公开(公告)号：US08602598B2

公开(公告)日：2013-12-10

申请号：US13611371

申请日：2012-09-12

Applicant: Sheng-Shing Duan ,  Shih-Chin Chou

Inventor： Sheng-Shing Duan ,  Shih-Chin Chou

IPC: F21V29/00

CPC classification number: F21V29/004 ,  F21V23/009 ,  F21V29/83 ,  F21Y2105/10 ,  F21Y2115/10 ,  F28D7/106 ,  F28F1/06 ,  F28F13/08

Abstract: A light source cooling device includes a light source module, an inner casing, an outer casing, and a plurality of spacers. The inner casing encloses an accommodation space for accommodating the light source module. The outer casing surrounds the inner casing and has a gap included between an inner wall of the inner casing and the outer casing, wherein the inner casing and the outer casing are made of materials with different thermal conductivity coefficients. The inner wall of the inner casing, an outer wall of the outer casing, and the spacers together form a plurality of heat-dissipating passages. The inner wall absorbs the heat generated by the light source module and generates a temperature gradient between the inner wall and the outer wall, which assists in creating thermal convection to exhaust the heat.

Abstract translation: 光源冷却装置包括光源模块，内壳，外壳和多个间隔件。 内壳包围用于容纳光源模块的容置空间。 外壳围绕内壳并且在内壳的内壁和外壳之间具有间隙，其中内壳和外壳由具有不同导热系数的材料制成。 内壳的内壁，外壳的外壁和间隔件一起形成多个散热通道。 内壁吸收由光源模块产生的热量，并在内壁和外壁之间产生温度梯度，这有助于产生热对流以排热。

公开(公告)号：US20130279198A1

公开(公告)日：2013-10-24

申请号：US13716188

申请日：2012-12-16

Applicant: LEXTAR ELECTRONICS CORP.

Inventor： YU-MIN LIN ,  CHIA-SHEN CHENG ,  CHENG-CHUN LIAO ,  YA-WEN CHEN

IPC: F21V8/00

CPC classification number: G02B6/0075 ,  G02B6/0011 ,  G02B6/0018 ,  G02B6/0038 ,  G02B6/0068

Abstract: A light guide device includes N+1 light guide plates and N linear plane splitters. The light guide plates include a light outlet face, a light guiding face and a reflection face. The volume of the light guide device is defined by the light outlet face opposite to the light guiding face. The light guiding face has a plurality of first microstructures for diverting the light. The reflection face extends from the light outlet face toward a splitting portion. The linear plane splitters have a first and a second splitting portion. The first and second splitting portions of the ith linear plane splitter connects the light guiding face and the reflection face of the (j−1)th and jth light guide plates. The i and j satisfy 1≦i≦N and 2≦j≦N+1. Moreover, a light module utilizing the light guide device is disclosed.

Abstract translation: 导光装置包括N + 1个导光板和N个线性平面分离器。 导光板包括光出射面，导光面和反射面。 光导装置的体积由与光导面相反的光出射面限定。 导光面具有用于使光转向的多个第一微结构。 反射面从光出射面向分割部延伸。 线性平面分离器具有第一和第二分离部分。 第i个线性平面分离器的第一和第二分割部分连接导光面和第（j-1）和第j导光板的反射面。 i和j满足1 @ i @ N和2 @ j @ N + 1。 此外，公开了一种利用导光装置的光模块。

公开(公告)号：US20130242570A1

公开(公告)日：2013-09-19

申请号：US13716141

申请日：2012-12-15

Applicant: LEXTAR ELECTRONICS CORP.

Inventor： CHUN-KUANG CHEN ,  FENG-LING LIN ,  PO-SHEN CHEN ,  HUI-YING CHEN

IPC: F21V15/01

CPC classification number: F21V15/01 ,  F21S4/28 ,  F21V15/013 ,  F21V17/104 ,  F21V19/0045 ,  F21Y2103/10 ,  F21Y2115/10

Abstract: A light-emitting device includes a lower housing, a supporting frame, a light-emitting component, and an upper housing. The lower housing has a capacious recess and a pair of first fastening parts. The capacious recess is located between the first fastening parts. The supporting frame is disposed in the capacious recess. The light-emitting component is disposed on the supporting frame. The upper housing has a pair of second fastening parts. The second fastening parts and the first fastening parts are fastened each other, so that the upper housing covering the supporting frame and the light-emitting component is combined with the lower housing.

Abstract translation: 发光装置包括下壳体，支撑框架，发光部件和上壳体。 下壳体具有宽敞的凹槽和一对第一紧固部件。 宽度凹槽位于第一紧固部分之间。 支撑框架设置在宽敞的凹槽中。 发光部件配置在支撑框架上。 上壳体具有一对第二紧固部件。 第二紧固部件和第一紧固部件彼此紧固，使得覆盖支撑框架的上壳体和发光部件与下壳体组合。

公开(公告)号：US08445327B2

公开(公告)日：2013-05-21

申请号：US13403714

申请日：2012-02-23

Applicant: Chia-En Lee ,  Cheng-Ta Kuo ,  Der-Ling Hsia

Inventor： Chia-En Lee ,  Cheng-Ta Kuo ,  Der-Ling Hsia

IPC: H01L21/00

CPC classification number: H01L33/0079 ,  H01L24/26 ,  H01L24/93 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00

Abstract: A wafer-level packaging process of a light-emitting diode is provided. First, a semiconductor stacked layer is formed on a growth substrate. A plurality of barrier patterns and a plurality of reflective layers are then formed on the semiconductor stacked layer, wherein each reflective layer is surrounded by one of the barrier patterns. A first bonding layer is then formed on the semiconductor stacked layer to cover the barrier patterns and the reflective layers. Thereafter, a carrying substrate having a plurality of second bonding layers and a plurality of conductive plugs electrically insulated from each other is provided, and the first bonding layer is bonded with the second bonding layer. The semiconductor stacked layer is then separated from the growth substrate. Next, the semiconductor stacked layer is patterned to form a plurality of semiconductor stacked patterns. Next, each semiconductor stacked pattern is electrically connected to the conductive plug.

Abstract translation: 提供了发光二极管的晶片级封装工艺。 首先，在生长基板上形成半导体堆叠层。 然后在半导体堆叠层上形成多个阻挡图案和多个反射层，其中每个反射层被一个屏障图案包围。 然后在半导体堆叠层上形成第一结合层以覆盖阻挡图案和反射层。 此后，设置具有多个第二接合层和彼此电绝缘的多个导电插塞的承载基板，并且第一接合层与第二接合层接合。 然后将半导体堆叠层与生长衬底分离。 接下来，对半导体堆叠层进行图案化以形成多个半导体堆叠图案。 接下来，每个半导体堆叠图案电连接到导电插头。

公开(公告)号：US20130032776A1

公开(公告)日：2013-02-07

申请号：US13241585

申请日：2011-09-23

Applicant: CHENG-HUNG CHEN

Inventor： CHENG-HUNG CHEN

IPC: H01L33/04

CPC classification number: H01L33/145 ,  H01L33/0095 ,  H01L33/30 ,  H01L33/38 ,  H01L33/42 ,  H01L33/44 ,  H01L2933/0016

Abstract: A light emitting diode structure and a manufacturing method thereof are disclosed. The structure includes a substrate, an N type semiconductor layer, and active layer, a P type semiconductor layer, a current diffusion layer, and a metal electrode. The metal ions of the P type semiconductor layer may bond with hydrogen after process thermal annealing, and metal hydride may be generated. The metal hydride may be directly formed on the surface of the P type semiconductor layer and may be used as the current blocking layer. Since the metal hydride may be directly formed on the surface of the P type semiconductor layer, its structure is flat, which resolve the problem having the electrodes peeled off from the solder wire.

Abstract translation: 公开了一种发光二极管结构及其制造方法。 该结构包括衬底，N型半导体层和有源层，P型半导体层，电流扩散层和金属电极。 P型半导体层的金属离子可以在工艺热退火后与氢结合，可能产生金属氢化物。 金属氢化物可以直接形成在P型半导体层的表面上，并且可以用作电流阻挡层。 由于金属氢化物可以直接形成在P型半导体层的表面上，所以其结构是平坦的，这解决了电极从焊丝剥离的问题。

公开(公告)号：USD671237S1

公开(公告)日：2012-11-20

申请号：US29416481

申请日：2012-03-22

Applicant: Chang-Han Chen ,  Cheng-Chun Liao ,  Chia-Shen Cheng ,  Chih-Yun Lu

Designer： Chang-Han Chen ,  Cheng-Chun Liao ,  Chia-Shen Cheng ,  Chih-Yun Lu

公开(公告)号：USD670663S1

公开(公告)日：2012-11-13

申请号：US29408561

申请日：2011-12-14

Applicant: Bo-Yu Ko

Designer： Bo-Yu Ko

公开(公告)号：USD670661S1

公开(公告)日：2012-11-13

申请号：US29406802

申请日：2011-11-18

Applicant: Cheng-Ping Chang

Designer： Cheng-Ping Chang

公开(公告)号：US08304993B2

公开(公告)日：2012-11-06

申请号：US12551976

申请日：2009-09-01

Applicant: Hua-Lung Tzou ,  Meng-Chai Wu

Inventor： Hua-Lung Tzou ,  Meng-Chai Wu

IPC: H01J25/50

CPC classification number: F21V29/763 ,  F21K9/278 ,  F21V23/006 ,  F21V23/06 ,  F21V29/507 ,  F21V29/75 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/141

Abstract: A lamp tube according to the present invention at least comprises: a tube body, a light-emitting module, a driving module and an electrical connection module. The light-emitting module and the driving module are disposed in the tube body. The light-emitting module is provided with a first circuit board and a plurality of LEDs. The driving module is provided with at least a second circuit board and a drive circuit. The electrical connection module forms an electrical connection between the first and second circuit boards. It is convenient to independently replace or repair the driving module or the light-emitting module without discarding the entire lamp tube so as to effectively save costs and achieve the effects of energy saving and environmental protection.

Abstract translation: 根据本发明的灯管至少包括：管体，发光模块，驱动模块和电连接模块。 发光模块和驱动模块设置在管体中。 发光模块设置有第一电路板和多个LED。 驱动模块设置有至少第二电路板和驱动电路。 电连接模块在第一和第二电路板之间形成电连接。 独立地更换或修理驱动模块或发光模块是方便的，而不会丢弃整个灯管，从而有效节省成本，达到节能环保的效果。

公开(公告)号：USD667384S1

公开(公告)日：2012-09-18

申请号：US29406686

申请日：2011-11-17

Applicant: Cheng-Ping Chang ,  Che-Ming Hsu ,  Hui-Kai Hsu

Designer： Cheng-Ping Chang ,  Che-Ming Hsu ,  Hui-Kai Hsu