公开(公告)号：US06913512B2

公开(公告)日：2005-07-05

申请号：US10863154

申请日：2004-06-07

申请人： Howard W. Grivna

发明人： Howard W. Grivna

IPC分类号： B24B5/00 ,  B24B7/06 ,  B24B19/24 ,  B24B21/00 ,  B24B21/04 ,  B24B21/12 ,  B24B27/00 ,  B24B49/00 ,  B24B49/04 ,  B24B51/00

CPC分类号： B24B7/06 ,  B24B7/28 ,  B24B19/24 ,  B24B21/04 ,  B24B21/12 ,  B24B27/0023 ,  B24B49/04 ,  B24B51/00

摘要： A material removal optimizing system for a wood surface treating apparatus with a plurality of individual work stations arranged serially along an endless conveyor. Each station includes a working abrasive head along with an elevation adjustment mechanism for adjustably positioning the contact surface of each abrasive head at a desired working distance from the opposed surface of the workpiece traveling along the endless conveyor. An incoming workpiece dimension indicator is positioned at the infeed end, and additional workpiece dimension indicators are positioned downstream from each work station, with each dimension indicator being positioned to measure the dimensional deviation of the workpiece from a datum plane after it has passed through its preceding individual work station.

摘要翻译： 一种用于木材表面处理装置的材料去除优化系统，其具有沿着环形输送机串联布置的多个单独的工作站。 每个工位包括一个工作研磨头以及一个高度调节机构，用于将磨料头的接触表面可调节地定位在距离环形输送机行进的工件相对表面所需的工作距离处。 进入的工件尺寸指示器位于进料端，并且附加的工件尺寸指示器位于每个工作站的下游，每个尺寸指示器被定位成在通过其前一个工件之后测量工件与基准平面的尺寸偏差 个人工作台。

公开(公告)号：US06908374B2

公开(公告)日：2005-06-21

申请号：US10052475

申请日：2002-01-17

申请人： Yuchun Wang ,  Bernard M. Frey ,  Bulent M. Basol ,  Douglas W. Young ,  Homayoun Talieh ,  Efrain Velazquez

发明人： Yuchun Wang ,  Bernard M. Frey ,  Bulent M. Basol ,  Douglas W. Young ,  Homayoun Talieh ,  Efrain Velazquez

IPC分类号： B24B21/04 ,  B24B21/08 ,  B24B37/04 ,  B24B47/04 ,  B24B49/16 ,  B24B49/12

CPC分类号： B24B37/205 ,  B24B21/04 ,  B24B21/08 ,  B24B37/013 ,  B24B37/04 ,  B24B47/04 ,  B24B49/16

摘要： The methods and systems described provide for an in-situ endpoint detection for material removal processes such as chemical mechanical processing (CMP) performed on a workpiece. In a preferred embodiment, an optical detection system is used to detect endpoint during the removal of planar conductive layers using CMP. An optically transparent polishing belt provides endpoint detection through any spot on the polishing belt. Once endpoint is detected, a signal can be used to terminate or alter a CMP process that has been previously initiated.

摘要翻译： 所描述的方法和系统提供用于材料去除过程（例如在工件上执行的化学机械处理（CMP））的原位端点检测。 在优选实施例中，使用光学检测系统来检测使用CMP去除平面导电层期间的端点。 光学透明的抛光带通过抛光带上的任何点提供端点检测。 一旦检测到端点，就可以使用信号来终止或改变先前已经启动的CMP过程。

公开(公告)号：US06903018B2

公开(公告)日：2005-06-07

申请号：US09915658

申请日：2001-07-25

申请人： Gundu M. Sabde ,  Whonchee Lee

发明人： Gundu M. Sabde ,  Whonchee Lee

IPC分类号： B24B21/04 ,  B24B37/24 ,  B24B37/26 ,  C10M125/20 ,  C10M129/08 ,  C10M145/04 ,  C10M145/28 ,  C10M145/30 ,  C10M173/02 ,  C10N20/02 ,  C10N40/00 ,  H01L21/304 ,  H01L21/302

CPC分类号： B24B37/245 ,  B24B21/04 ,  B24B37/26 ,  B24D2203/00

摘要： Methods and apparatuses for planarizing microelectronic substrate assemblies on fixed-abrasive polishing pads with non-abrasive lubricating planarizing solutions. One aspect of the invention is to deposit a lubricating planarizing solution without abrasive particles onto a fixed-abrasive polishing pad having a body, a planarizing surface on the body, and a plurality of abrasive particles fixedly attached to the body at the planarizing surface. The front face of a substrate assembly is pressed against the lubricating planarizing solution and at least a portion of the fixed abrasive particles on the planarizing surface of the polishing pad. At least one of the polishing pad or the substrate assembly is then moved with respect to the other to impart relative motion therebetween. As the substrate assembly moves relative to the polishing pad, regions of the front face are separated from the abrasive particles in the polishing pad by a lubricant-additive in the lubricating planarizing solution.

摘要翻译： 在具有非磨蚀性润滑平坦化溶液的固定研磨抛光垫上平面化微电子基板组件的方法和装置。 本发明的一个方面是将没有磨料颗粒的润滑平坦化溶液沉积到具有主体，主体上的平坦化表面的固定研磨抛光垫上，以及在平坦化表面处固定地附接到主体的多个磨料颗粒。 衬底组件的前表面被压在抛光垫的平坦化表面上的润滑平坦化溶液和固定磨料颗粒的至少一部分上。 然后抛光垫或基板组件中的至少一个相对于另一个移动以在其间进行相对运动。 当基板组件相对于抛光垫移动时，前表面的区域通过润滑平面化溶液中的润滑剂添加剂与抛光垫中的磨料颗粒分离。

公开(公告)号：US06896600B1

公开(公告)日：2005-05-24

申请号：US10112421

申请日：2002-03-29

申请人： Patrick P. H. Wu ,  Xuyen Pham ,  Tony Luong

发明人： Patrick P. H. Wu ,  Xuyen Pham ,  Tony Luong

IPC分类号： B24B21/04 ,  B24B37/04 ,  B24B57/02 ,  B24B57/00

CPC分类号： B24B37/04 ,  B24B21/04 ,  B24B57/02

摘要： A liquid dispense manifold having drip nozzles configured to form controlled droplets is provided for use in chemical-mechanical polisher (CMP) systems. The liquid dispense manifold includes a plurality of drip nozzles that are secured to the side of the liquid dispense manifold. Each of the plurality of drip nozzles has a passage defined between a first end and a second end. A bend is defined within the drip nozzle passage such that droplets are directed downward toward a polishing surface. The nozzles are configured with respect to the manifold to provide an even flow rate of substantially uniform drops onto the polishing surface.

摘要翻译： 具有配置成形成受控液滴的滴注嘴的液体分配歧管被提供用于化学机械抛光机（CMP）系统。 液体分配歧管包括固定在液体分配歧管一侧的多个滴水嘴。 多个滴水喷嘴中的每一个具有在第一端和第二端之间限定的通道。 在滴水喷嘴通道内限定弯曲，使得液滴朝向研磨表面向下。 喷嘴相对于歧管配置，以提供基本均匀的液滴到抛光表面上的均匀流速。

公开(公告)号：US20050098887A1

公开(公告)日：2005-05-12

申请号：US11004208

申请日：2004-12-03

申请人： Michael Ball ,  Jose Sanchez

发明人： Michael Ball ,  Jose Sanchez

IPC分类号： B24B21/04 ,  H01L21/00 ,  H01L21/60 ,  H01L21/68 ,  H01L21/683 ,  H01L21/48 ,  H01L23/48

CPC分类号： H01L21/67132 ,  B24B21/04 ,  H01L21/6835 ,  H01L21/6838 ,  H01L24/11 ,  H01L2221/68386 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  Y10S156/941 ,  Y10T156/1179 ,  Y10T156/19 ,  H01L2224/0401

摘要： A method and apparatus are disclosed for mounting a wafer on a mount and thinning the wafer. The wafer includes a front surface having bumps with an adhesive tape having a backing attached thereto and a back surface. The front surface of the wafer is mounted facedown on a suction surface with the backing of the adhesive tape abutting the surface. The wafer is then suctioned, after which the back surface of the wafer undergoes a grinding process to thin the wafer. Since the backing attached to the bumps on the wafer is substantially planar and sits substantially flat on the suction surface of the wafer mount, the force exerted on the wafer from the thinning process does not overcome the suction force holding the wafer on the wafer mount. Thus, the bumped wafer may be thinned without damaging the bumps and the active surface of the wafer.

摘要翻译： 公开了一种用于将晶片安装在支架上并使晶片变薄的方法和装置。 晶片包括具有凸起的前表面，所述凸起具有附接到其上的背衬的粘合带和背面。 晶片的前表面正面安装在吸附表面上，粘合带的背面与表面邻接。 然后将晶片抽吸，之后晶片的背面进行研磨处理以使晶片变薄。 由于附着在晶片上的凸起的背衬基本上是平面的，并且在晶片安装件的吸附表面上基本平坦地放置，所以从薄化过程施加在晶片上的力不会克服将晶片保持在晶片安装座上的吸力。 因此，凸起的晶片可以变薄而不损坏凸块和晶片的有效表面。

公开(公告)号：US20050095965A1

公开(公告)日：2005-05-05

申请号：US10697292

申请日：2003-10-31

申请人： Po Chuang

发明人： Po Chuang

IPC分类号： B24B21/04 ,  B24B47/00 ,  B24B49/00

CPC分类号： B24B21/04 ,  B24B47/00

摘要： A grinding-band swaying device for a band grinding machine includes a motor pivotally connected with a machine base and driving an endless grinding band around two rollers and forming a fulcrum for swaying, a speed-reducing unit and an eccentric wheel. The speed-reducing unit is positioned under the motor, having a shaft connected with the eccentric wheel. An elastic compressing unit is provided between the speed-reducing unit or the motor and the machine base, and then the eccentric wheel is kept to elastically urge the machine base. When the motor together with the speed-reducing unit rotates the eccentric wheel, the speed-reducing unit, the motor and the roller sway regularly with the fulcrum and then the endless grinding band moves forward and also sways regularly synchronously to perform grinding against a work with grinding angles constantly altered to achieve balanced grinding result.

摘要翻译： 用于带磨床的磨带摇摆装置包括与机座枢转连接的马达，并围绕两个滚筒驱动环形研磨带，并形成摆动支点，减速单元和偏心轮。 减速单元位于马达下方，具有与偏心轮连接的轴。 在减速单元或马达与机座之间设置弹性压缩单元，然后使偏心轮弹性推动机座。 当电动机与减速单元一起旋转偏心轮时，减速单元，电动机和滚子与支点规则地摇摆，然后环形研磨带向前移动，并且同步地同步地摆动以对工作进行研磨 研磨角度不断变化，实现平衡磨削效果。

公开(公告)号：US20050075058A1

公开(公告)日：2005-04-07

申请号：US10678122

申请日：2003-10-06

申请人： Wang Wang

发明人： Wang Wang

IPC分类号： B24B21/00 ,  B24B21/04 ,  B24B55/08

CPC分类号： B24B21/008 ,  B24B21/04 ,  B24B55/08

摘要： A sand-belt finishing machine includes two opposite grinding devices arranged in parallel with each other and each including two opposite rollers and a sand belt reeved around the two rollers, and a dust clearing device mounted between the two grinding devices. Thus, the wooden board is placed on a single main frame and is processed by a single working procedure to synchronously obtain a double surface treatment, including the rough working treatment and the finishing treatment, thereby greatly simplifying the working process.

摘要翻译： 砂带整理机包括彼此平行布置的两个相对的研磨装置，每个包括两个相对的辊和围绕两个辊的砂带，以及安装在两个研磨装置之间的除尘装置。 因此，将木板放置在单个主框架上，并通过单个工作程序进行处理，以同步获得双面处理，包括粗加工处理和精加工处理，从而大大简化了加工过程。

公开(公告)号：US06857947B2

公开(公告)日：2005-02-22

申请号：US10346425

申请日：2003-01-17

申请人： Yuchun Wang ,  Bernard M. Frey ,  Bulent M. Basol ,  Homayoun Talieh ,  Douglas W. Young ,  Brett E. McGrath ,  Mukesh Desai ,  Efrain Velazquez ,  Tuan Truong

发明人： Yuchun Wang ,  Bernard M. Frey ,  Bulent M. Basol ,  Homayoun Talieh ,  Douglas W. Young ,  Brett E. McGrath ,  Mukesh Desai ,  Efrain Velazquez ,  Tuan Truong

IPC分类号： B24B21/04 ,  B24B21/08 ,  B24B37/013 ,  B24B37/20 ,  B24B49/10 ,  B24B49/16 ,  B24B21/00

CPC分类号： B24B37/013 ,  B24B21/04 ,  B24B21/08 ,  B24B37/205 ,  B24B49/10 ,  B24B49/16

摘要： An apparatus for polishing a workpiece includes a workpiece holder configured to hold the workpiece, a polishing member configured to be positioned adjacent to a face of the workpiece in order to polish the workpiece face with a front side of the polishing member, and a platen having a plurality of pressure zones configured to selectively apply pressure to the polishing member thereby causing the polishing member to contact the workpiece face with selective pressure. In another embodiment, the apparatus includes a pressure controller coupled to the platen and configured to selectively adjust the pressure zones.

摘要翻译： 一种用于抛光工件的装置包括：被配置为保持工件的工件保持器;抛光构件，其构造成邻近工件的表面定位，以便抛光工件面与抛光构件的前侧;以及压板， 多个压力区被配置为选择性地向抛光构件施加压力，从而使抛光构件与选择压力接触工件面。 在另一个实施例中，该装置包括耦合到压板并配置成选择性地调节压力区的压力控制器。

公开(公告)号：US6102781A

公开(公告)日：2000-08-15

申请号：US677050

申请日：1996-07-09

申请人： Chester Greathouse ,  Leroy E. Stump ,  Jerome Emmett Hansen

发明人： Chester Greathouse ,  Leroy E. Stump ,  Jerome Emmett Hansen

IPC分类号： B24B7/12 ,  B24B9/00 ,  B24B21/04 ,  B24B21/08 ,  B24B1/00

CPC分类号： B24B21/04 ,  B24B21/08 ,  B24B7/12 ,  B24B9/002

摘要： An improved method and device for performing setup and adjustment of pressure shoes used in an abrasive finishing machine. The setup of the pressure shoe stop limit device is performed automatically and remotely. The stop limit is hydraulically locked in place and limits subsequent shoe rotation. This automatically positionable travel limit stop takes into account the natural spring of the various machine components, including the innate springiness of the surfacing head elastic covering which wears and deforms over time. The pressure shoe is adjusted relative to the surfacing head, and accounts for the undefinable characteristics of the overall machine.

摘要翻译： 一种用于执行磨料整理机中使用的压力鞋的设置和调整的改进的方法和装置。 自动，远程地进行压脚限位装置的设定。 止动限位液压锁定到位，限制随后的鞋子旋转。 这种可自动定位的行程限位器考虑到各种机器部件的天然弹簧，包括随着时间的推移磨损和变形的堆焊头弹性覆盖层的固有弹性。 压力鞋相对于堆焊头进行调整，并考虑到整机的不确定特性。

公开(公告)号：US6059643A

公开(公告)日：2000-05-09

申请号：US803623

申请日：1997-02-21

申请人： Albert Hu ,  Burford J. Furman ,  Mohamed Abushaban

发明人： Albert Hu ,  Burford J. Furman ,  Mohamed Abushaban

IPC分类号： B24B21/06 ,  B24B21/12 ,  B24B37/04 ,  G11B5/84 ,  B24B21/04

CPC分类号： B24B21/12 ,  B24B21/06 ,  B24B37/04 ,  G11B5/84 ,  G11B5/8404

摘要： The present invention relates to an apparatus and method of Chemical Mechanical Planarization ("CMP") for wafer, flat panel display (FPD), and hard drive disk (HDD). The preferred apparatus comprises a looped belt spatially oriented in a vertical direction with respect to a ground floor. A polishing pad is glued to an outer surface of the belt. At an inner surface of the belt, there are a plurality of wafer supports to support the wafers while they are in polishing process. Wafers are loaded from a wafer station to a wafer head using a handling structure before polishing and are unloaded from the wafer head to the wafer station after polishing. An electric motor or equivalent is used to drive the looped belt running over two pulleys. An adjustment means is used to adjust the tension and position of the belt for smooth running. This new CMP machine can be mounted in multiple orientations to save manufacturing space.

摘要翻译： 本发明涉及一种用于晶片，平板显示器（FPD）和硬盘驱动盘（HDD）的化学机械平面化（“CMP”）的设备和方法。 优选的装置包括相对于底层在垂直方向上空间取向的环状带。 抛光垫胶合到带的外表面。 在带的内表面上，存在多个晶片支撑件，以在抛光过程中支撑晶片。 在抛光之前，使用处理结构将晶片从晶圆台装载到晶片头，并且在抛光之后从晶片头卸载到晶片台。 使用电动机或等效物来驱动环形带运行在两个滑轮上。 调节装置用于调节皮带的张力和位置，以使其平稳运行。 这种新的CMP机器可以安装在多个方向，以节省制造空间。