Abstract:
A method comprises generating a data set comprising first surface roughness data from a first orientation and second surface roughness data from a second orientation and determining a roughness bias parameter from the first surface roughness data and the second surface roughness data.
Abstract:
In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target radiation onto an edge surface of a wafer, the radiation targeting assembly comprising a first expanded paraboloid or expanded ellipsoid reflector positioned adjacent the edge surface of the wafer, a reflected radiation collecting assembly that collects radiation reflected from the surface, a signal processing module to generate surface parameter data from the reflected radiation, and a defect detection module to analyze the surface parameter data to detect a defect on the surface.
Abstract:
In one embodiment, a system to measure defects on a surface of a wafer and an edge of the wafer using a single tool comprises a scatterometer to identify at least one defect region on the surface and a surface profile height measuring tool to measure one or more characteristics of the surface in the defect region with a surface profile height measuring tool.
Abstract:
In one embodiment, a system to inspect a surface comprises an assembly to direct a first radiation beam onto a surface in a first plane of incidence, a first detector to generate a first signal from a portion of the radiation reflected from the first radiation beam, a first spatial filter interposed between the surface and the first detector, a first ellipsoidal mirror to collect scattered light, a second detector to generate a second signal from the scattered portion of the beam, and a processor to generate, from the first and second signals, a data set representing one or more characteristics of the surface using the first and second signals.
Abstract:
A system to detect pits in a surface comprises first and second radiation targeting assemblies to target a second radiation beam onto a surface, a first radiation collecting assembly that collects radiation scattered from the surface, a processor coupled to the first radiation collecting assembly, a memory module coupled to the processor and comprising logic instructions which, when executed by the processor, configure the processor to generate a first signal from radiation scattered from the first radiation beam, generate a second signal from radiation scattered from the second radiation beam, record the first signal and the second signal at an array of different positions on the surface, calculate a median value for the first signal and the second signal over the array of different positions on the surface, and use the first signal, the second signal, and the median value to detect pits in the surface.
Abstract:
A material independent optical profilometer system and method for measuring at least one of either a height or a slope of an object such as a thin film disk, a silicon wafer, or a glass substrate is disclosed.
Abstract:
A double-sided optical inspection system is presented which may detect and classify particles, pits and scratches on thin film disks or wafers in a single scan of the surface. In one embodiment, the invention uses a pair of orthogonally oriented laser beams, one in the radial and one in the circumferential direction on both surfaces of the wafer or thin film disk. The scattered light from radial and circumferential beams is separated via their polarization or by the use of a dichroic mirror together with two different laser wavelengths.
Abstract:
In one embodiment, a system to inspect an edge region of a wafer, comprises a surface analyzer assembly comprising a radiation targeting assembly that targets a radiation beam onto a surface of the wafer; a reflected radiation collection assembly to collect radiation reflected from a surface of the wafer; means for rotating the surface analyzer assembly about an edge surface of the wafer; and means for detecting one or more defects in the edge region of the wafer.
Abstract:
In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target a radiation beam onto a surface; and a reflected radiation collecting assembly that collects radiation reflected from the surface, wherein the reflected radiation collecting assembly comprises a mirror to collect radiation reflected from the surface.
Abstract:
A magneto-optical clock head is disclosed. The magneto-optical clock head allows a longitudinally recorded clock track to be read from a disk surface from a position outside of a head-disk assembly (HDA). The clock track has sections of alternating magnetization which define transitions. Importantly, the magneto-optical clock head is used to sense the transitions using the transverse Kerr effect, as opposed to the longitudinal Kerr effect as used in one prior technique. In one embodiment, the magneto-optical clock head includes a light source for generating a p-polarized beam which is aligned in such a manner that it strikes the clock track. A reflected beam is then produced which has an intensity that varies based upon the direction of the magnetization of the sections of alternating magnetization of the clock track due to the transverse Kerr effect. A detector is provided to detect the intensity variations in the reflected beam and to ultimately generate a clock signal which is provided to transducers to allow them to appropriately write servo information onto their respective disk surfaces. A method for optically reading a clock signal stored within a clock track which is written onto a disk surface that is located within a head disk assembly of a disk drive is also provided.