Abstract:
A method by which a defective memory cell can be efficiently excluded from a memory cell array is provided. In one embodiment, the memory cell array includes M word lines and (N+K) bit lines. K of the bit lines are spares (i.e., redundant bit lines). Programmable switches in a switch array are programmed so that the switch array connects a driver that drives the bit lines to N bit lines that are not connected to defective memory cells. The memory cell array is tested by a test circuit connected to the bit lines in such a manner that the test circuit transmits and receives a signal to and from the bit lines via the switch array. The test circuit may be formed using a reconfigurable circuit. Other embodiments may be claimed.
Abstract:
In a multi-core semiconductor device, a data bus between CPUs or the like consumes a larger amount of power. By provision of a plurality of CPUs which transmit data by a backscattering method of a wireless signal, a router circuit which mediates data transmission and reception between the CPUs or the like, and a thread control circuit which has a thread scheduling function, a semiconductor device which consumes less power and has high arithmetic performance can be provided at low cost.
Abstract:
An imaging device is provided at a lower manufacturing cost. In a light-receiving portion of an imaging device which includes the light-receiving portion, a first transistor connected to the light-receiving portion, and a peripheral circuit, a comb-like n-type semiconductor and a comb-like p-type semiconductor are arranged so as to engage with each other in a plan view. Further, the light-receiving portion and the first transistor overlap with each other. The peripheral circuit includes a second transistor and a third transistor. Further, the second transistor and the third transistor include semiconductor layers having different bandgaps. Further, one of the semiconductor layers of the second transistor and the third transistor has the same bandgap as a semiconductor layer of the first transistor.
Abstract:
A low-power programmable LSI that can perform configuration (dynamic configuration) at high speed and can quickly start is provided. The programmable LSI includes a plurality of logic elements and a memory element for storing configuration data to be input to the plurality of logic elements. The plurality of logic elements each include a configuration memory. Each of the plurality of logic elements performs different arithmetic processing and changes an electrical connection between the logic elements in accordance with the configuration data stored in the configuration memory. The memory element is formed using a storage element including a transistor whose channel is formed in an oxide semiconductor layer and a node set in a floating state when the transistor is turned off.
Abstract:
An object of the invention is to improve the accuracy of light detection in a photosensor, and to increase the light-receiving area of the photosensor. The photosensor includes: a light-receiving element which converts light into an electric signal; a first transistor which transfers the electric signal; and a second transistor which amplifies the electric signal. The light-receiving element includes a silicon semiconductor, and the first transistor includes an oxide semiconductor. The light-receiving element is a lateral junction photodiode, and an n-region or a p-region included in the light-receiving element overlaps with the first transistor.
Abstract:
It is an object to provide a signal processing circuit for which a complex manufacturing process is not necessary and whose power consumption can be suppressed. In particular, it is an object to provide a signal processing circuit whose power consumption can be suppressed by stopping the power supply for a short time. The signal processing circuit includes a control circuit, an arithmetic unit, and a buffer memory device. The buffer memory device stores data sent from the main memory device or the arithmetic unit in accordance with an instruction from the control unit; the buffer memory device comprises a plurality of memory cells; and the memory cells each include a transistor including an oxide semiconductor in a channel formation region and a memory element to which charge whose amount depends on a value of the data is supplied via the transistor.
Abstract:
To provide a charge pump circuit to manufacture a low-power-consumption PLD. A semiconductor device includes a first circuit and a second circuit electrically connected to the first circuit. A charge pump circuit formed of a transistor including an oxide semiconductor and a boosting control circuit controlling the charge pump circuit are provided between the first circuit and the second circuit. The first circuit and the charge pump circuit operate at first power supply voltage, and the boosting control circuit and the second circuit operate at second power supply voltage. The first power supply voltage is lower than the second power supply voltage.
Abstract:
Configuration is performed in accordance with a plurality of states when power supply voltage is supplied intermittently. At the time of start of supply of power supply voltage with configuration, a programmable logic device is sequentially changed into a first state where configuration data is not set in a configuration memory, a second state where the configuration memory is initialized, and a third state where the configuration data can be set in the configuration memory. At the time of start of supply of power supply voltage without configuration, the programmable logic device is sequentially changed into a fourth state where the configuration data is not set in the configuration memory and the third state. The first to fourth states are switched to any one of the states by control of a first state signal and a second state signal.
Abstract:
In a method for manufacturing a semiconductor device including a transistor and a conductive film over a substrate, a first insulating film and a second insulating film are formed over the transistor and the conductive film sequentially. Then, an opening and a recessed portion are formed in the second insulating film using one multi-tone photomask, wherein the opening is deeper than the recessed portion in the second insulating film. By using the opening, a first contact hole exposing one of the electrodes of the transistor is formed through the first and second insulating films and, by using the recessed portion, a second contact hole exposing the first insulating film is formed through the second insulating film. Moreover, an electrode is formed on and in contact with the one of the electrodes in the first contact hole and the first insulating film in the second contact hole.
Abstract:
A storage device with long data retention time is configured to include a first transistor, a second transistor, and a third transistor. The first transistor controls electrical connection between a first wiring and a gate of the second transistor. The second transistor controls electrical connection between a second wiring and a gate of the third transistor. The off-state current of the first transistor is lower than that of the third transistor. The leakage current of the second transistor is lower than that of the third transistor.