摘要:
A ferroelectric memory comprises a first transistor connected between N1 and N2 nodes, a second transistor connected between the N2 node and an N3 node, a first transistor connected between P1 and P2 nodes, a second transistor connected between the P2 node and a P3 node, a first wiring formed in a first wiring layer to interconnect the N1 node and the P1 node, a second wiring formed in the first wiring layer to interconnect the N3 node and the P3 node, a third wiring formed in a second wiring layer different from the first wiring layer to interconnect the N2 node and the P2 node, a first capacitor whose first electrode is connected to the first wiring, and a second capacitor whose first electrode is connected to the second wiring. Second electrodes of the first and second capacitors are both connected to the N2 node or the P2 node.
摘要:
A semiconductor memory according to an example of the present invention comprises first and second bit lines having a twisted bit-line architecture in which the first and second bit lines are alternately twisted at a constant period in first and second columns, a first cell block which is disposed in the first column, a first block select transistor which is connected between the first or second bit line and one end of the first cell block, a second cell block which is disposed in the second column, and a second block select transistor which is connected between the second or first bit line and one end of the second cell block.
摘要:
In a semiconductor wafer (1), an internal circuit such as a ROM formed at a product region or a chip (2) can be tested via a test pad (5) formed on a scribe line (3). Here, since the test pad (5) is formed on the scribe line (3), after the semiconductor wafer has been once cut off and separated away from each other as chips along the scribe lines (3), respectively, since the test pads (5) are all broken off, ROM test will not be executed again. In other words, since the test conditions of the product test of the separated chip (2) cannot be decoded or deciphered by another person, it is possible to provide a semiconductor device of high secrecy, which can be preferably used as an IC card.
摘要:
A plurality of erase circuits are provided for the blocks BLK(0) to BLK(n), each for one block. Protect circuits are connected to the erase circuits, respectively. The protects circuits generate protect signals PROT0 to PROTn, respectively. Each protect signal indicates whether the protect circuit is set in protect mode or not. Each erase circuit receives the protect signal from the protect circuit connected to it. A unit provided in the erase circuit determines, from the protect signal, whether the protect circuit is set in the protect mode. The unit changes the voltage applied to the sources of the memory cells of the cell block connected to the erase circuit, in accordance with whether the protect circuit is set in the protect mode or not. When a voltage is applied to the sources of the memory cells, a data item of a logic value is read from each memory cell. When a different voltage is applied to the sources of the memory cells, a data item of the other logic value is read from each memory cell. Hence, whether or not the protect circuits are set in protect mode can be determined, without erasing or writing data in the block of the memory cell array.
摘要:
A non-volatile semiconductor memory having: a memory cell array having non-volatile memory cells disposed in a matrix form, each memory cell having a floating gate, a control gate, an erase gate, a source and a drain, and data being written through injection of electrons into the floating gate and erased through removal of electrons from the floating gate; and a peripheral circuit driven by a high voltage power source and a low voltage power source, predetermined voltages being applied to the control gate, erase gate and drain respectively of each memory cell to enter one of a data write mode, data erase mode and data read mode, in the data write mode, high voltages being applied to the control gate and drain of the memory cell to be data-written, a stress relaxing voltage being applied to each erase gate of memory cells not to be data-written, and the stress relaxing voltage being an intermediate voltage between the voltages of the high and low power sources.
摘要:
A non-volatile semiconductor memory having: a memory cell array having non-volatile memory cells disposed in a matrix form, each memory cell having a floating gate, a control gate, an erase gate, a source and a drain, and data being written through injection of electrons into the floating gate and erased through removal of electrons from the floating gate; and a peripheral circuit driven by a high voltage power source and a low voltage power source, predetermined voltages being applied to the control gate, erase gate and drain respectively of each memory cell to enter one of a data write mode, data erase mode and data read mode, in the data write mode, high voltages being applied to the control gate and drain of the memory cell to be data-written, a stress relaxing voltage being applied to each erase gate of memory cells not to be data-written, and the stress relaxing voltage being an intermediate voltage between the voltages of the high and low power sources.
摘要:
A comparator compares data read out by a sensing amplifier with input data, and outputs equality data when both of the data are equal to each other, while the comparator outputs inequality data when both of the data are not equal to each other. When the comparator outputs inequality data for at least one time within a predetermined period decided by a control signal, the latch circuit latches and keeps outputting the inequality data. The latch circuit latches and outputs equality data when the comparator continuously outputs equality data within the period. Within the period decided by the control signal, the determination circuit determines whether or not writing has been completed on the basis of output data of the latch circuit. The re-write signal generator circuit sends a re-write signal to a write circuit when the determination circuit determines that writing is not yet completed.
摘要:
A process for producing dichloroacetaldehyde hydrate together with chloral from acetaldehyde or para-aldehyde. The process comprises a step of chlorinating acetaldehyde or para-aldehyde to obtain a chlorinated solution containing dichloroacetaldehyde as a major component, a step of distilling this chlorinated solution to obtain a distillate having a boiling point of 90.degree.-100.degree. C. and containing 50% or more of dichloroacetaldehyde, a step of adding water to this distillate, crystallizing dichloroacetaldehyde hydrate, and separating the crystals, and a step of chlorinating the remaining aldehyde components into chloral. The process enables dichloroacetaldehyde hydrate to be separated at a high purity and the raw materials to be utilized efficiently.
摘要:
A process for manufacturing monochloroacetaldehyde trimer and chloral together by effectively utilizing a raw material acetaldehyde or para-aldehyde. The process comprises a step of chlorinating acetaldehyde or para-aldehyde to produce a chlorinated liquid of which the major component is monochloroacetaldehyde, a step comprising adding chloral to said chlorinated liquid and distilling the mixture to obtain a fraction of which the major components are monochloroacetaldehyde and chloral, a step of trimerizing monochloroacetaldehyde by reacting said fraction in the presence of a trimerization catalyst and separating the MCA trimer by filtration, and a step of chlorinating other fractions from said distillation step and the filtrate from said trimerization step to produce chloral. According to this process all raw material aldehydes and components derived from aldehydes which have not been consumed for the production of MCA trimer can be easily converted into chloral which is useful as an industrial chemical. The process is also free from the problem of the waste water treatment.
摘要:
Source and drain regions of a second conductivity type are formed in a stripe form in the surface area of a semiconductor substrate of a first conductivity type. A first insulation film is formed on the source and drain regions of the substrate. A second thin insulation film having a tunnel effect is formed on that part of the substrate which lies between the source and drain regions. A floating gate is formed on the second insulation film. A third insulation film is formed on the first insulation film, the floating gate and that part of the substrate which lies between the source and drain regions and on which the second insulation film is not formed. A control gate is formed on the third insulation film in a stripe form extending in a direction which intersects the source and drain regions. An impurity region of the first conductivity type having an impurity concentration higher than the substrate is formed in the substrate except the source and drain regions and the portions lying below the control gate. A floating gate transistor is constituted to include the substrate, source and drain regions, second insulation film, floating gate, third insulation film and control gate. An offset transistor is constituted to include the substrate, source and drain regions, third insulation film and control gate. The first insulation film and the impurity region are used as an element isolation region of a memory cell.