二检测结果的缺陷。 该方法包括基于第一检测结果和第二检测结果对缺陷的类型进行分类。

    Method and apparatus for reviewing defects
    53.
    发明授权
    Method and apparatus for reviewing defects 有权
    检查缺陷的方法和装置

    公开(公告)号：US07601954B2

    公开(公告)日：2009-10-13

    申请号：US11668510

    申请日：2007-01-30

    申请人： Hidetoshi Nishiyama ,  Toshifumi Honda ,  Sachio Uto

    发明人： Hidetoshi Nishiyama ,  Toshifumi Honda ,  Sachio Uto

    IPC分类号： G01N23/00

    CPC分类号： G01N23/225 ,  G02B15/14 ,  G02B21/0016 ,  H01J37/226 ,  H01J37/28 ,  H01J2237/216 ,  H01J2237/2482 ,  H01J2237/2817 ,  H01K3/02

    摘要： A method and an apparatus for reviewing defects detected by an optical particle inspection system or an optical profile inspection system in detail by an electron microscope are provided. In order to putting defects to be reviewed in the viewing field of the electron microscope and reducing the size of the apparatus, the electron microscope reviews defects detected by an optical defect inspection system. In the electron microscope, an optical microscope for reviewing detects is arranged, and when focusing of this optical microscope is carried out, the illumination position and the detection position of the optical microscope are not changed to the sample.

    摘要翻译： 提供了一种用于通过电子显微镜详细检查由光学粒子检查系统或光学轮廓检查系统检测到的缺陷的方法和装置。 为了在电子显微镜的观察区域中提供缺陷以及减小设备的尺寸，电子显微镜检查由光学缺陷检查系统检测到的缺陷。 在电子显微镜中，设置检查用光学显微镜，当进行该光学显微镜的聚焦时，光学显微镜的照明位置和检测位置不变为样品。

    Method and apparatus for detecting defects of a sample using a dark field signal and a bright field signal
    56.
    发明授权
    Method and apparatus for detecting defects of a sample using a dark field signal and a bright field signal 失效
    使用暗场信号和亮场信号来检测样本的缺陷的方法和装置

    公开(公告)号：US07463350B2

    公开(公告)日：2008-12-09

    申请号：US10981721

    申请日：2004-11-05

    申请人： Hidetoshi Nishiyama ,  Minoru Yoshida ,  Yukihiro Shibata ,  Shunji Maeda

    发明人： Hidetoshi Nishiyama ,  Minoru Yoshida ,  Yukihiro Shibata ,  Shunji Maeda

    IPC分类号： G01N21/00

    CPC分类号： G01N21/95684

    摘要： Disclosed is a method and apparatus for inspecting defects of patterns of a sample at high speed and with high sensitivity while damage of the sample arising from high-power pulsed light is reduced. Light emitted from a pulsed laser light source is transmitted through a pseudo continuous-wave forming optical system having an optical system capable of reducing energy per pulse and yet maintaining the entire amount of light of the pulsed light, a beam formation optical system, and a coherence reduction optical system, and a beam deflected by a deformation illumination optical system is made to reflect on a PBS to be irradiated on a wafer. The apparatus is configured so that the diffracted light from the wafer is focused by an objective lens, transmitted through light modulation units, focused to form a plurality of images on a plurality of image sensors in a visual-field divided parallel detection unit 12, and then defects are detected by a signal processing unit.

    摘要翻译： 公开了一种用于在高功率脉冲光下产生的样品损坏的情况下高速且高灵敏度地检查样品的图案的缺陷的方法和装置。 从脉冲激光光源发出的光通过伪连续波形成光学系统传输，该光学系统具有能够减少每脉冲能量并且仍保持脉冲光的光量，光束形成光学系统和 相干降低光学系统和由变形照明光学系统偏转的光束在PBS上反射以照射在晶片上。 该装置被配置为使得来自晶片的衍射光被物镜聚焦，透镜通过光调制单元被聚焦以在视野分割并行检测单元12中的多个图像传感器上形成多个图像，以及 那么由信号处理单元检测到缺陷。

    Method and apparatus for detecting defects in a specimen utilizing information concerning the specimen
    58.
    发明授权
    Method and apparatus for detecting defects in a specimen utilizing information concerning the specimen 有权
    用于利用关于样本的信息来检测样本中的缺陷的方法和装置

    公开(公告)号：US07400393B2

    公开(公告)日：2008-07-15

    申请号：US11478617

    申请日：2006-07-03

    申请人： Yukihiro Shibata ,  Shunji Maeda ,  Hidetoshi Nishiyama

    发明人： Yukihiro Shibata ,  Shunji Maeda ,  Hidetoshi Nishiyama

    IPC分类号： G01N21/88

    CPC分类号： G01N21/95607 ,  G01N2021/8822

    摘要： This invention provides a defect inspection method and apparatus that can easily and quickly determine, from among a plurality of inspection conditions, a condition that allows for an inspection with high sensitivity. The inspection apparatus has a variety of optical functions to cover a variety of kinds of defects to be inspected (shape, material, nearby pattern, etc.). For each optical function, grayscale depths of defects that the operator wants detected and of pseudo defects that he or she wants undetected are accumulated for future use, so that conditions conducive to a higher sensitivity and a lower pseudo defect detection rate can be selected efficiently. Conditions that can be selected for optical systems include a bright-field illumination, a dark-field illumination and a bright-/dark-field composite illumination, illumination wavelength bands, polarization filters and spatial filters.

    摘要翻译： 本发明提供一种能够从多个检查条件中容易且快速地确定能够以高灵敏度进行检查的条件的缺陷检查方法和装置。 检查装置具有各种光学功能，可以覆盖要检查的各种缺陷（形状，材料，附近图案等）。 对于每个光学功能，操作者想要检测到的缺陷的灰度深度和他或她想要未检测到的伪缺陷被累积以供将来使用，使得可以有效地选择有利于更高灵敏度和更低伪缺陷检测率的条件。 可以选择用于光学系统的条件包括亮场照明，暗场照明和亮/暗场复合照明，照明波长带，偏振滤光器和空间滤光器。

    Semiconductor device inspection method
    59.
    发明授权
    Semiconductor device inspection method 有权
    半导体器件检查方法

    公开(公告)号：US07332359B2

    公开(公告)日：2008-02-19

    申请号：US10082593

    申请日：2002-02-22

    申请人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama

    发明人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama

    IPC分类号： H01L31/26

    CPC分类号： H01L21/67271 ,  G01N21/9501 ,  G01N21/95607 ,  G01N2021/95615

    摘要： Techniques for inspecting semiconductor devices. An inspection condition using chip matrix data and chip size data is set. The intricate circuit patterns of at least one semiconductor device is inspected with the inspection condition. In an embodiment of the present invention, inspection uses images formed by the irradiation of white light, a laser light, or an electron beam. Data obtained from the inspection is used to generate a revised inspection condition. Semiconductor devices are inspected using the revised inspection condition.

    摘要翻译： 检查半导体器件的技术。 设置使用芯片矩阵数据和芯片尺寸数据的检查条件。 在检查条件下检查至少一个半导体器件的复杂电路图案。 在本发明的实施例中，检查使用通过照射白光，激光或电子束形成的图像。 使用从检查获得的数据来生成修订的检查条件。 使用修订的检查条件检查半导体器件。