摘要:
A non-volatile semiconductor memory having: a memory cell array having non-volatile memory cells disposed in a matrix form, each memory cell having a floating gate, a control gate, an erase gate, a source and a drain, and data being written through injection of electrons into the floating gate and erased through removal of electrons from the floating gate; and a peripheral circuit driven by a high voltage power source and a low voltage power source, predetermined voltages being applied to the control gate, erase gate and drain respectively of each memory cell to enter one of a data write mode, data erase mode and data read mode, in the data write mode, high voltages being applied to the control gate and drain of the memory cell to be data-written, a stress relaxing voltage being applied to each erase gate of memory cells not to be data-written, and the stress relaxing voltage being an intermediate voltage between the voltages of the high and low power sources.
摘要:
A non-volatile semiconductor memory having: a memory cell array having non-volatile memory cells disposed in a matrix form, each memory cell having a floating gate, a control gate, an erase gate, a source and a drain, and data being written through injection of electrons into the floating gate and erased through removal of electrons from the floating gate; and a peripheral circuit driven by a high voltage power source and a low voltage power source, predetermined voltages being applied to the control gate, erase gate and drain respectively of each memory cell to enter one of a data write mode, data erase mode and data read mode, in the data write mode, high voltages being applied to the control gate and drain of the memory cell to be data-written, a stress relaxing voltage being applied to each erase gate of memory cells not to be data-written, and the stress relaxing voltage being an intermediate voltage between the voltages of the high and low power sources.
摘要:
Source and drain regions of a second conductivity type are formed in a stripe form in the surface area of a semiconductor substrate of a first conductivity type. A first insulation film is formed on the source and drain regions of the substrate. A second thin insulation film having a tunnel effect is formed on that part of the substrate which lies between the source and drain regions. A floating gate is formed on the second insulation film. A third insulation film is formed on the first insulation film, the floating gate and that part of the substrate which lies between the source and drain regions and on which the second insulation film is not formed. A control gate is formed on the third insulation film in a stripe form extending in a direction which intersects the source and drain regions. An impurity region of the first conductivity type having an impurity concentration higher than the substrate is formed in the substrate except the source and drain regions and the portions lying below the control gate. A floating gate transistor is constituted to include the substrate, source and drain regions, second insulation film, floating gate, third insulation film and control gate. An offset transistor is constituted to include the substrate, source and drain regions, third insulation film and control gate. The first insulation film and the impurity region are used as an element isolation region of a memory cell.
摘要:
A memory cell array is divided into a plurality of blocks. In altering data for a block (selected block), a moderating voltage is applied to the source or control gate of a memory cell in another block (non-selected block) to moderate stress between the floating gate and source/drain, thereby preventing write error and erase error. In the program operation, the source and drain of a memory cell in the non-selected block are equalized to moderate an electric field between the control gate and source/drain and not to flow a channel current, thereby preventing write error. In carrying out a negative voltage erase method, prior to setting the source line and word line of a cell in a non-selected block to an erase voltage, the source and word lines are equalized. The equalization operation is released after the erase operation, thereby preventing malfunction of a non-selected cell.
摘要:
Source and drain regions of a second conductivity type are formed in a stripe form in the surface area of a semiconductor substrate of a first conductivity type. A first insulation film is formed on the source and drain regions of the substrate. A second thin insulation film having a tunnel effect is formed on that part of the substrate which lies between the source and drain regions. A floating gate is formed on the second insulation film. A third insulation film is formed on the first insulation film, the floating gate and that part of the substrate which lies between the source and drain regions and on which the second insulation film is not formed. A control gate is formed on the third insulation film in a stripe form extending in a direction which intersects the source and drain regions. An impurity region of the first conductivity type having an impurity concentration higher than the substrate is formed in the substrate except the source and drain regions and the portions lying below the control gate. A floating gate transistor is constituted to include the substrate, source and drain regions, second insulation film, floating gate, third insulation film and control gate. An offset transistor is constituted to include the substrate, source and drain regions, third insulation film and control gate. The first insulation film and the impurity region are used as an element isolation region of a memory cell.
摘要:
An memory cell array includes a plurality of electrically erasable and programmable memory cell transistors which are arranged in a matrix form and each of which includes a source region, drain region, floating gate, erasing gate and control gate. The patterns of the control gates and the source regions in the memory cell array are arranged in parallel along the row direction of the memory cell array and the patterns of the erasing gates are arranged to extend in the column direction of the memory cell array. The memory cell transistors in the memory cell array are selected by a row decoder and a column decoder. An erasing circuit functions to erase memory data of each memory cell transistor by applying an erasing potential to the erasing gate of the memory cell transistor. A source potential generation circuit applies a first potential for programming and readout to the source region of a memory cell transistor selected by the row and column decoders when data is programmed into or read out from the selected memory cell transistor and applies a second potential which is higher than the first potential and lower than the erasing potential to the source region of each memory cell transistor when memory data of each memory cell transistor is erased by the erasing circuit. A potential difference between the source region and the erasing gate of the memory cell transistor in the erasing mode is reduced by the second potential output from the source potential generation circuit.
摘要:
A nonvolatile semiconductor memory includes a cell array in which electrically erasable programmable nonvolatile semiconductor memory cells, each using a cell transistor having source and drain regions in a semiconductor substrate, and a gate electrode with a three-layered structure on the semiconductor substrate are arranged in a matrix form. In the gate electrode having the three-layered structure, a first-layer floating gate electrode opposes a semiconductor substrate surface through a first gate insulating film, and a second- or third-layer gate electrode serves as one of erase and control gate electrodes. The erase gate electrode opposes a part of the floating gate electrode through a tunnel insulating film, and the control gate electrode opposes the floating gate electrode through a second gate insulating film. The erase and control gate electrodes are arranged to be parallel to each other, and to be perpendicular to the source and drain regions. Of two cell transistors adjacent to each other in a length direction of the channel region, the source region of one cell transistor is common to the drain region of the other cell transistor, and the cell transistors adjacent to each other in the widthwise direction of the channel region are element-isolated by an element isolation region formed in the semiconductor substrate between the channel regions.
摘要:
The time required for the program verify and erase verify operations can be shortened. The change of threshold values of memory cells can be suppressed even if the write and erase operations are executed repetitively. After the program and erase operations, whether the operations were properly executed can be judged simultaneously for all bit lines basing upon a change, after the pre-charge, of the potential at each bit line, without changing the column address. In the data rewrite oepration, the rewrite operation is not effected for a memory cell with the data once properly written, by changing the data in the data register.
摘要:
The time required for the program verify and erase verify operations can be shortened. The change of threshold values of memory cells can be suppressed even if the write and erase operations are executed repetitively. After the program and erase operations, whether the operations were properly executed can be judged simultaneously for all bit lines basing upon a change, after the pre-charge, of the potential at each bit line, without changing the column address. In the data rewrite operation, the rewrite operation is not effected for a memory cell with the data once properly written, by changing the data in the data register.
摘要:
When an erase voltage is applied to the sources of data erasable and rewritable memory cells each having a floating gate, the erasure characteristics of the memory cells can be improved by controlling the rise time of the erase voltage or by increasing the erase voltage stepwise. In test mode, no row lines are selected by a row decoder and further the sources of the respective memory cells are set to ground level. Under these conditions, in case there exists an overerased memory cell, this cell is turned on due to depletion, so that it is possible to detect the presence of the overerased memory cell on the basis of change in potential of the column line connected to this turned on memory cell. A differential amplifier is used to detect the change in potential of the column line. In the test mode, the potential of the column lines is compared with a reference potential applied to a dummy column line, and a source bias generating circuit applies a test potential suitable for test to the respective sources of the cells, to shift the threshold level of the respective cells in a positive direction, for instance. By applying this test potential to the cells, it is possible to detect the pseudo-threshold level shifted in the positive direction; that is, to detect the overerased status of the memory cell more properly.