公开(公告)号：US20090285194A1

公开(公告)日：2009-11-19

申请号：US12415676

申请日：2009-03-31

申请人： Wan Jong Kim ,  Kyoung Joon Cho ,  Jong Heon Kim ,  Shawn Patrick Stapleton

发明人： Wan Jong Kim ,  Kyoung Joon Cho ,  Jong Heon Kim ,  Shawn Patrick Stapleton

IPC分类号： H04B7/216 ,  H04B7/00

CPC分类号： H03F1/3247 ,  H03F1/3258 ,  H03F3/19 ,  H03F3/20 ,  H03F3/24 ,  H03F2200/129 ,  H03F2200/451 ,  H03F2201/3224 ,  H03F2201/3227 ,  H03F2201/3233

摘要： An efficient peak cancellation method for reducing the peak-to-average power ratio in wideband communication systems uses repeated clipping and frequency domain filtering to achieve a desired peak-to-average power ratio for wideband code division multiple access and orthogonal frequency division multiplexing signals. The maximum magnitude of the filtered pulse is determined by a scaling factor which permits eliminating several iterations while still achieving convergence to the targeted peak-to-average power ratio, thereby reducing computational load and saving hardware resources. This results in improved performance in terms of error vector magnitude, adjacent channel leakage ratio and peak-to-average power ratio.

摘要翻译： 用于降低宽带通信系统中的峰值与平均功率比的有效的峰值抵消方法使用重复的限幅和频域滤波来实现宽带码分多址和正交频分复用信号所需的峰值与平均功率比。 经过滤波的脉冲的最大幅度由缩放因子决定，该比例因子可以消除多次迭代，同时仍然达到目标峰值与平均功率比的收敛，从而减少计算负荷并节省硬件资源。 这导致在误差矢量幅度，相邻信道泄漏比和峰值与平均功率比方面的性能提高。

公开(公告)号：US20090130986A1

公开(公告)日：2009-05-21

申请号：US12278758

申请日：2007-02-08

申请人： Young Woo Yun ,  Hak Seong Kim ,  Bong Hoe Kim ,  Joon Kui Ahn ,  Dong Youn Seo ,  Jung Hoon Lee ,  Ki Jun Kim ,  Suk Hyon Yoon ,  Eun Sun Kim ,  Jong Heon Kim

发明人： Young Woo Yun ,  Hak Seong Kim ,  Bong Hoe Kim ,  Joon Kui Ahn ,  Dong Youn Seo ,  Jung Hoon Lee ,  Ki Jun Kim ,  Suk Hyon Yoon ,  Eun Sun Kim ,  Jong Heon Kim

IPC分类号： H04B17/00 ,  H04L27/28

CPC分类号： H04L27/2601 ,  H04B7/0632 ,  H04B7/065 ,  H04L1/0026 ,  H04L1/0027 ,  H04L1/0029 ,  H04L5/0005 ,  H04L5/0057 ,  H04W24/10 ,  H04W52/146 ,  H04W52/325

摘要： A method of exchanging channel quality information between a base station and a user equipment in a mobile communication system is disclosed. A method of transmitting channel quality information in a mobile communication system which transmits channel quality information from a user equipment to a base station comprises transmitting channel quality information, which is measured based on a signal received from the base station, to the base station, receiving feedback information of the channel quality information from the base station, and transmitting difference information to the base station, the difference information for matching the channel quality information transmitted from the user equipment with channel quality information received by the base station based on the feedback information.

摘要翻译： 公开了一种在移动通信系统中的基站与用户设备之间交换信道质量信息的方法。 在从用户设备向基站发送信道质量信息的移动通信系统中发送信道质量信息的方法包括将基于从基站接收的信号测量的信道质量信息发送到基站，接收 基站的信道质量信息的反馈信息，向基站发送差分信息，基于反馈信息，将从用户设备发送的信道质量信息与基站接收的信道质量信息进行匹配的差分信息。

公开(公告)号：US07491572B2

公开(公告)日：2009-02-17

申请号：US10574316

申请日：2004-09-30

申请人： Jong-Heon Kim ,  Chi-Jung Song

发明人： Jong-Heon Kim ,  Chi-Jung Song

IPC分类号： H01L21/00 ,  H01L31/0328

CPC分类号： H01L27/14618 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： A package for semiconductor image pickup device is provided. The package is fabricated by using flip chip bumping. During deposition process of forming a metallic bonding layer and a metal layer for plating, a surface of a semiconductor image pickup device is maintained at the range between room temperature and 200° C. in accordance with a first embodiment. A polymer layer for preventing stress from generating can absorb stress generated during the deposition process in accordance with a second embodiment. According to the present invention, a functional polymer layer on the surface of a semiconductor image pickup device can be prevent from being deteriorated in its properties and from transforming at its surface.

摘要翻译： 提供了一种用于半导体图像拾取装置的封装。 封装通过使用倒装芯片凸块来制造。 在形成金属接合层和用于电镀的金属层的沉积工艺期间，根据第一实施例，半导体图像拾取装置的表面保持在室温和200℃之间的范围内。 用于防止产生应力的聚合物层可以吸收根据第二实施方案的沉积工艺期间产生的应力。 根据本发明，可以防止半导体图像拾取装置的表面上的功能性聚合物层的性质劣化，并且防止其表面变形。

公开(公告)号：US20070085180A1

公开(公告)日：2007-04-19

申请号：US10574316

申请日：2004-09-30

申请人： Jong-Heon Kim ,  Chi-Jung Song

发明人： Jong-Heon Kim ,  Chi-Jung Song

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H01L27/14618 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： A package for semiconductor image pickup device is provided. The package is fabricated by using flip chip bumping. During deposition process of forming a metallic bonding layer and a metal layer for plating, a surface of a semiconductor image pickup device is maintained at the range between room temperature and 200° C. in accordance with a first embodiment. A polymer layer for preventing stress from generating can absorb stress generated during the deposition process in accordance with a second embodiment. According to the present invention, a functional polymer layer on the surface of a semiconductor image pickup device can be prevent from being deteriorated in its properties and from transforming at its surface.

摘要翻译： 提供了一种用于半导体图像拾取装置的封装。 封装通过使用倒装芯片凸块来制造。 在形成金属接合层和用于电镀的金属层的沉积工艺期间，根据第一实施例，半导体图像拾取装置的表面保持在室温和200℃之间的范围内。 用于防止产生应力的聚合物层可以吸收根据第二实施方案的沉积工艺期间产生的应力。 根据本发明，可以防止半导体图像拾取装置的表面上的功能性聚合物层的性质劣化，并且防止其表面变形。

公开(公告)号：US20060197431A1

公开(公告)日：2006-09-07

申请号：US11366503

申请日：2006-03-03

申请人： Sang-Shin Choi ,  Chang-Ryon Byon ,  Soon-Cheol Shin ,  Joon-Soo Bae ,  Hyung-Seok Oh ,  Seok-Nam Lee ,  Jong-Heon Kim ,  Jeong-Hoon Kim ,  Hoo-Deuk Kim

发明人： Sang-Shin Choi ,  Chang-Ryon Byon ,  Soon-Cheol Shin ,  Joon-Soo Bae ,  Hyung-Seok Oh ,  Seok-Nam Lee ,  Jong-Heon Kim ,  Jeong-Hoon Kim ,  Hoo-Deuk Kim

IPC分类号： H01J29/82

CPC分类号： H01J29/87

摘要： A cathode ray tube includes a tube having a panel having an inner phosphor screen, a funnel connected to the panel, a neck connected to the funnel, a deflection unit disposed around the funnel, an electron gun installed in the neck, and a scatter-proof unit installed on the panel and the funnel such that the panel shares the scatter-proof unit with the funnel for preventing the tube from breaking and scattering into many pieces.

摘要翻译： 阴极射线管包括具有内荧光屏的面板，连接到面板的漏斗，连接到漏斗的颈部，设置在漏斗周围的偏转单元，安装在颈部中的电子枪， 安装在面板和漏斗上的防爆单元，使得面板与漏斗共享防散射单元，以防止管破裂并分散成多个部件。

公开(公告)号：US06897141B2

公开(公告)日：2005-05-24

申请号：US10842883

申请日：2004-05-10

申请人： Jong-Heon Kim

发明人： Jong-Heon Kim

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L21/44

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/3651 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/05124 ,  H01L2224/05166

摘要： A solder terminal and a fabrication method thereof are provided. According to one embodiment of the present invention, a solder terminal structure includes an adhesion metal layer formed on an electrode pad of a semiconductor device, a thermal diffusion barrier, a solder bonding layer, and a solder bump formed on upper portion of the solder bonding layer. With the thermal diffusion layer, the characteristic deterioration caused by the probe mark generated on the electrode pad can be prevented during a semiconductor reliability test, and at the same time, material movement between the layers of the electrode pad, the solder bonding layer and the adhesion metal layer can be reduced. Also, by having the thermal diffusion barrier act as a solder dam (a layer to confine the melted solder area to prevent the solder from being wetted), an additional deposition or etching process can be omitted.

摘要翻译： 提供焊接端子及其制造方法。 根据本发明的一个实施例，焊接端子结构包括形成在半导体器件的电极焊盘上的粘附金属层，形成在焊料上部上的热扩散阻挡层，焊料接合层和焊料凸块 层。 利用热扩散层，在半导体可靠性试验中可以防止在电极焊盘上产生的探针标记引起的特性劣化，同时在电极焊盘，焊料接合层和 粘附金属层可以减少。 此外，通过使热扩散阻挡层作为焊料坝（限制熔融焊料区域以防止焊料被润湿的层），可以省略附加的沉积或蚀刻工艺。

公开(公告)号：US06774495B2

公开(公告)日：2004-08-10

申请号：US10279383

申请日：2002-10-23

申请人： Jong-Heon Kim

发明人： Jong-Heon Kim

IPC分类号： H01L2348

CPC分类号： H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/3651 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05671 ,  H01L2224/05124 ,  H01L2224/05166

摘要： A solder terminal and a fabrication method thereof are provided. According to one embodiment of the present invention, a solder terminal structure includes an adhesion metal layer formed on an electrode pad of a semiconductor device, a thermal diffusion barrier, a solder bonding layer, and a solder bump formed on upper portion of the solder bonding layer. With the thermal diffusion layer, the characteristic deterioration caused by the probe mark generated on the electrode pad can be prevented during a semiconductor reliability test, and at the same time, material movement between the layers of the electrode pad, the solder bonding layer and the adhesion metal layer can be reduced. Also, by having the thermal diffusion barrier act as a solder dam (a layer to confine the melted solder area to prevent the solder from being wetted), an additional deposition or etching process can be omitted.

摘要翻译： 提供焊接端子及其制造方法。 根据本发明的一个实施例，焊接端子结构包括形成在半导体器件的电极焊盘上的粘附金属层，形成在焊料上部上的热扩散阻挡层，焊料接合层和焊料凸块 层。 利用热扩散层，在半导体可靠性试验中可以防止在电极焊盘上产生的探针标记引起的特性劣化，同时在电极焊盘，焊料接合层和 粘附金属层可以减少。 此外，通过使热扩散阻挡层作为焊料坝（限制熔融焊料区域以防止焊料被润湿的层），可以省略附加的沉积或蚀刻工艺。