公开(公告)号：US5788454A

公开(公告)日：1998-08-04

申请号：US623659

申请日：1996-03-29

申请人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright

发明人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright

IPC分类号： B65G49/07 ,  H01L21/00 ,  H01L21/673 ,  H01L21/677

CPC分类号： H01L21/67781 ,  H01L21/67173 ,  H01L21/67313 ,  H01L21/67326 ,  H01L21/67742 ,  H01L21/67754 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/138 ,  Y10S414/14 ,  Y10S414/141

摘要： A processor for processing integrated circuit wafers, semiconductor substrates, data disks and similar units requiring very low contamination levels. The processor has an interface section which receives wafers in standard wafer carriers. The interface section transfers the wafers from carriers onto novel trays for improved processing. The interface unit can hold multiple groups of multiple trays. A conveyor having an automated arm assembly moves wafers supported on a tray. The conveyor moves the trays from the interface along a track to several processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.

公开(公告)号：US5221360A

公开(公告)日：1993-06-22

申请号：US893585

申请日：1992-06-02

申请人： Raymon F. Thompson ,  Aleksander Owczarz

发明人： Raymon F. Thompson ,  Aleksander Owczarz

IPC分类号： B08B3/02 ,  H01L21/00

CPC分类号： H01L21/67028 ,  B08B3/02 ,  Y10S134/902

摘要： Rinser dryer system for rising process chemical from silicon or gallium arsenide wafers, substrates, masks or disks and drying of silicon or gallium arsenide wafers, substrates, masks or disks positioned in a wafer cassette. A wafer cassette is positioned in a rotor assembly and the rotor assembly positioned within a removable heated chamber bowl. The wafer cassette rotates past rising and drying manifold nozzles. The removable chamber bowl is secured to a rinser dryer mounting plate by quick disconnect hardware for removal and for external cleansing. A broken chip collector in a lower portion of an exhaust manifold assembly removes small broken chip remains. An acidity sensor is positioned in a bottom portion of the exhaust manifold assembly for monitoring rinse effluent during the rising process. A gated exhaust valve in an exhaust gas manifold of the exhaust manifold assembly provides for gases to exhaust to an external location. A computer controls cycling of the process modes as the silicon or gallium arsenide wafers, substrates, masks or disks are sprayed, washed, rinsed, and dried.

摘要翻译： 用于从硅或砷化镓晶片，衬底，掩模或盘上升过程化学品的Rinser干燥器系统以及位于晶片盒中的硅或砷化镓晶片，衬底，掩模或盘的干燥。 晶片盒位于转子组件中，转子组件位于可移除的加热室碗内。 晶片盒经过上升和干燥的歧管喷嘴旋转。 可拆卸的室碗通过快速拆卸硬件固定到洗衣机烘干机安装板上，用于去除和外部清洁。 在排气歧管组件的下部的破碎的芯片收集器去除小的破碎的芯片残留物。 酸度传感器位于排气歧管组件的底部，用于在上升过程中监测冲洗流出物。 排气歧管组件的废气歧管中的门控排气阀提供气体排放到外部位置。 当喷射，洗涤，冲洗和干燥硅或砷化镓晶片，基底，掩模或盘时，计算机控制过程模式的循环。

公开(公告)号：US20150014176A1

公开(公告)日：2015-01-15

申请号：US13938191

申请日：2013-07-09

申请人： Raymon F. Thompson

发明人： Raymon F. Thompson

IPC分类号： C25D17/00 ,  C25D5/08 ,  F04C2/02

CPC分类号： C25D17/001 ,  C25D5/08 ,  C25D7/123 ,  C25D21/10 ,  C25D21/18 ,  F04C2/025 ,  F04C2220/30 ,  H01L21/2885 ,  H01L21/76877

摘要： A wafer processing apparatus is disclosed that includes a wafer support and a processing base. The wafer support is configured to support a wafer at a processing position with respect to a processing base. The processing base includes a scroll pump oriented to pump a processing fluid in a substantially perpendicular direction with respect to the surface of the wafer when the wafer contacts the processing fluid while in the processing position. While in contact with the processing fluid, the wafer support may rotate the wafer in the processing fluid. In one embodiment, the diameter of the scroll pump is substantially the same as or greater than the diameter of the surface of the wafer being processed.

摘要翻译： 公开了一种晶片处理装置，其包括晶片支撑件和处理基座。 晶片支撑件被配置为在相对于处理基座的处理位置处支撑晶片。 处理基座包括一个涡卷泵，当在处理位置时晶片与处理流体接触时，该涡旋泵相对于晶片的表面在基本垂直的方向上泵送处理流体。 在与处理流体接触的同时，晶片支撑件可以在处理流体中旋转晶片。 在一个实施例中，涡旋泵的直径基本上等于或大于被处理的晶片的表面的直径。

公开(公告)号：US07193295B2

公开(公告)日：2007-03-20

申请号：US10923131

申请日：2004-08-20

申请人： Kert L. Dolechek ,  Raymon F. Thompson

发明人： Kert L. Dolechek ,  Raymon F. Thompson

IPC分类号： H01L29/06

CPC分类号： H01L29/06 ,  H01L21/302 ,  H01L21/30604 ,  H01L21/3083 ,  H01L21/67126 ,  H01L21/68735 ,  Y10S438/959

摘要： The present invention provides system and apparatus for use in processing wafers. The new system and apparatus allows for the production of thinner wafers that at same time remain strong. As a result, the wafers produced by the present process are less susceptible to breaking. The unique system also offers an improved structure for handling thinned wafers and reduces the number of processing steps. This results in improved yields and improved process efficiency.

摘要翻译： 本发明提供了用于处理晶片的系统和装置。 新的系统和设备允许生产更薄的晶片，同时保持坚固。 结果，由本方法生产的晶片不易破裂。 独特的系统还提供了一种改进的处理薄化晶片的结构，并减少了处理步骤的数量。 这导致产量提高和工艺效率提高。

公开(公告)号：US07094291B2

公开(公告)日：2006-08-22

申请号：US09893316

申请日：2001-06-26

申请人： Timothy J. Reardon ,  Craig P. Meuchel ,  Thomas H. Oberlitner ,  Aleksander Owczarz ,  Raymon F. Thompson

发明人： Timothy J. Reardon ,  Craig P. Meuchel ,  Thomas H. Oberlitner ,  Aleksander Owczarz ,  Raymon F. Thompson

IPC分类号： B05C11/00 ,  B05B12/00 ,  B05B15/00

CPC分类号： H01L21/6715 ,  G11B7/26 ,  H01L21/67075 ,  H01L21/6708 ,  H01L21/67086 ,  H01L21/68707 ,  H01L21/68785 ,  Y10S134/902

摘要： A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.

公开(公告)号：US06997988B2

公开(公告)日：2006-02-14

申请号：US09921840

申请日：2001-08-02

申请人： Gary L. Curtis ,  Raymon F. Thompson

发明人： Gary L. Curtis ,  Raymon F. Thompson

IPC分类号： B05C11/02 ,  B05B1/28

CPC分类号： H01L21/67017 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/6708 ,  Y10S134/902

摘要： An apparatus for processing a workpiece in a micro-environment includes a workpiece housing connected to be rotated by a motor. The workpiece housing forms a substantially closed processing chamber where one or more processing fluids are distributed across at least one face of the workpiece by centrifugal force generated during rotation of the housing. A sump is connected to an inlet and an outlet in the chamber. Rotation of the workpiece housing recirculates fluid into the chamber.

摘要翻译： 用于在微环境中处理工件的装置包括连接以由电动机旋转的工件壳体。 工件壳体形成基本封闭的处理室，其中一个或多个处理流体通过在壳体旋转期间产生的离心力分布在工件的至少一个面上。 贮槽连接到腔室中的入口和出口。 工件壳体的旋转使流体进入腔室。

公开(公告)号：US06881309B2

公开(公告)日：2005-04-19

申请号：US09882309

申请日：2001-06-14

申请人： Kyle M. Hanson ,  Robert A. Weaver ,  Jerry Simchuk ,  Raymon F. Thompson

发明人： Kyle M. Hanson ,  Robert A. Weaver ,  Jerry Simchuk ,  Raymon F. Thompson

IPC分类号： C25D7/12 ,  C25B9/00 ,  C25C7/00 ,  C25D17/00

CPC分类号： C25D17/001 ,  Y10S204/07

摘要： In an electroplating reactor for plating a spinning wafer, a diffusion plate is supported above an anode located within a cup filled with process fluid within the reactor. The diffusion plate includes a plurality of openings which are arranged in a spiral pattern. The openings allow for an improved plating thickness distribution on the wafer surface. The openings can be elongated slots curved along the direction of the spiral path.

摘要翻译： 在用于电镀旋转晶片的电镀反应器中，扩散板被支撑在位于反应器内装有工艺流体的杯内的阳极上。 扩散板包括多个以螺旋图案布置的开口。 这些开口允许在晶片表面上改善电镀厚度分布。 开口可以是沿着螺旋路径的方向弯曲的细长槽。

公开(公告)号：US06794291B2

公开(公告)日：2004-09-21

申请号：US10202074

申请日：2002-07-23

申请人： Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson ,  Brian Aegerter ,  Curt T. Dundas

发明人： Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson ,  Brian Aegerter ,  Curt T. Dundas

IPC分类号： H01L21311

CPC分类号： H01L21/6715 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/6708 ,  Y10S118/90 ,  Y10S438/906 ,  Y10S438/913

摘要： An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.

摘要翻译： 用于处理半导体晶片或类似物品的设备包括具有由上下转子形成的处理室的反应器。 晶片支撑在转子之间。 转子由旋转电机旋转。 处理流体在中心位置被引入到晶片的顶表面或底表面上，或在两个表面上。 流体向外均匀地向各个方向流动。 晶片支架自动提升晶片，从而当转子在加工后彼此分离时，它可以由机器人从反应器中移出。

公开(公告)号：US06660098B2

公开(公告)日：2003-12-09

申请号：US09922362

申请日：2001-08-02

申请人： Gary L Curtis ,  Raymon F. Thompson

发明人： Gary L Curtis ,  Raymon F. Thompson

IPC分类号： C23C1600

CPC分类号： H01L21/67017 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/6708 ,  Y10S134/902

摘要： An apparatus for processing a workpiece in a micro-environment includes a workpiece housing connected to a motor for rotation. The workpiece housing defines a substantially closed processing chamber therein in which one or more processing fluids are distributed across at least one face of the workpiece by centrifugal force generated during rotation of the housing. A dividing member at the edge of the spinning workpiece separates flow of fluids off of the top and bottom surfaces of the workpiece.

摘要翻译： 用于在微环境中处理工件的装置包括连接到用于旋转的电动机的工件壳体。 工件壳体在其中限定基本封闭的处理室，其中一个或多个处理流体在壳体旋转期间产生的离心力穿过工件的至少一个面分布。 旋转工件边缘处的分隔构件将流体流离开工件的顶面和底面。

公开(公告)号：US06558470B2

公开(公告)日：2003-05-06

申请号：US09845462

申请日：2001-04-30

申请人： Gary L. Curtis ,  Raymon F. Thompson

发明人： Gary L. Curtis ,  Raymon F. Thompson

IPC分类号： B08B302

CPC分类号： H01L21/67017 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/6708

摘要： An apparatus for processing a microelectronic workpiece in a micro-environment is set forth. The apparatus includes a first chamber member having an interior chamber wall and a second chamber member having an interior chamber wall. The first and second chamber members are adapted for relative movement between a loading position in which the first and second chamber members are distal one another and a processing position in which the first and second chamber members are proximate one another to define a processing chamber. At least one workpiece support assembly is disposed between the first and second chamber members for supporting the microelectronic workpiece. The workpiece support assembly is operable to space the workpiece a first distance, x1, from an interior chamber wall of at least one of the first and second chamber members when the first and second chamber members are in the loading position and to space the workpiece a second distance, x2, from the interior chamber wall when the first and second chamber members are in the processing position, wherein x1>x2.

摘要翻译： 阐述了在微环境中处理微电子工件的装置。 该装置包括具有内部室壁的第一室构件和具有内部室壁的第二室构件。 第一和第二室构件适于在第一和第二室构件彼此远离的装载位置和第一和第二室构件彼此靠近以限定处理室的处理位置之间的相对运动。 至少一个工件支撑组件设置在第一和第二室构件之间，用于支撑微电子工件。 工件支撑组件可操作以当第一和第二室构件处于装载位置时将工件与第一和第二室构件中的至少一个室内构件的内室壁隔开第一距离x1，并使工件空间 第二距离x2，当第一和第二腔室构件处于加工位置时，其中x1> x2。