公开(公告)号：US20120058276A1

公开(公告)日：2012-03-08

申请号：US13296513

申请日：2011-11-15

申请人： Hiroki Uchida ,  Kazuki Yoshikawa ,  Toshiaki Shibata

发明人： Hiroki Uchida ,  Kazuki Yoshikawa ,  Toshiaki Shibata

IPC分类号： B05D7/14 ,  B05D3/10 ,  B05D1/38

CPC分类号： C23C22/66 ,  C23C18/1601 ,  C23C18/54 ,  C23C22/83 ,  H01L21/321 ,  H01L21/32134

摘要： There is disclosed a processing solution for metal replacement for metal aluminum or an aluminum alloy. The processing solution is used for surface processing of an underlying aluminum material. The processing solution for metal replacement removes an oxide film on the underlying aluminum material and suppresses corrosive attack to it to allow a plating film having high smoothness and good plating appearance to be deposited on the underlying aluminum material. The processing solution for metal replacement at least includes a metal salt capable of being replaced with aluminum, and an alkaline compound. A quaternary ammonium hydroxide is contained in the processing solution for metal replacement as the alkaline compound.

摘要翻译： 公开了用于金属铝或铝合金的金属替换的处理溶液。 该处理溶液用于下面的铝材料的表面处理。 用于金属替换的处理溶液除去下面的铝材料上的氧化物膜，并且抑制其腐蚀性，使得具有高平滑度和良好电镀外观的镀膜沉积在下面的铝材料上。 用于金属置换的处理溶液至少包括能够被铝替代的金属盐和碱性化合物。 在作为碱性化合物的金属替代用处理液中含有季铵氢氧化物。

公开(公告)号：US20110268885A1

公开(公告)日：2011-11-03

申请号：US13185181

申请日：2011-07-18

申请人： Hiroki Uchida ,  Kazuki Yoshikawa ,  Toshiaki Shibata

发明人： Hiroki Uchida ,  Kazuki Yoshikawa ,  Toshiaki Shibata

IPC分类号： B05D7/14 ,  C23G1/02 ,  B05D3/10

CPC分类号： C23G1/22 ,  C09K13/02 ,  C23C18/54

摘要： A solution for removing an aluminum oxide film from an aluminum or aluminum alloy surface, which includes a salt or oxide of a metal capable of substituting aluminum, a solubilizing agent for ions of the metal, and an alkali, and which has a pH of 10 to 13.5.The removing solution makes it possible to form a film of the metal derived from the metal salt or oxide contained in the removing solution by dissolving away the oxide film from the aluminum or aluminum alloy surface at a low temperature and a high speed while restraining, as securely as possible, erosion of the aluminum or aluminum alloy surface. Besides, the removing solution ensures that even in the case where the thickness of the aluminum or aluminum alloy basis material is very small, the aluminum or aluminum alloy surface can be activated while assuredly leaving the aluminum or aluminum alloy basis material.

摘要翻译： 一种从铝或铝合金表面除去氧化铝膜的方法，其包括能够代替铝的金属的盐或氧化物，金属离子的增溶剂和碱，并且其pH为10 至13.5。 除去溶液使得可以通过在低温和高速下从铝或铝合金表面中除去氧化膜而形成由金属盐衍生的金属或衍生自除去溶液中的氧化物的膜，同时抑制作为 尽可能安全地侵蚀铝或铝合金表面。 此外，除去溶液确保即使在铝或铝合金基材的厚度非常小的情况下，铝或铝合金表面也可以被激活，同时确保留下铝或铝合金基材。

公开(公告)号：US07551435B2

公开(公告)日：2009-06-23

申请号：US11898254

申请日：2007-09-11

申请人： Jun Taniguchi ,  Hiroki Uchida ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date ,  Masatomo Asano ,  Nobuhiro Nanri

发明人： Jun Taniguchi ,  Hiroki Uchida ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date ,  Masatomo Asano ,  Nobuhiro Nanri

IPC分类号： H05K7/20 ,  H01L23/36

CPC分类号： H01L23/473 ,  G06F1/203 ,  G06F2200/201 ,  H01L2924/0002 ,  H01L2924/00

摘要： Electronic components differing in height (a CPU 2a, a capacitor 2b, and coil elements 2c) are mounted on a printed circuit board 1. A heat-absorbing member 3 is provided above the printed circuit board 1 in such a way that the member 3 contacts not only the top surface of the CPU 2a that is the shortest but the sides of the capacitor 2b and the coil elements 2c. To circulate a cooling medium, a flow path 4 is formed in the heat-absorbing member 3. Heat generated at the CPU 2a is transmitted from its top surface to the cooling medium in the flow path 4 via the heat-absorbing member 3; heat generated at the capacitor 2b and the coil elements 2c is transmitted from their sides to the cooling medium in the flow path 4 via the heat-absorbing member 3.

摘要翻译： 高度不同的电子元件（CPU2a，电容器2b和线圈元件2c）安装在印刷电路板1上。在印刷电路板1的上方设有吸热元件3，使得元件3 不仅接触CPU 2a的最短但电容器2b和线圈元件2c的侧面的顶表面。 为了循环冷却介质，在吸热部件3中形成有流路4.在CPU2a产生的热量经由吸热部件3从流路4的顶面向冷却介质传递。 在电容器2b和线圈元件2c处产生的热量经由吸热构件3从侧面传递到流路4中的冷却介质。

公开(公告)号：US20090133782A1

公开(公告)日：2009-05-28

申请号：US12313875

申请日：2008-11-24

申请人： Hiroki Uchida ,  Kazuki Yoshikawa ,  Toshiaki Shibata

发明人： Hiroki Uchida ,  Kazuki Yoshikawa ,  Toshiaki Shibata

IPC分类号： C23C22/56

CPC分类号： C23C22/66 ,  C23C18/1601 ,  C23C18/54 ,  C23C22/83 ,  H01L21/321 ,  H01L21/32134

摘要： There is disclosed a processing solution for metal replacement for metal aluminum or an aluminum alloy. The processing solution is used for surface processing of an underlying aluminum material. The processing solution for metal replacement removes an oxide film on the underlying aluminum material and suppresses corrosive attack to it to allow a plating film having high smoothness and good plating appearance to be deposited on the underlying aluminum material. The processing solution for metal replacement at least includes a metal salt capable of being replaced with aluminum, and an alkaline compound. A quaternary ammonium hydroxide is contained in the processing solution for metal replacement as the alkaline compound.

摘要翻译： 公开了用于金属铝或铝合金的金属替换的处理溶液。 该处理溶液用于下面的铝材料的表面处理。 用于金属替换的处理溶液除去下面的铝材料上的氧化物膜，并且抑制其腐蚀性，使得具有高平滑度和良好电镀外观的镀膜沉积在下面的铝材料上。 用于金属置换的处理溶液至少包括能够被铝替代的金属盐和碱性化合物。 在作为碱性化合物的金属替代用处理液中含有季铵氢氧化物。

公开(公告)号：US07502227B2

公开(公告)日：2009-03-10

申请号：US11085483

申请日：2005-03-22

申请人： Hiroki Uchida ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

发明人： Hiroki Uchida ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

IPC分类号： H05K7/20

CPC分类号： G06F1/203 ,  G06F2200/201

摘要： A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

摘要翻译： 具有MPU元件的第一壳体中的主体流动路径分别与形成在内部散热板和外部散热板中的内部流路和外部流路连通，并且泵驱动冷却液体在 这些流路。 在设置在第二壳体中的枢轴和设置在内部散热板中的枢轴之间布置有梁，在内部散热板的枢轴与设置在外部散热板中的枢轴之间布置有梁， 并且内部散热板和外部散热板可移动到第二壳体。 根据打开第二壳体的操作，第二壳体和内部散热板之间的距离以及内部流路和外部流路之间的距离增加。

公开(公告)号：US20080206008A1

公开(公告)日：2008-08-28

申请号：US12115165

申请日：2008-05-05

申请人： Akira ONOSE ,  Hiroki Uchida

发明人： Akira ONOSE ,  Hiroki Uchida

IPC分类号： B23C1/20

CPC分类号： B27C5/10 ,  Y10T409/306608 ,  Y10T409/308176 ,  Y10T409/308624

摘要： A power tool including: a base slidable on a workpiece, and an opening provided through the base; a main unit supported to the base and movable in a first direction substantially perpendicular to the base, the main unit including an electric motor; a cutter driven by the electric motor, the cutter being capable of protruding through the opening from the base; a stopper pole supported to a housing coupled to the main unit, the stopper pole being movable in the first direction, the stopper pole having one end protruding from the housing toward the base, thereby regulating a moving distance of the cutter; a digital display unit including a moving distance detection portion for detecting a moving distance of the stopper pole and a digital display portion for displaying the moving distance; and a dust prevention member provided between a part of the stopper pole protruding toward the base and the moving distance detection portion, thereby preventing dust from entering into the housing.

摘要翻译： 一种电动工具，包括：可在工件上滑动的基座和通过所述基座设置的开口; 支撑在所述基座上的主单元，其基本上垂直于所述基座的第一方向移动，所述主单元包括电动机; 由电动机驱动的切割器，切割器能够从基部穿过开口突出; 支撑在与主单元相连的壳体上的止动杆，止动杆可沿第一方向移动，止动杆的一端从壳体向基座突出，从而调节切割器的移动距离; 数字显示单元，包括用于检测止动杆的移动距离的移动距离检测部分和用于显示移动距离的数字显示部分; 以及设置在朝向底座突出的止挡杆的一部分与移动距离检测部之间的防尘部件，从而防止灰尘进入壳体。

公开(公告)号：US20060038285A1

公开(公告)日：2006-02-23

申请号：US10991395

申请日：2004-11-19

申请人： Hideshi Tokuhira ,  Hiroaki Date ,  Hiroki Uchida ,  Minoru Ishinabe

发明人： Hideshi Tokuhira ,  Hiroaki Date ,  Hiroki Uchida ,  Minoru Ishinabe

IPC分类号： H01L23/34

CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A small-size and light-weight electronic apparatus with a cooling structure capable of exhibiting good cooling performance is provided. A cover member with a plurality of grooves for forming a channel is joined by brazing to a housing on a lid body side to which an LCD panel is attached, and these grooves are covered with the housing to form a channel for circulating a coolant. The housing constitutes a part of the channel, and the channel for the coolant is integrated into the housing. Heat generated by a main body is transferred to the lid body side by the coolant and dissipated outside through the housing that performs the function of a heat-radiation plate.

摘要翻译： 提供了具有能够表现出良好冷却性能的冷却结构的小型和轻量级的电子设备。 具有用于形成通道的多个槽的盖构件通过钎焊连接到安装有LCD面板的盖体侧的壳体，并且这些槽被壳体覆盖以形成用于使冷却剂循环的通道。 壳体构成通道的一部分，并且用于冷却剂的通道被集成到壳体中。 由主体产生的热量通过冷却剂被转移到盖主体侧，并通过外壳散发，从而发挥散热板的功能。

公开(公告)号：US06867378B2

公开(公告)日：2005-03-15

申请号：US10078424

申请日：2002-02-21

申请人： Hiroki Uchida ,  Masayuki Ochiai

发明人： Hiroki Uchida ,  Masayuki Ochiai

IPC分类号： B23K1/00 ,  B23K35/02 ,  B23K35/22 ,  B23K35/26 ,  H05K3/34 ,  H05K1/16

CPC分类号： B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  H05K3/3421 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0218

摘要： A solder paste contains a solder alloy powder and a metal powder dispersed in a flux. The solder alloy contains Sn and Zn, whereas the metal powder contains at least one element selected from the group consisting of Pd, Ti, and Ni. Preferably, the metal powder is contained in an amount exceeding the solubility limit of the metal powder with respect to the solder alloy at the melting point of the solder alloy powder. The solder paste may be used to form a structure for electrically connecting two objects by interposing a solder layer between their terminals.

摘要翻译： 焊膏含有分散在焊剂中的焊料合金粉末和金属粉末。 焊料合金含有Sn和Zn，而金属粉末含有选自Pd，Ti和Ni中的至少一种元素。 优选地，在焊料合金粉末的熔点，金属粉末的含量超过金属粉末相对于焊料合金的溶解度极限的量。 焊膏可以用于形成用于通过在其端子之间插入焊料层来电连接两个物体的结构。

公开(公告)号：US06662345B2

公开(公告)日：2003-12-09

申请号：US10155115

申请日：2002-05-28

申请人： Hiroki Uchida ,  Yasuo Yamagishi

发明人： Hiroki Uchida ,  Yasuo Yamagishi

IPC分类号： G06F1750

CPC分类号： G06F17/50 ,  G06F17/5018 ,  G06F17/5036 ,  G06F17/5072 ,  G06F2217/80 ,  H05K3/0005 ,  H05K3/3494

摘要： A thermal analysis in heating a print-circuit board in a reflowing furnace is simulated by a processor using data required for the design and thermal analysis of the printed-circuit board that carries solder-bonded components. The result of simulation indicates the possibility of existence of unmelted solder bonds heated at peak temperature below a predetermined lower limit and solder bonds heated at temperature above a predetermined upper limit. On the basis of the result, the components that are likely to be heated at inapplicable temperature are redesigned so that they can actually be heated at temperature in the predetermined range. The modification of design is displayed.

公开(公告)号：US06461953B1

公开(公告)日：2002-10-08

申请号：US09762478

申请日：2001-02-07

申请人： Seiki Sakuyama ,  Hiroki Uchida

发明人： Seiki Sakuyama ,  Hiroki Uchida

IPC分类号： H01L2144

CPC分类号： H05K3/3484 ,  H01L21/4853 ,  H01L2224/16225 ,  H01L2224/81 ,  H01L2924/014 ,  H05K3/3452 ,  H05K3/3468 ,  H05K2201/10734 ,  H05K2203/0191 ,  H05K2203/0264 ,  H05K2203/043 ,  H05K2203/044 ,  H05K2203/0568 ,  H05K2203/0577

摘要： A solder bump forming method includes the steps of packing solder (5) into a plurality of recesses (11) provided to the surface layer (12) of a substrate (1); and melting/hardening the solder to form solder bumps (5A) within the recesses (11). The solder bump forming method further includes, prior to the step of packing solder (5) into the plurality of recesses (11), a step of adhering or arranging a film (4) over the surface layer (12), and a step of producing in the film (4) a plurality of window portions (40) communicating with the plurality of recesses. The film (4) is composed of a material principal component of which is different from the material of the substrate (1).

摘要翻译： 焊料凸点形成方法包括以下步骤：将焊料（5）包装到设置在基板（1）的表面层（12）上的多个凹部（11）中; 并且熔化/硬化所述焊料以在所述凹部（11）内形成焊料凸块（5A）。 焊料凸点形成方法还包括在将焊料（5）填充到多个凹部（11）中的步骤之前，将表面层（12）上的膜（4）附着或配置的步骤，以及 在所述膜（4）中产生与所述多个凹部连通的多个窗口部分（40）。 膜（4）由材料的主要成分与基板（1）的材料不同而构成。