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1.发明授权Method for mounting a semiconductor device by which deformation of leads is prevented 失效用于安装半导体器件的方法，由此防止引线的变形
公开(公告)号：US5693571A
公开(公告)日：1997-12-02
申请号：US669038
申请日：1996-06-24
CPC分类号： H01L23/49555 , H01L23/32 , H01L2924/0002
摘要： There is provided a mounting construction which prevents leads of a semiconductor device from being short circuited when the semiconductor device is mounted on a mounting board so that mountability of the semiconductor device is improved. A plurality of outer leads extend from sides of a package of the semiconductor device. A mounting board has a surface on which a plurality of terminals to be electrically connected to the semiconductor device are provided. A mounting member is mounted on the mounting board separately from the semiconductor device. The semiconductor device is attached to the mounting member. The mounting member has a frame member forming a space in which the semiconductor device is placed. A first connecting lead has a first lead connecting portion and a first external connecting portion to be connected to a one of terminals provided on the mounting board. The first external connecting portion extends along a bottom surface of the frame member. A second connecting lead has a second lead connecting portion and a second external connecting portion to be connected to a one of the terminals provided on the mounting board. The second external connecting portion extends along a bottom surface of the frame member. The first external connecting portion and the second external connecting portion are arranged alternately with a predetermined distance apart from each other in a direction along an extending direction of the frame member.
摘要翻译： 提供了一种安装结构，当半导体器件安装在安装板上时，防止半导体器件的引线短路，从而提高了半导体器件的安装能力。 多个外引线从半导体器件的封装的侧面延伸。 安装板具有设置有与半导体器件电连接的多个端子的表面。 安装构件与半导体装置分开地安装在安装板上。 半导体器件附接到安装构件。 安装构件具有形成半导体器件放置的空间的框架构件。 第一连接引线具有第一引线连接部分和第一外部连接部分，以连接到设置在安装板上的端子之一。 第一外部连接部分沿着框架构件的底表面延伸。 第二连接引线具有第二引线连接部分和第二外部连接部分，以连接到设置在安装板上的一个端子。 第二外部连接部分沿着框架构件的底表面延伸。 第一外部连接部分和第二外部连接部分在沿着框架部件的延伸方向的方向上彼此间隔预定距离交替布置。
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2.发明授权Mounting construction and method of a semiconductor device by which deformation of leads is prevented 失效半导体器件的安装结构和方法可以防止引线的变形
公开(公告)号：US5557145A
公开(公告)日：1996-09-17
申请号：US401441
申请日：1995-03-09
CPC分类号： H01L23/49555 , H01L23/32 , H01L2924/0002
摘要： There is provided a mounting construction which prevents leads of a semiconductor device from being short circuited when the semiconductor device is mounted on a mounting board so that mountability of the semiconductor device is improved. A plurality of outer leads extend from sides of a package of the semiconductor device. A mounting board has a surface on which a plurality of terminals to be electrically connected to the semiconductor device are provided. A mounting member is mounted on the mounting board separately from the semiconductor device. The semiconductor device is attached to the mounting member. The mounting member has a frame member forming a space in which the semiconductor device is placed. A first connecting lead has a first lead connecting portion and a first external connecting portion to be connected to a one of terminals provided on the mounting board. The first external connecting portion extends along a bottom surface of the frame member. A second connecting lead has a second lead connecting portion and a second external connecting portion to be connected to a one of the terminals provided on the mounting board. The second external connecting portion extends along a bottom surface of the frame member. The first external connecting portion and the second external connecting portion are arranged alternately with a predetermined distance apart from each other in a direction along an extending direction of the frame member.
摘要翻译： 提供了一种安装结构，当半导体器件安装在安装板上时，防止半导体器件的引线短路，从而提高了半导体器件的安装能力。 多个外引线从半导体器件的封装的侧面延伸。 安装板具有设置有与半导体器件电连接的多个端子的表面。 安装构件与半导体装置分开地安装在安装板上。 半导体器件附接到安装构件。 安装构件具有形成半导体器件放置的空间的框架构件。 第一连接引线具有第一引线连接部分和第一外部连接部分，以连接到设置在安装板上的端子之一。 第一外部连接部分沿着框架构件的底表面延伸。 第二连接引线具有第二引线连接部分和第二外部连接部分，以连接到设置在安装板上的一个端子。 第二外部连接部分沿着框架构件的底表面延伸。 第一外部连接部分和第二外部连接部分在沿着框架部件的延伸方向的方向上彼此间隔预定距离交替布置。
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公开(公告)号：US5804469A
公开(公告)日：1998-09-08
申请号：US839796
申请日：1997-04-18
申请人： Yuichi Asano , Hitoshi Kobayashi , Katsunori Wako
发明人： Yuichi Asano , Hitoshi Kobayashi , Katsunori Wako
IPC分类号： H01L23/50 , H01L23/433 , H01L23/495 , H01L21/44
CPC分类号： H01L23/4334 , H01L23/49541 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L24/48 , H01L2924/00014 , H01L2924/01029 , H01L2924/01039 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/1532 , H01L2924/181
摘要： A method for producing a semiconductor device includes: a) an attaching process in which a flat-plate member is positioned on a flat-shape lead frame provided with a plurality of leads and a plurality of support bars so that the flat-plate member contacts at least the plurality of leads, and the flat-plate member is attached to plurality of support bars; b) an element mounting process in which a semiconductor element is mounted on the flat-plate member attached to the plurality of support bars of the flat-shape lead frame; c) a wire-bonding process in which a wire is provided between each of the plurality of leads and the semiconductor element; and d) a separating process, performed after the completion of the wire-bonding process, in which the plurality of support bars are deformed so as to separate the flat-plate member and the plurality of leads and electrically disconnect or separate the flat-plate member from the plurality of leads.
摘要翻译： 一种半导体器件的制造方法，其特征在于，包括：a）平板部件位于设置有多个引线和多个支撑杆的扁平状引线框架上的安装工序，使得所述平板部件接触 至少所述多个引线，并且所述平板构件附接到多个支撑杆; b）元件安装工艺，其中将半导体元件安装在平板形元件上，该平板元件安装在平板形引线框架的多个支撑杆上; c）引线接合工艺，其中在所述多个引线和所述半导体元件中的每一个之间设置导线; 以及d）分离处理，其在所述引线接合工艺完成之后进行，其中所述多个支撑杆变形，以便使所述平板部件和所述多个引线分离，并且将所述平板 来自多个线索的成员。
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公开(公告)号：US06222258B1
公开(公告)日：2001-04-24
申请号：US09102005
申请日：1998-06-22
申请人： Yuichi Asano , Hitoshi Kobayashi , Katsunori Wako
发明人： Yuichi Asano , Hitoshi Kobayashi , Katsunori Wako
IPC分类号： H01L23495
CPC分类号： H01L23/4334 , H01L23/49541 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/00014 , H01L2924/01029 , H01L2924/01039 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399 , H01L2924/00012
摘要： A method for producing a semiconductor device includes: a) an attaching process in which a flat-plate member is positioned on a flat-shape lead frame provided with a plurality of leads and a plurality of support bars so that the flat-plate member contacts at least the plurality of leads, and the flat-plate member is attached to plurality of support bars; b) an element mounting process in which a semiconductor element is mounted on the flat-plate member attached to the plurality of support bars of the flat-shape lead frame; c) a wire-bonding process in which a wire is provided between each of the plurality of leads and the semiconductor element; and d) a separating process, performed after the completion of the wire-bonding process, in which the plurality of support bars are deformed so as to separate the flat-plate member and the plurality of leads and electrically disconnect or separate the flat-plate member from the plurality of leads.
摘要翻译： 一种半导体器件的制造方法，其特征在于，包括：a）平板部件位于设置有多个引线和多个支撑杆的扁平状引线框架上的安装工序，使得所述平板部件接触 至少所述多个引线，并且所述平板构件附接到多个支撑杆; b）元件安装工艺，其中将半导体元件安装在平板形元件上，该平板元件安装在平板形引线框架的多个支撑杆上; c）引线接合工艺，其中在所述多个引线和所述半导体元件中的每一个之间设置导线; 以及d）分离处理，其在所述引线接合工艺完成之后进行，其中所述多个支撑杆变形，以便分离所述平板部件和所述多个引线，并且将所述平板 来自多个线索的成员。
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公开(公告)号：US10352365B2
公开(公告)日：2019-07-16
申请号：US14777881
申请日：2014-03-12
摘要： A power transmission shaft including a male spline formed in an outer periphery thereof, and a diameter increasing portion formed on a part of a tooth bottom of the male spline, which is located on an opposite side to an axial end of the power transmission shaft. The tooth bottom of the male spline has a substantially constant circumferential width extending up to an axial region of the diameter increasing portion. The diameter increasing portion includes a chamfered portion formed in the axial region of the diameter increasing portion, the chamfered portion connecting the tooth bottom and a tooth flank of the male spline to each other to reduce a tooth groove width.
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公开(公告)号：US08757887B2
公开(公告)日：2014-06-24
申请号：US12530834
申请日：2008-03-13
申请人： Akira Torii , Hiroshi Kawamura , Kiyoshige Yamauchi , Masahiro Ozawa , Tohru Nakagawa , Yuichi Asano , Mitsuru Umekida , Hisaaki Kura , Shin Tomogami
发明人： Akira Torii , Hiroshi Kawamura , Kiyoshige Yamauchi , Masahiro Ozawa , Tohru Nakagawa , Yuichi Asano , Mitsuru Umekida , Hisaaki Kura , Shin Tomogami
CPC分类号： B60B27/0078 , B60B27/0005 , B60B27/0042 , B60B27/0084 , B60B27/0094 , B60B2310/316 , B60B2380/12 , F16C19/186 , F16C33/64 , F16C35/063 , F16C35/0635 , F16C2326/02 , F16D2001/103 , Y10T29/49536 , Y10T403/7021 , Y10T403/7026
摘要： A bearing device for a wheel prevents backlash in a circumferential direction and has excellent workability for connecting a hub wheel and an outer joint member of a constant velocity universal joint. The bearing device includes a recess-projection fitting structure in which the hub wheel and a shaft section, which is fitted in a hole of the hub wheel of the outer joint member of the constant velocity universal joint, are unitized together. In the recess-projection fitting structure, entire fitting regions among projections on the outer surface of the shaft section of the outer joint member and recesses, which fit on the projections, are brought into intimate contact with each other.
摘要翻译： 用于车轮的轴承装置防止在圆周方向上的间隙，并且具有用于连接轮毂轮和等速万向接头的外接头构件的优异的可加工性。 轴承装置包括凹凸突起嵌合结构，轮毂轮和装配在等速万向接头的外接头构件的轮毂轮的孔中的轴部分组合在一起。 在凹凸装配结构中，外接头构件的轴部的外表面的突起之间的整体嵌合区域和配合在突起上的凹部彼此紧密接触。
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公开(公告)号：US08564108B2
公开(公告)日：2013-10-22
申请号：US13596736
申请日：2012-08-28
IPC分类号： H01L23/495
CPC分类号： H01L23/4334 , H01L21/561 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/97 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01074 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2924/20752 , H01L2224/05599
摘要： A BGA type semiconductor device includes: a substrate having wirings and electrodes; a semiconductor element disposed on the substrate, having a rectangular plan shape, and a plurality of electrodes disposed along each side of the semiconductor element; a plurality of wires connecting the electrodes on the semiconductor element with the electrodes on the substrate; a heat dissipation member disposed on the substrate, covering the semiconductor element, and having openings formed in areas facing apex portions of the plurality of wires connected to the electrodes formed along each side of the semiconductor element; and a sealing resin member for covering and sealing the semiconductor element and heat dissipation member.
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公开(公告)号：US08278743B2
公开(公告)日：2012-10-02
申请号：US13023962
申请日：2011-02-09
IPC分类号： H01L23/495
CPC分类号： H01L23/4334 , H01L21/561 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/97 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01074 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2924/20752 , H01L2224/05599
摘要： A BGA type semiconductor device includes: a substrate having wirings and electrodes; a semiconductor element disposed on the substrate, having a rectangular plan shape, and a plurality of electrodes disposed along each side of the semiconductor element; a plurality of wires connecting the electrodes on the semiconductor element with the electrodes on the substrate; a heat dissipation member disposed on the substrate, covering the semiconductor element, and having openings formed in areas facing apex portions of the plurality of wires connected to the electrodes formed along each side of the semiconductor element; and a sealing resin member for covering and sealing the semiconductor element and heat dissipation member.
摘要翻译： BGA型半导体器件包括：具有布线和电极的衬底; 设置在所述基板上的具有矩形平面形状的半导体元件和沿着所述半导体元件的每一侧设置的多个电极; 将半导体元件上的电极与基板上的电极连接的多条导线; 散热构件，设置在所述基板上，覆盖所述半导体元件，并且具有形成在与所述半导体元件的每一侧形成的所述电极连接的所述多根导线的顶点部分的区域中形成的开口; 以及用于覆盖和密封半导体元件和散热构件的密封树脂构件。
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公开(公告)号：US20110230611A1
公开(公告)日：2011-09-22
申请号：US13130381
申请日：2009-10-20
申请人： Yuichi Asano , Mitsuru Saito
发明人： Yuichi Asano , Mitsuru Saito
IPC分类号： C08K3/10
CPC分类号： C08J3/226 , C08J3/12 , C08J2323/06 , C08J2423/00 , C08K3/08 , C08L23/08 , C08L23/0815 , C08L2205/02 , C08L2310/00 , C08L2666/06
摘要： A masterbatch for coloring a synthetic resin of the present invention includes an aluminum pigment, a polyethylene wax, and a linear low-density polyethylene resin, and the masterbatch in a form of cylindrical pellets, each 2.5 mm in diameter and not less than 2 mm and not more than 5 mm in height, has a Rattler value of not more than 2.5%.
摘要翻译： 用于着色本发明的合成树脂的母料包括铝颜料，聚乙烯蜡和线性低密度聚乙烯树脂，并且所述母粒为圆柱形颗粒形式，每个直径2.5mm且不小于2mm 高度不超过5毫米，拉特勒值不大于2.5％。
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10.发明申请WHEEL BEARING DEVICE, METHOD OF ASSEMBLING WHEEL BEARING DEVICE, ASSEMBLY CONFIGURED BY WHEEL BEARING DEVICE AND DRIVE SHAFT, AND METHOD OF ASSEMBLING ASSEMBLY 有权车轮轴承装置，组装轴承装置的方法，由轴承装置和驱动轴构成的组件以及组装装置的方法公开(公告)号：US20100216557A1
公开(公告)日：2010-08-26
申请号：US12599536
申请日：2008-05-14
申请人： Tohru Nakagawa , Yuichi Asano , Masahiro Ozawa
发明人： Tohru Nakagawa , Yuichi Asano , Masahiro Ozawa
CPC分类号： F16D1/0858 , B60B27/0005 , B60B27/0026 , B60B27/0042 , B60B27/0084 , B60B27/0094 , B60B35/128 , B60B35/18 , B60B2310/208 , B60B2310/305 , B60B2310/316 , B60B2310/54 , B60B2360/102 , B60B2900/111 , B60B2900/112 , B60Y2200/11 , F16C19/186 , F16C2326/02 , F16D1/072 , F16D3/2237 , F16D3/224 , F16D2003/22326 , F16D2250/00 , F16D2300/10 , Y02T10/86 , Y10T29/49682
摘要： The present invention provides a wheel bearing device, a method of assembling the wheel bearing device, an assembly configured by the wheel bearing device and a drive shaft, and a method of assembling the assembly, in which the wheel bearing device eliminates a nut tightening operation, is capable of reducing costs, and has a projection and recess mating structure that can firmly connect an outer joint member and a hub.Axial direction load is applied to a stepped surface 56 provided on an outer diameter surface of an outer joint member. A projection that extends in the axial direction and is provided on one of a stem shaft 9b of the outer joint member and an inner diameter surface of a hole section 29 of a hub 4 is press-fitted into a partner member along the axial direction, As a result, a recess that is in close contact with the projection over an overall mating contact area 45 is formed in the partner member, thereby configuring a projection and recess mating structure M.
摘要翻译： 本发明提供了一种车轮轴承装置，组装车轮轴承装置的方法，由车轮轴承装置和驱动轴构成的组件以及组装方法，其中车轮轴承装置消除了螺母紧固操作 能够降低成本，并且具有可以牢固地连接外部接头构件和轮毂的突出和凹入配合结构。 向设置在外侧接头部件的外径面上的台阶面56施加轴向载荷。 在轴向方向上延伸并且设置在外侧接头构件的杆轴9b和轮毂4的孔部29的内径面中的一个上的突起沿轴向压入配合构件， 结果，在配对构件中形成了与整个配合接触区域45上的突起紧密接触的凹部，由此构成突出和凹入配合结构M.
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