公开(公告)号：US06222258B1

公开(公告)日：2001-04-24

申请号：US09102005

申请日：1998-06-22

申请人： Yuichi Asano ,  Hitoshi Kobayashi ,  Katsunori Wako

发明人： Yuichi Asano ,  Hitoshi Kobayashi ,  Katsunori Wako

IPC分类号： H01L23495

CPC分类号： H01L23/4334 ,  H01L23/49541 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2924/00012

摘要： A method for producing a semiconductor device includes: a) an attaching process in which a flat-plate member is positioned on a flat-shape lead frame provided with a plurality of leads and a plurality of support bars so that the flat-plate member contacts at least the plurality of leads, and the flat-plate member is attached to plurality of support bars; b) an element mounting process in which a semiconductor element is mounted on the flat-plate member attached to the plurality of support bars of the flat-shape lead frame; c) a wire-bonding process in which a wire is provided between each of the plurality of leads and the semiconductor element; and d) a separating process, performed after the completion of the wire-bonding process, in which the plurality of support bars are deformed so as to separate the flat-plate member and the plurality of leads and electrically disconnect or separate the flat-plate member from the plurality of leads.

摘要翻译： 一种半导体器件的制造方法，其特征在于，包括：a）平板部件位于设置有多个引线和多个支撑杆的扁平状引线框架上的安装工序，使得所述平板部件接触 至少所述多个引线，并且所述平板构件附接到多个支撑杆; b）元件安装工艺，其中将半导体元件安装在平板形元件上，该平板元件安装在平板形引线框架的多个支撑杆上; c）引线接合工艺，其中在所述多个引线和所述半导体元件中的每一个之间设置导线; 以及d）分离处理，其在所述引线接合工艺完成之后进行，其中所述多个支撑杆变形，以便分离所述平板部件和所述多个引线，并且将所述平板 来自多个线索的成员。

公开(公告)号：US06199525B1

公开(公告)日：2001-03-13

申请号：US09166062

申请日：1998-10-02

申请人： Hitoshi Uema ,  Yuichi Asano

发明人： Hitoshi Uema ,  Yuichi Asano

IPC分类号： F01L102

CPC分类号： F01L1/02 ,  F01L1/022 ,  F01L1/024 ,  F01L1/026 ,  F01L1/46 ,  F02B75/20 ,  F02B2075/027 ,  F02B2075/182 ,  F02B2275/20

摘要： A camshaft drive arrangement for an internal combustion engine wherein the drive includes first and second intermediate shafts journaled directly within the cylinder block. The first intermediate shaft is driven directly to the crankshaft and the second intermediate shaft is driven from the first intermediate shaft by a flexible transmitter drive. The second intermediate shaft drives a camshaft journaled in the cylinder head by a second flexible transmitter drive.

摘要翻译： 一种用于内燃机的凸轮轴驱动装置，其中驱动器包括直接在气缸体内轴颈的第一和第二中间轴。 第一中间轴被直接驱动到曲轴，并且第二中间轴由第一中间轴由柔性发射器驱动驱动。 第二中间轴通过第二柔性发射器驱动器驱动在气缸盖中轴颈的凸轮轴。

公开(公告)号：US5929513A

公开(公告)日：1999-07-27

申请号：US886013

申请日：1997-06-30

申请人： Yuichi Asano ,  Akihiro Kubota ,  Koichi Sibasaki ,  Kazuhiro Yonetake ,  Tsuyoshi Aoki

发明人： Yuichi Asano ,  Akihiro Kubota ,  Koichi Sibasaki ,  Kazuhiro Yonetake ,  Tsuyoshi Aoki

IPC分类号： H01L23/433 ,  H01L23/495 ,  H01L23/28 ,  H01L23/10

CPC分类号： H01L23/4334 ,  H01L23/49548 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3011

摘要： The present invention relates to a semiconductor device in which inner leads of a lead frame are electrically connected to a semiconductor chip, a method for producing thereof and a lead frame used therein. The object of the present invention is to improve a strength of the lead frame and a heat release efficiency in a small-size multi-pin type semiconductor device. In the inner lead of the lead frame, a thin plate portion is formed. The thin plate portions are secured on a heat spreader. A semiconductor chip is mounted on the heat spreader. The semiconductor chip is bonded to the thin plate portions of the inner leads through wires.

摘要翻译： 本发明涉及一种半导体器件，其中引线框架的内部引线电连接到半导体芯片，其制造方法和其中使用的引线框架。 本发明的目的在于提高小型多针式半导体装置的引线框架的强度和散热效率。 在引线框架的内引线中形成薄板部分。 薄板部分固定在散热器上。 半导体芯片安装在散热器上。 半导体芯片通过导线结合到内引线的薄板部分。

公开(公告)号：US5834831A

公开(公告)日：1998-11-10

申请号：US609840

申请日：1996-03-01

申请人： Akihiro Kubota ,  Yuichi Asano ,  Koichi Sibasaki ,  Kazuhiro Yonetake ,  Tsuyoshi Aoki ,  Akira Takashima

发明人： Akihiro Kubota ,  Yuichi Asano ,  Koichi Sibasaki ,  Kazuhiro Yonetake ,  Tsuyoshi Aoki ,  Akira Takashima

IPC分类号： H01L23/433 ,  H01L23/495 ,  H01L23/50

CPC分类号： H01L24/49 ,  H01L23/4334 ,  H01L23/4951 ,  H01L23/49548 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/4813 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/85385 ,  H01L24/45 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3011

摘要： A thin semiconductor device in which a strength of a lead frame and a heat dissipation efficiency can be improved. The semiconductor device has a semiconductor chip, a lead having an inner lead and an a outer lead continuing to the inner lead, said inner lead having a thin plate portion thinner than the other portion therof, said thin plate portion being electrically connected to said semiconductor chip through a wire and said outer lead serving as an outer connecting terminal, and a sealing resin sealing said semiconductor chip and at least a part of said lead, wherin said inner lead of said lead is positioned on said semiconductor chip.

摘要翻译： 可以提高引线框架的强度和散热效率的薄型半导体器件。 半导体器件具有半导体芯片，具有内引线和连接到内引线的外引线的引线，所述内引线具有比其它部分栅极更薄的薄板部分，所述薄板部分电连接到所述半导体 并且所述外引线用作外连接端子，密封树脂密封所述半导体芯片，并且所述引线的至少一部分，所述引线的所述内引线位于所述半导体芯片上。

公开(公告)号：US5693571A

公开(公告)日：1997-12-02

申请号：US669038

申请日：1996-06-24

申请人： Hitoshi Kobayashi ,  Yuichi Asano ,  Kenji Kobayashi ,  Kenichi Sasaki ,  Yuji Sakurai

发明人： Hitoshi Kobayashi ,  Yuichi Asano ,  Kenji Kobayashi ,  Kenichi Sasaki ,  Yuji Sakurai

IPC分类号： H01L23/28 ,  H01L23/32 ,  H01L23/495 ,  H01L23/50 ,  H01L21/60 ,  H01L21/44

CPC分类号： H01L23/49555 ,  H01L23/32 ,  H01L2924/0002

摘要： There is provided a mounting construction which prevents leads of a semiconductor device from being short circuited when the semiconductor device is mounted on a mounting board so that mountability of the semiconductor device is improved. A plurality of outer leads extend from sides of a package of the semiconductor device. A mounting board has a surface on which a plurality of terminals to be electrically connected to the semiconductor device are provided. A mounting member is mounted on the mounting board separately from the semiconductor device. The semiconductor device is attached to the mounting member. The mounting member has a frame member forming a space in which the semiconductor device is placed. A first connecting lead has a first lead connecting portion and a first external connecting portion to be connected to a one of terminals provided on the mounting board. The first external connecting portion extends along a bottom surface of the frame member. A second connecting lead has a second lead connecting portion and a second external connecting portion to be connected to a one of the terminals provided on the mounting board. The second external connecting portion extends along a bottom surface of the frame member. The first external connecting portion and the second external connecting portion are arranged alternately with a predetermined distance apart from each other in a direction along an extending direction of the frame member.

摘要翻译： 提供了一种安装结构，当半导体器件安装在安装板上时，防止半导体器件的引线短路，从而提高了半导体器件的安装能力。 多个外引线从半导体器件的封装的侧面延伸。 安装板具有设置有与半导体器件电连接的多个端子的表面。 安装构件与半导体装置分开地安装在安装板上。 半导体器件附接到安装构件。 安装构件具有形成半导体器件放置的空间的框架构件。 第一连接引线具有第一引线连接部分和第一外部连接部分，以连接到设置在安装板上的端子之一。 第一外部连接部分沿着框架构件的底表面延伸。 第二连接引线具有第二引线连接部分和第二外部连接部分，以连接到设置在安装板上的一个端子。 第二外部连接部分沿着框架构件的底表面延伸。 第一外部连接部分和第二外部连接部分在沿着框架部件的延伸方向的方向上彼此间隔预定距离交替布置。

公开(公告)号：US5557145A

公开(公告)日：1996-09-17

申请号：US401441

申请日：1995-03-09

申请人： Hitoshi Kobayashi ,  Yuichi Asano ,  Kenji Kobayashi ,  Kenichi Sasaki ,  Yuji Sakurai

发明人： Hitoshi Kobayashi ,  Yuichi Asano ,  Kenji Kobayashi ,  Kenichi Sasaki ,  Yuji Sakurai

IPC分类号： H01L23/28 ,  H01L23/32 ,  H01L23/495 ,  H01L23/50 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L23/49555 ,  H01L23/32 ,  H01L2924/0002

摘要： There is provided a mounting construction which prevents leads of a semiconductor device from being short circuited when the semiconductor device is mounted on a mounting board so that mountability of the semiconductor device is improved. A plurality of outer leads extend from sides of a package of the semiconductor device. A mounting board has a surface on which a plurality of terminals to be electrically connected to the semiconductor device are provided. A mounting member is mounted on the mounting board separately from the semiconductor device. The semiconductor device is attached to the mounting member. The mounting member has a frame member forming a space in which the semiconductor device is placed. A first connecting lead has a first lead connecting portion and a first external connecting portion to be connected to a one of terminals provided on the mounting board. The first external connecting portion extends along a bottom surface of the frame member. A second connecting lead has a second lead connecting portion and a second external connecting portion to be connected to a one of the terminals provided on the mounting board. The second external connecting portion extends along a bottom surface of the frame member. The first external connecting portion and the second external connecting portion are arranged alternately with a predetermined distance apart from each other in a direction along an extending direction of the frame member.

摘要翻译： 提供了一种安装结构，当半导体器件安装在安装板上时，防止半导体器件的引线短路，从而提高了半导体器件的安装能力。 多个外引线从半导体器件的封装的侧面延伸。 安装板具有设置有与半导体器件电连接的多个端子的表面。 安装构件与半导体装置分开地安装在安装板上。 半导体器件附接到安装构件。 安装构件具有形成半导体器件放置的空间的框架构件。 第一连接引线具有第一引线连接部分和第一外部连接部分，以连接到设置在安装板上的端子之一。 第一外部连接部分沿着框架构件的底表面延伸。 第二连接引线具有第二引线连接部分和第二外部连接部分，以连接到设置在安装板上的一个端子。 第二外部连接部分沿着框架构件的底表面延伸。 第一外部连接部分和第二外部连接部分在沿着框架部件的延伸方向的方向上彼此间隔预定距离交替布置。