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公开(公告)号:US20210083670A1
公开(公告)日:2021-03-18
申请号:US17065632
申请日:2020-10-08
申请人: Guobiao ZHANG
发明人: Guobiao ZHANG
IPC分类号: H03K19/1776 , G11C5/02 , H03K19/17728 , H03K19/173 , H03K19/17736
摘要: A configurable processor singlet is a single die comprising monolithically integrated three-dimensional memory (3D-M) arrays and arithmetic-logic circuits (ALC's). The preferred singlet also comprises an array of configurable computing elements (CCE's). Each CCE comprises at least a 3D-M array, an ALC, and inter-storage-processor (ISP) connections.
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公开(公告)号:US20210083669A1
公开(公告)日:2021-03-18
申请号:US17065604
申请日:2020-10-08
申请人: Guobiao ZHANG
发明人: Guobiao ZHANG
IPC分类号: H03K19/1776 , G11C5/02 , H03K19/17728 , H03K19/173 , H03K19/17736
摘要: A configurable processor doublet comprises a pair of face-to-face bonded three-dimensional memory (3D-M) die and processing die. The 3D-M die comprises 3D-M arrays, whereas the processing die comprises arithmetic-logic circuits (ALC's). The preferred doublet also comprises an array of configurable computing elements (CCE's). Each CCE comprises at least a 3D-M array, an ALC, and inter-storage-processor (ISP) connections.
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公开(公告)号:US10950616B2
公开(公告)日:2021-03-16
申请号:US16792808
申请日:2020-02-17
发明人: Eli Harari , Raul Adrian Cernea
IPC分类号: H01L27/11 , G11C16/04 , H01L27/11578 , G11C7/18 , H03K19/20 , H03K19/1776 , G11C16/08 , G11C16/24 , H01L29/786
摘要: A NOR string includes a number of individually addressable thin-film storage transistors sharing a bit line, with the individually addressable thin-film transistors further grouped into a predetermined number of segments. In each segment, the thin-film storage transistors of the segment share a source line segment, which is electrically isolated from other source line segments in the other segments within the NOR string. The NOR string may be formed along an active strip of semiconductor layers provided above and parallel a surface of a semiconductor substrate, with each active strip including first and second semiconductor sublayers of a first conductivity and a third semiconductor sublayer of a second conductivity, wherein the shared bit line and each source line segment are formed in the first and second semiconductor sublayers, respectively.
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公开(公告)号:US20210058085A1
公开(公告)日:2021-02-25
申请号:US17094612
申请日:2020-11-10
申请人: Intel Corporation
IPC分类号: H03K19/1776 , G11C7/10 , H01L25/065 , G11C5/02
摘要: An integrated circuit device may include a programmable fabric die having programmable logic fabric and configuration memory that may configure the programmable logic fabric. The integrated circuit device may also include a base die that may provide fabric support circuitry, including memory and/or communication interfaces. The first die and the second die may be coupled using a multi-purpose interface that may allow communication between the first die and the second die. The multi-purpose interface may allow concurrent access to the base die by the programmable logic fabric and the configuration memory by using multiple channels over the multi-purpose interface.
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公开(公告)号:US20210020238A1
公开(公告)日:2021-01-21
申请号:US16980211
申请日:2018-03-23
申请人: NEC Corporation
发明人: Xu BAI , Toshitsugu SAKAMOTO , Yukihide TSUJI , Makoto MIYAMURA , Ryusuke NEBASHI , Ayuka TADA
IPC分类号: G11C13/00 , H03M5/02 , H03K19/1776
摘要: A reconfigurable circuit includes: a complementary resistive switch including a first resistive switch, a second resistive switch and a selection transistor, wherein a first terminal of the first resistive switch is connected to a first terminal of the second resistive switch and connected to a first terminal of the selection transistor; a first current source having a first terminal connected to a second terminal of the first resistive switch and a second terminal connected to a ground voltage line; a second current source having a first terminal connected to a second terminal of the second resistive switch and a second terminal connected to the ground voltage line; and a resistor having a first terminal connected to a second terminal of the selection transistor and a second terminal connected to a power voltage line.
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公开(公告)号:US10861808B2
公开(公告)日:2020-12-08
申请号:US16371863
申请日:2019-04-01
发明人: Hsien-Wei Chen , Ming-Fa Chen , Chih-Chia Hu
IPC分类号: H01L23/498 , H01L23/00 , H03K19/1776 , H01L23/495
摘要: A method includes polishing a semiconductor substrate of a first die to reveal first through-vias that extend into the semiconductor substrate, forming a dielectric layer on the semiconductor substrate, and forming a plurality of bond pads in the dielectric layer. The plurality of bond pads include active bond pads and dummy bond pads. The active bond pads are electrically coupled to the first through-vias. The first die is bonded to a second die, and both of the active bond pads and the dummy bond pads are bonded to corresponding bond pads in the second die.
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公开(公告)号:US20200379831A1
公开(公告)日:2020-12-03
申请号:US16970855
申请日:2018-11-20
发明人: Kenichi SHIMBO , Tadanobu TOBA , Taisuke UETA , Hideyuki SAKAMOTO
IPC分类号: G06F11/07 , G06F11/10 , G06F11/14 , H03K19/1776
摘要: An electronic control device includes a rewritable configuration memory composed of a plurality of frames in which logic circuit information is stored, a reconfiguration control unit configured to rewrite the logic circuit information of the frames, a logic unit configured to form a logic circuit based on the logic circuit information stored in the frames, and a configuration memory diagnosis unit configured to read the logical circuit information stored in the frames of the configuration memory and to perform error detection which is detection of an error in the stored logic circuit information, in which when the frames are rewritten by the reconfiguration control unit, the configuration memory diagnosis unit performs the error detection of ones of the frames that are rewritten prior to ones of the frames that are not rewritten.
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公开(公告)号:US10833679B2
公开(公告)日:2020-11-10
申请号:US16235984
申请日:2018-12-28
申请人: Intel Corporation
IPC分类号: H03K19/177 , H01L25/00 , H03K19/1776 , G11C7/10 , H01L25/065 , G11C5/02
摘要: An integrated circuit device may include a programmable fabric die having programmable logic fabric and configuration memory that may configure the programmable logic fabric. The integrated circuit device may also include a base die that may provide fabric support circuitry, including memory and/or communication interfaces. The first die and the second die may be coupled using a multi-purpose interface that may allow communication between the first die and the second die. The multi-purpose interface may allow concurrent access to the base die by the programmable logic fabric and the configuration memory by using multiple channels over the multi-purpose interface.
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公开(公告)号:US10817493B2
公开(公告)日:2020-10-27
申请号:US15644021
申请日:2017-07-07
申请人: Raytheon Company
发明人: James R. Sackett
IPC分类号: G06F16/00 , G06F12/00 , H03K19/10 , G06F16/22 , H03K19/17704 , H03K19/17728 , G06F12/02 , H03K19/1776 , H01L27/28
摘要: Generally discussed herein are systems, devices, and methods for data interpolation. A system for data interpolation can include first circuitry to split a set of data into four disjoint subsets including first, second, third, and fourth subsets and load each of the disjoints subsets into respective first, second, third, and fourth memory portions, second circuitry to retrieve, simultaneously, data from each of the first, second, third, and fourth memory portions, and interpolation circuitry to perform, based on the retrieved data, data interpolation.
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公开(公告)号:US20200321965A1
公开(公告)日:2020-10-08
申请号:US16957428
申请日:2017-12-28
IPC分类号: H03K19/17764 , H03K19/1776 , H03K19/17736 , H03K19/17704
摘要: A method for programming a Field Programmable Gate Array (FPGA) via a network, the network being operated according to a predetermined communications protocol, can include: establishing a communication connection between the FPGA and an external master, setting the FPGA into a programming mode, the master providing an FPGA programming image to the FPGA in a sequence of frames so that the frames can be parsed and enabling the FPGA to write only during receiving the payload section of the frames. The FPGA programming image and parsing the sequence of frames can be performed by a permanently programmed or hardwired logic component. A network, FPGA, and a communication system can be configured to utilize embodiments of the method.
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