公开(公告)号：US07776650B2

公开(公告)日：2010-08-17

申请号：US12404490

申请日：2009-03-16

Applicant: Heung-Kyu Kwon ,  Tae-Hun Kim ,  Jeong-O Ha

Inventor： Heung-Kyu Kwon ,  Tae-Hun Kim ,  Jeong-O Ha

IPC: H01L21/00

CPC classification number: H01L23/3128 ,  H01L21/561 ,  H01L21/563 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/81

Abstract: Embodiments of the invention provide a method for fabricating a system in package. In one embodiment, the method comprises preparing a printed circuit board (PCB) strip comprising a plurality of individual PCBs, stacking a plurality of first semiconductor chips and forming an encapsulant on a first surface of a first individual PCB of the plurality of individual PCBs to form a first semiconductor chip stack structure comprising a first semiconductor chip stack, and performing a first test adapted to test one of the first semiconductor chips in the first semiconductor chip stack. The method further comprises flip chip bonding a second semiconductor chip to a second surface of the first individual PCB if the first semiconductor chip stack structure meets a test standard based on a result of the first test, and dividing the first semiconductor chip stack structure to form a system in package.

Abstract translation: 本发明的实施例提供一种用于制造封装中的系统的方法。 在一个实施例中，该方法包括准备包括多个单独的PCB的印刷电路板（PCB）条带，堆叠多个第一半导体芯片，并在多个单独的PCB的第一个别PCB的第一表面上形成密封剂， 形成包括第一半导体芯片堆叠的第一半导体芯片堆栈结构，并且执行适于测试第一半导体芯片堆叠中的第一半导体芯片之一的第一测试。 如果第一半导体芯片堆栈结构基于第一测试的结果而满足测试标准，则将第二半导体芯片倒装成第一单独PCB的第二表面，并且将第一半导体芯片堆叠结构划分为形式 一个系统的包装。

公开(公告)号：US20100186729A1

公开(公告)日：2010-07-29

申请号：US12654898

申请日：2010-01-07

Applicant: Tae Hun Kim

Inventor： Tae Hun Kim

IPC: F24C15/00 ,  B01D50/00

CPC classification number: F24C15/2014 ,  B01D53/0407 ,  B01D53/864 ,  B01D53/885 ,  B01D2253/34 ,  B01D2255/1021 ,  B01D2255/1023 ,  B01D2257/502

Abstract: Disclosed herein is an oven range with a filter member improving the purification efficiency of toxic gas in a cavity. The filter member includes a plurality of sections inclined upward or downward with respect to one another and interconnected, with curves irregularly formed along the sections. Accordingly, since the toxic gas being discharged through the filter member is dispersed, entangled and mixed by the irregular curves of the filter member, a reaction time between the toxic gas and a catalyst coating the filter member is increased, thereby improving the purification efficiency.

Abstract translation: 本文公开了具有提高空腔中的有毒气体的净化效率的过滤器构件的烘箱范围。 过滤构件包括相对于彼此向上或向下倾斜并互连的多个部分，其中沿着这些部分不规则地形成有曲线。 因此，由于通过过滤构件排出的有毒气体被过滤构件的不规则曲线分散，缠结和混合，所以有毒气体和过滤构件的催化剂涂层之间的反应时间增加，从而提高净化效率。

公开(公告)号：US20100099465A1

公开(公告)日：2010-04-22

申请号：US12648248

申请日：2009-12-28

Applicant: Tae Hun Kim ,  Boem Young Woo ,  Jeong Hyuk Yoon ,  Hyun Ju Ahn ,  Seung Sook Han ,  Jun Serk Park ,  Ho Sang Cheon

Inventor： Tae Hun Kim ,  Boem Young Woo ,  Jeong Hyuk Yoon ,  Hyun Ju Ahn ,  Seung Sook Han ,  Jun Serk Park ,  Ho Sang Cheon

IPC: H04M1/00

CPC classification number: G06F3/04845 ,  G06F3/0488

Abstract: A method of displaying an object and a terminal capable of implementing the same. The method includes displaying an object movable on a touchscreen of a terminal at a first position on the touchscreen; and if a first touch action is carried out on the object, fixing the object to the first position.

Abstract translation: 一种显示对象和能够实现对象的终端的方法。 该方法包括在触摸屏上的第一位置显示可在终端的触摸屏上移动的对象; 并且如果在对象上执行第一触摸动作，则将对象固定到第一位置。

公开(公告)号：US07694868B2

公开(公告)日：2010-04-13

申请号：US12315341

申请日：2008-12-02

Applicant: Kyeong-heon Kim ,  Tae-hun Kim ,  Dong-hee Kim

Inventor： Kyeong-heon Kim ,  Tae-hun Kim ,  Dong-hee Kim

IPC: B23K35/02 ,  H05K3/34

CPC classification number: H05K3/3484 ,  H05K3/1225 ,  H05K2201/2027 ,  H05K2203/1476 ,  Y10T29/49144

Abstract: Provided is a method and apparatus for mounting a plurality of electronic components. The method comprises mounting a first electronic component on a substrate; forming a mask on the substrate to expose the first electronic component and a region of the substrate on which a solder paste is to be applied; forming a guide on a portion of the mask disposed around the first electronic component; applying the solder paste onto the substrate by using a squeezer contacting a portion of the mask disposed around the region of the substrate on which the solder paste is to be applied; removing the guide and the mask; and mounting a second electronic component on the solder paste.

Abstract translation: 提供了一种用于安装多个电子部件的方法和装置。 该方法包括将第一电子部件安装在基板上; 在所述基板上形成掩模以暴露所述第一电子部件和所述基板的要被施加焊膏的区域; 在设置在所述第一电子部件周围的所述掩模的一部分上形成引导件; 通过使用与设置在其上施加有焊膏的基板的区域周围的掩模的一部分接触的挤压器将焊膏施加到基板上; 去除导板和面罩; 并将第二电子部件安装在焊膏上。

公开(公告)号：US07663610B2

公开(公告)日：2010-02-16

申请号：US11729807

申请日：2007-03-30

Applicant: Tae Hun Kim ,  Boem Young Woo ,  Jeong Hyuk Yoon ,  Hyun Ju Ahn ,  Seung Sook Han ,  Jun Serk Park ,  Ho Sang Cheon

Inventor： Tae Hun Kim ,  Boem Young Woo ,  Jeong Hyuk Yoon ,  Hyun Ju Ahn ,  Seung Sook Han ,  Jun Serk Park ,  Ho Sang Cheon

IPC: G09G5/00

CPC classification number: G06F3/04845 ,  G06F3/0488

Abstract: A method of displaying an object and terminal capable of implementing the same are disclosed, by which various objects attributed to various functions provided within the terminal can be displayed to maximize facilitation and convenience of a user of the terminal. The present invention includes an object displaying step of displaying the object movable on the touchscreen on a first position on the touchscreen and an object position fixing step of if a first touch action is carried out on the object, fixing a position of the object to the first position.

Abstract translation: 公开了一种显示能够实现该对象和终端的对象和终端的方法，通过该方法可以显示归属于终端内提供的各种功能的各种对象，以最大限度地提高终端用户的便利性和便利性。 本发明包括一个对象显示步骤，用于在触摸屏上的第一位置上显示在触摸屏上可移动的物体;以及物体位置固定步骤，如果对物体执行第一触摸动作，则将物体的位置固定到 第一名

公开(公告)号：US07615415B2

公开(公告)日：2009-11-10

申请号：US11781377

申请日：2007-07-23

Applicant: Heung-kyu Kwon ,  Tae-hun Kim ,  Su-chang Lee

Inventor： Heung-kyu Kwon ,  Tae-hun Kim ,  Su-chang Lee

IPC: H01L21/00

CPC classification number: H01L25/03 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A vertical stack type multi-chip package is provided having improved reliability by increasing the grounding performance and preventing the decrease in reliability of the multi-chip package from moisture penetration into a lower semiconductor chip. The vertical stack type multi-chip package comprises an organic substrate having a printed circuit pattern on which a semiconductor chip is mounted. A first semiconductor chip is mounted on a die bonding region of the organic substrate and is electrically connected to the organic substrate through a first wire. A metal stiffener is formed on the first semiconductor chip and connected to the organic substrate by a first ground unit around the first semiconductor chip. An encapsulant is used to seal the first semiconductor chip below the metal stiffener. A second semiconductor chip, which is larger in size than that the first semiconductor chip, is mounted on the metal stiffener and connected by a second ground unit. The second semiconductor chip is connected to the organic substrate by a second wire. A mold resin seals the second semiconductor chip and a solder ball is bonded to a solder ball pad below the organic substrate.

Abstract translation: 通过提高接地性能并防止多芯片封装的湿度渗透到下半导体芯片中的可靠性降低，提供了具有提高的可靠性的垂直堆叠型多芯片封装。 垂直堆叠型多芯片封装包括具有其上安装有半导体芯片的印刷电路图案的有机基板。 第一半导体芯片安装在有机基板的芯片接合区域上，并通过第一导线与有机基板电连接。 在第一半导体芯片上形成金属加强件，并通过第一半导体芯片周围的第一接地单元与有机基板连接。 密封剂用于将金属加强件下方的第一半导体芯片密封。 尺寸大于第一半导体芯片的第二半导体芯片安装在金属加强件上并通过第二接地单元连接。 第二半导体芯片通过第二线连接到有机基板。 模具树脂密封第二半导体芯片，焊球与有机基板下方的焊球焊盘接合。

公开(公告)号：US20090275979A1

公开(公告)日：2009-11-05

申请号：US11721374

申请日：2005-12-23

Applicant: Jung-Nam Im ,  Jeong-Kyung Kim ,  Tae-Hun Kim

Inventor： Jung-Nam Im ,  Jeong-Kyung Kim ,  Tae-Hun Kim

IPC: A61B17/04

CPC classification number: A61L17/10 ,  A61B17/06166 ,  A61B2017/00526 ,  A61L17/04 ,  D01F8/04

Abstract: The present invention relates to a monofilament suture and a preparation method thereof, more specifically, to a novel monofilament suture wherein two polymers having identical inherent properties are spun to have a cross-sectional structure of conjugated filaments, and said cross-section has interfaces between the spun polymers. The interfaces form a discontinuous cross-section along the radial direction and are distributed continuously along the fiber axis direction, thereby offering improved knot security and applicability to a variety of medical materials, and a preparation method thereof.

Abstract translation: 本发明涉及一种单丝缝合物及其制备方法，更具体地说，涉及一种新颖的单丝缝合物，其中将具有相同固有性质的两种聚合物纺丝成具有共轭长丝的横截面结构，并且所述横截面在 纺丝聚合物。 界面沿径向形成不连续的横截面，并沿着纤维轴线方向连续分布，从而提高了各种医疗材料的结点安全性和适用性及其制备方法。

公开(公告)号：US20090237371A1

公开(公告)日：2009-09-24

申请号：US12402035

申请日：2009-03-11

Applicant: Dong Kyu Kim ,  Wan Ho Ju ,  Tae Hun Kim

Inventor： Dong Kyu Kim ,  Wan Ho Ju ,  Tae Hun Kim

IPC: G06F3/041

CPC classification number: G06F3/0416 ,  G06F3/017 ,  G06F3/0412 ,  G06F3/044 ,  G06F3/04817 ,  G06F3/0482 ,  G06F3/04845 ,  G06F3/0485 ,  G06F3/0488 ,  G06F3/04883 ,  G06F2203/04101 ,  G06F2203/04108 ,  G06F2203/04806

Abstract: The present invention relates to a mobile terminal. Specifically to a mobile terminal including a display including a touchscreen, a sensing unit for sensing an object contacting the touchscreen and the object in near-proximity to the touchscreen, and a controller for controlling information appearing on the display according to the object contacting the touchscreen and movement of the object relative to the touchscreen.

Abstract translation: 移动终端技术领域本发明涉及移动终端。 具体地涉及包括包括触摸屏的显示器的移动终端，用于感测接触触摸屏的物体的感测单元和靠近触摸屏的物体，以及控制器，用于根据接触触摸屏的对象控制出现在显示器上的信息 以及物体相对于触摸屏的移动。

公开(公告)号：US07585755B2

公开(公告)日：2009-09-08

申请号：US11978567

申请日：2007-10-30

Applicant: Seung-hwan Song ,  Yoon-dong Park ,  June-mo Koo ,  Suk-pil Kim ,  Jae-woong Hyun ,  Choong-ho Lee ,  Tae-hun Kim

Inventor： Seung-hwan Song ,  Yoon-dong Park ,  June-mo Koo ,  Suk-pil Kim ,  Jae-woong Hyun ,  Choong-ho Lee ,  Tae-hun Kim

IPC: H01L21/8239 ,  H01L29/788 ,  H01L29/792 ,  H01L27/105

CPC classification number: H01L21/84 ,  H01L27/105 ,  H01L27/1052 ,  H01L27/115 ,  H01L27/11521 ,  H01L27/11524 ,  H01L27/1203

Abstract: A method of fabricating a non-volatile memory device according to example embodiments may include forming a semiconductor layer on a substrate. A plurality of lower charge storing layers may be formed on a bottom surface of the semiconductor layer. A plurality of lower control gate electrodes may be formed on the plurality of lower charge storing layers. A plurality of upper charge storing layers may be formed on a top surface of the semiconductor layer. A plurality of upper control gate electrodes may be formed on the plurality of upper charge storing layers, wherein the plurality of lower and upper control gate electrodes may be arranged alternately.

Abstract translation: 根据示例性实施例的制造非易失性存储器件的方法可包括在衬底上形成半导体层。 多个下电荷存储层可以形成在半导体层的底表面上。 可以在多个下电荷存储层上形成多个下控制栅电极。 多个上电荷存储层可以形成在半导体层的顶表面上。 多个上部控制栅极电极可以形成在多个上部电荷存储层上，其中多个下部和上部控制栅电极可以交替布置。

公开(公告)号：US20090222766A1

公开(公告)日：2009-09-03

申请号：US12358579

申请日：2009-01-23

Applicant: Jae Young Chae ,  Tae Hun Kim ,  Sang Woon Lee ,  Young Sook Kim

Inventor： Jae Young Chae ,  Tae Hun Kim ,  Sang Woon Lee ,  Young Sook Kim

IPC: G06F3/048 ,  G06F3/01

CPC classification number: H04M1/72583 ,  G06F3/04817 ,  G06F3/0482 ,  G06F3/04842 ,  G06F3/0488 ,  G06F2221/2109 ,  H04M1/274508 ,  H04M1/27455 ,  H04M1/72547

Abstract: A mobile terminal comprising a display unit; and a controller configured to selectively display one or more menu icons associated with an object displayed on the display unit, in response to the object being selected, wherein the one or more menu icons have a functional or informational association with the selected object, such that further selection of the menu icons provides additional information about the selected object or establishment of a dynamic relationship between the selected object and the one or more menu icons results in performance of an operation related to the selected object.

Abstract translation: 一种移动终端，包括显示单元; 以及控制器，被配置为响应于所选择的对象，选择性地显示与显示在显示单元上的对象相关联的一个或多个菜单图标，其中所述一个或多个菜单图标具有与所选择的对象的功能或信息关联，使得 菜单图标的进一步选择提供关于所选择的对象的附加信息或所选择的对象与一个或多个菜单图标之间的动态关系的建立导致执行与所选对象相关的操作。