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公开(公告)号：US08362512B2
公开(公告)日：2013-01-29
申请号：US12635818
申请日：2009-12-11
IPC分类号： H01L33/00
CPC分类号： H01L33/502 , C09K11/7731 , C09K11/7734 , C09K11/7774 , G02B6/0023 , G02B6/0068 , G02B6/0073 , H01L33/486 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/01322 , H01L2933/0091 , Y02B20/181 , H01L2924/00014 , H01L2924/00
摘要： A light emitting diode is disclosed. The diode includes a package support and a semiconductor chip on the package support, with the chip including an active region that emits light in the visible portion of the spectrum. Metal contacts are in electrical communication with the chip on the package. A substantially transparent encapsulant covers the chip in the package. A phosphor in the encapsulant emits a frequency in the visible spectrum different from the frequency emitted by the chip and in response to the wavelength emitted by the chip. A display element is also disclosed that combines the light emitting diode and a planar display element. The combination includes a substantially planar display element with the light emitting diode positioned on the perimeter of the display element and with the package support directing the output of the diode substantially parallel to the plane of the display element.
摘要翻译： 公开了一种发光二极管。 二极管包括封装支撑件和封装支撑件上的半导体芯片，其中芯片包括在光谱的可见部分中发光的有源区域。 金属触点与封装上的芯片电连通。 基本上透明的密封剂覆盖封装中的芯片。 密封剂中的荧光体发射可见光谱中与芯片发射的频率不同的频率，并响应于芯片发出的波长。 还公开了组合发光二极管和平面显示元件的显示元件。 该组合包括基本上平面的显示元件，其中发光二极管位于显示元件的周边上，并且封装支撑件引导二极管的输出基本上平行于显示元件的平面。
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公开(公告)号：US20130011946A1
公开(公告)日：2013-01-10
申请号：US13616759
申请日：2012-09-14
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/642 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： Packages for containing one or more light emitting devices, such as light emitting diodes (LEDs), are disclosed with an efficient, isolated thermal path. In one embodiment, LED package can include a thermal element and at least one electrical element embedded within a body. The thermal element and electrical element can have the same and/or substantially the same thickness and can extend directly from a bottom surface of the LED package such that they are substantially flush with or extend beyond the bottom surface of the LED package. The thermal and electrical element have exposed portions which can be substantially flush with lateral sides of the body such that the thermal and electrical element do not have a significant portion extending beyond an outermost edge of the lateral sides of the body.
摘要翻译： 公开了一种用于容纳一个或多个发光器件（例如发光二极管（LED））的封装，其具有有效的隔离的热路径。 在一个实施例中，LED封装可以包括热元件和嵌入在主体内的至少一个电元件。 热元件和电气元件可以具有相同和/或基本上相同的厚度，并且可以直接从LED封装的底表面延伸，使得它们基本上与LED封装的底表面齐平或延伸超出LED封装的底表面。 热元件和电元件具有暴露部分，其可以与主体的侧面基本齐平，使得热电元件和电元件不具有延伸超过主体的侧面的最外边缘的显着部分。
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公开(公告)号：US20130003375A1
公开(公告)日：2013-01-03
申请号：US13367929
申请日：2012-02-07
摘要： Components and methods containing one or more light emitter devices, such as light emitting diodes (LEDs) or LED chips, are disclosed. In one aspect, a light emitter device component can include inner walls forming a recess defining an opening such that surface area outside of the opening of the recess is less than or equal to a threshold ratio of overall surface area. In one aspect, the light emitter device component can include a ceramic body mounted directly or indirectly on the ceramic body. Components disclosed herein can result in improved light extraction and thermal management.
摘要翻译： 公开了包含一个或多个发光器件（例如发光二极管（LED）或LED芯片）的组件和方法。 在一个方面，光发射器件部件可以包括形成限定开口的凹部的内壁，使得凹部开口外的表面面积小于或等于总表面积的阈值比。 在一个方面，发光器件组件可以包括直接或间接安装在陶瓷体上的陶瓷体。 本文公开的组件可以导致改进的光提取和热管理。
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公开(公告)号：US08269244B2
公开(公告)日：2012-09-18
申请号：US12853812
申请日：2010-08-10
IPC分类号： H01L33/64
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/642 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： Packages for containing one or more light emitting devices, such as light emitting diodes (LEDs), are disclosed with an efficient, isolated thermal path. In one embodiment, LED package can include a thermal element and at least one electrical element embedded within a body. The thermal element and electrical element can have the same and/or substantially the same thickness and can extend directly from a bottom surface of the LED package such that they are substantially flush with or extend beyond the bottom surface of the LED package. The thermal and electrical element have exposed portions which can be substantially flush with lateral sides of the body such that the thermal and electrical element do not have a significant portion extending beyond an outermost edge of the lateral sides of the body.
摘要翻译： 公开了一种用于容纳一个或多个发光器件（例如发光二极管（LED））的封装，其具有有效的隔离的热路径。 在一个实施例中，LED封装可以包括热元件和嵌入在主体内的至少一个电元件。 热元件和电气元件可以具有相同和/或基本上相同的厚度，并且可以直接从LED封装的底表面延伸，使得它们基本上与LED封装的底表面齐平或延伸超出LED封装的底表面。 热元件和电元件具有暴露部分，其可以与主体的侧面基本齐平，使得热电元件和电元件不具有延伸超过主体的侧面的最外边缘的显着部分。
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公开(公告)号：US20120127720A1
公开(公告)日：2012-05-24
申请号：US13227961
申请日：2011-09-08
CPC分类号： H01L27/153 , H01L25/0753 , H01L25/167 , H01L33/08 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/49113 , H01L2924/12032 , Y10T29/49117 , H01L2924/00014 , H01L2924/00
摘要： Light emitting devices and methods such as light emitting diodes (LEDs) are disclosed for use in higher voltage applications. Variable arrangements of LEDs are disclosed herein. Arrangements can include one or more LED chips connected in series, parallel, and/or a combination thereof. LED chips can be disposed in a package body having at least one thermal element and one or more electrical components.
摘要翻译： 公开了用于较高电压应用的发光器件和诸如发光二极管（LED）的方法。 这里公开了LED的可变布置。 布置可以包括串联，并联和/或其组合的一个或多个LED芯片。 LED芯片可以设置在具有至少一个热元件和一个或多个电气部件的封装主体中。
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公开(公告)号：US20120104428A1
公开(公告)日：2012-05-03
申请号：US13347243
申请日：2012-01-10
IPC分类号： H01L33/58
CPC分类号： H01L33/502 , C09K11/7731 , C09K11/7734 , C09K11/7774 , G02B6/0023 , G02B6/0068 , G02B6/0073 , H01L33/486 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/01322 , H01L2933/0091 , Y02B20/181 , H01L2924/00014 , H01L2924/00
摘要： A light emitting diode is disclosed. The diode includes a package support and a semiconductor chip on the package support, with the chip including an active region that emits light in the visible portion of the spectrum. Metal contacts are in electrical communication with the chip on the package. A substantially transparent encapsulant covers the chip in the package. A phosphor in the encapsulant emits a frequency in the visible spectrum different from the frequency emitted by the chip and in response to the wavelength emitted by the chip. A display element is also disclosed that combines the light emitting diode and a planar display element. The combination includes a substantially planar display element with the light emitting diode positioned on the perimeter of the display element and with the package support directing the output of the diode substantially parallel to the plane of the display element.
摘要翻译： 公开了一种发光二极管。 二极管包括封装支撑件和封装支撑件上的半导体芯片，其中芯片包括在光谱的可见部分中发光的有源区域。 金属触点与封装上的芯片电连通。 基本上透明的密封剂覆盖封装中的芯片。 密封剂中的荧光体发射可见光谱中与芯片发射的频率不同的频率，并响应芯片发出的波长。 还公开了组合发光二极管和平面显示元件的显示元件。 该组合包括基本上平面的显示元件，其中发光二极管位于显示元件的周边上，并且封装支撑件引导二极管的输出基本上平行于显示元件的平面。
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公开(公告)号：US20110310587A1
公开(公告)日：2011-12-22
申请号：US13087510
申请日：2011-04-15
IPC分类号： F21V9/16
CPC分类号： G02B6/0003 , F21K9/232 , F21K9/60 , F21K9/61 , F21K9/64 , F21V29/70 , F21Y2115/10 , G02B5/02 , G02B6/001 , G02B6/0035 , G02B6/005 , G02B6/0073 , G02B6/0096
摘要： A semiconductor light emitting apparatus includes an elongated hollow wavelength conversion tube that co mprises an elongated wavelength conversion tube wall having wavelength conversion material such as phosphor dispersed therein uniformly or non-uniformly. The tube need not be cylindrical. A semiconductor light emitting device is oriented to emit light inside the elongated hollow wavelength conversion tube to impinge upon the elongated wavelength conversion tube wall and the wavelength conversion material dispersed therein.
摘要翻译： 半导体发光装置包括细长的中空波长转换管，其包含具有波长转换材料的细长波长转换管壁，例如均匀或不均匀地分散其中的荧光体。 管不需要是圆柱形的。 半导体发光器件被定向以在细长的中空波长转换管内发光，以照射到分散在其中的细长波长转换管壁和波长转换材料。
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公开(公告)号：USD648687S1
公开(公告)日：2011-11-15
申请号：US29380549
申请日：2010-12-07
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69.发明申请HIGH EFFICACY LED LAMP WITH REMOTE PHOSPHOR AND DIFFUSER CONFIGURATION 审中-公开高效率的LED灯具，具有远程磷光体和扩散器配置公开(公告)号：US20110227102A1
公开(公告)日：2011-09-22
申请号：US13029063
申请日：2011-02-16
IPC分类号： H01L33/58
CPC分类号： F21V3/00 , F21K9/232 , F21K9/64 , F21V9/30 , F21V29/505 , F21V29/677 , F21V29/767 , F21V29/85 , F21Y2113/13 , F21Y2115/10 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： Solid state lamps and bulbs comprising different combinations and arrangements of a light source, wavelength conversion elements with one or more distinct phosphor layers or regions which are positioned separately or remotely with respect to the light source, and a diffuser element are provided. These elements may be arranged on or in conjunction with a thermal management device that allows for the fabrication of lamps and bulbs that are efficient, reliable and cost effective and can provide an essentially omni-directional emission pattern (even with a light source comprised of a co-planar arrangement of lighting devices such as LEDs). Various embodiments of the invention may be used to address many of the difficulties associated with utilizing efficient solid state light sources such as LEDs in the fabrication of lamps or bulbs suitable for direct replacement of traditional incandescent bulbs. Embodiments of the invention can be arranged to fit recognized standard size profiles such as those ascribed to commonly used lamps such as incandescent light bulbs, while still providing emission patterns that comply with ENERGY STAR® standards.
摘要翻译： 提供包括光源的不同组合和布置的固态灯和灯泡，其具有一个或多个不同荧光体层的波长转换元件或相对于光源单独地或远程地定位的散射器元件。 这些元件可以布置在热管理装置上或与热管理装置相结合，热管理装置允许制造高效，可靠和成本有效的灯和灯泡，并且可以提供基本上全方位的发射模式（即使使用由 诸如LED之类的照明装置的共平面布置）。 可以使用本发明的各种实施例来解决在制造适于直接替代传统白炽灯泡的灯泡或灯泡中利用有效的固态光源（例如LED）所涉及的许多困难。 本发明的实施例可以被布置成适合公认的标准尺寸轮廓，例如归因于常用灯（例如白炽灯泡）的标准尺寸轮廓，同时仍然提供符合ENERGYSTAR®标准的排放模式。
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公开(公告)号：US07910938B2
公开(公告)日：2011-03-22
申请号：US11839603
申请日：2007-08-16
IPC分类号： H01L33/48
CPC分类号： H01L33/54 , H01L33/486 , H01L33/50 , H01L33/60 , H01L2224/48091 , H01L2224/48465 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要： A light emitting packaged diode ids disclosed that includes a light emitting diode mounted in a reflective package in which the surfaces adjacent the diode are near-Lambertian reflectors. An encapsulant in the package is bordered by the Lambertian reflectors and a phosphor in the encapsulant converts frequencies emitted by the LED chip and, together with the frequencies emitted by the LED chip, produces white light. A substantially flat meniscus formed by the encapsulant defines the emitting surface of the packaged diode.
摘要翻译： 公开了一种发光封装二极管，其包括安装在反射封装中的发光二极管，其中与二极管相邻的表面是近朗伯反射器。 包装中的密封剂由朗伯反射器界定，并且密封剂中的磷光体转换由LED芯片发射的频率，并且与LED芯片发射的频率一起产生白光。 由密封剂形成的基本平坦的弯液面限定了封装二极管的发射表面。
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