Method and apparatuses for planarizing microelectronic substrate assemblies
    9.
    发明授权
    Method and apparatuses for planarizing microelectronic substrate assemblies 有权
    用于平面化微电子衬底组件的方法和装置

    公开(公告)号:US06881127B2

    公开(公告)日:2005-04-19

    申请号:US09915657

    申请日:2001-07-25

    摘要: Methods and apparatuses for planarizing microelectronic substrate assemblies on fixed-abrasive polishing pads with non-abrasive lubricating planarizing solutions. One aspect of the invention is to deposit a lubricating planarizing solution without abrasive particles onto a fixed-abrasive polishing pad having a body, a planarizing surface on the body, and a plurality of abrasive particles fixedly attached to the body at the planarizing surface. The front face of a substrate assembly is pressed against the lubricating planarizing solution and at least a portion of the fixed abrasive particles on the planarizing surface of the polishing pad. At least one of the polishing pad or the substrate assembly is then moved with respect to the other to impart relative motion therebetween. As the substrate assembly moves relative to the polishing pad, regions of the front face are separated from the abrasive particles in the polishing pad by a lubricant-additive in the lubricating planarizing solution.

    摘要翻译: 在具有非磨蚀性润滑平坦化溶液的固定研磨抛光垫上平面化微电子基板组件的方法和装置。 本发明的一个方面是将没有磨料颗粒的润滑平坦化溶液沉积在具有主体,主体上的平坦化表面的固定磨料抛光垫上,以及在平坦化表面处固定地附接到主体的多个磨料颗粒。 衬底组件的前表面被压在抛光垫的平坦化表面上的润滑平坦化溶液和固定磨料颗粒的至少一部分上。 然后抛光垫或基板组件中的至少一个相对于另一个移动以在其间进行相对运动。 当基板组件相对于抛光垫移动时,前表面的区域通过润滑平面化溶液中的润滑剂添加剂与抛光垫中的磨料颗粒分离。