利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

16 条记录 (耗时 0.024 秒)

    Light emitter device packages, modules and methods
    3.
    发明授权
    Light emitter device packages, modules and methods 有权
    发光器件封装，模块和方法

    公开(公告)号：US09583681B2

    公开(公告)日：2017-02-28

    申请号：US13367898

    申请日：2012-02-07

    申请人： Sung Chul Joo ,  Christopher P. Hussell

    发明人： Sung Chul Joo ,  Christopher P. Hussell

    IPC分类号： H01L27/15 ,  H01L33/48 ,  H01L25/075 ,  H01L33/62 ,  H01L33/64

    CPC分类号： H01L33/486 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01L2924/00014

    摘要： Light emitter device packages, modules and methods are disclosed having a body and a cavity that can be formed from a single substrate of material. The material can be thermally conductive and/or metallic. A light emitter device package can have at least one isolating layer creating at least a first isolated portion of the body and/or first isolated portion of the cavity. The isolating layer can be formed from the same material as the single substrate which forms the package body and cavity, and can be a layer which is thermally and electrically isolated. A light emitter or light emitter device, such as an LED chip can be mounted upon a surface of the cavity and upon at least a portion of the isolating layer.

    摘要翻译： 公开了发光器件封装，模块和方法，其具有可以由单个材料衬底形成的主体和空腔。 该材料可以是导热的和/或金属的。 光发射器件封装可以具有至少一个隔离层，该隔离层至少产生主体​​的第一隔离部分和/或空腔的第一隔离部分。 隔离层可以由与形成封装主体和空腔的单个基板相同的材料形成，并且可以是热和电隔离的层。 诸如LED芯片的发光器或发光器件可以安装在空腔的表面上并且安装在隔离层的至少一部分上。

    LIGHT EMITTING DEVICE PACKAGES WITH IMPROVED HEAT TRANSFER
    6.
    发明申请
    LIGHT EMITTING DEVICE PACKAGES WITH IMPROVED HEAT TRANSFER 有权
    具有改进的热传递的发光装置包装

    公开(公告)号：US20110031865A1

    公开(公告)日：2011-02-10

    申请号：US12825075

    申请日：2010-06-28

    申请人： Christopher P. Hussell ,  Sung Chul Joo ,  Robert S. Pyles

    发明人： Christopher P. Hussell ,  Sung Chul Joo ,  Robert S. Pyles

    IPC分类号： F21V29/00

    CPC分类号： H01L33/647 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/60 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/09701 ,  H01L2924/12032 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Packages containing one or more light emitting devices, such as light emitting diodes (LEDs), are disclosed. In one embodiment, LED package can include a thermal element having improved solder reliability to improve heat dissipation capacity of the LED package. LED package can include a molded plastic body having one or more LEDs attached to one or more electrical elements. The LEDs can be connected to an upper surface of the thermal element. The thermal element can include a bottom surface which can extend further away in distance from a body of the LED package than a bottom surface of the electrical element. This configuration can result in an improved connection between the LED package and an external circuitry source, thereby increasing heat transfer ability of the LED package.

    摘要翻译： 公开了包含一个或多个发光器件（例如发光二极管（LED））的封装。 在一个实施例中，LED封装可以包括具有改进的焊料可靠性以提高LED封装的散热能力的热元件。 LED封装可以包括具有连接到一个或多个电气元件的一个或多个LED的模制塑料体。 LED可以连接到热元件的上表面。 热元件可以包括底表面，该底表面可以远离电气元件的底部表面延伸远离LED封装体的距离。 该配置可以改善LED封装和外部电路源之间的连接，从而增加LED封装的传热能力。

    Light emitting diode (LED) packages, systems, devices and related methods
    8.
    发明授权
    Light emitting diode (LED) packages, systems, devices and related methods 有权
    发光二极管（LED）封装，系统，器件及相关方法

    公开(公告)号：US08610140B2

    公开(公告)日：2013-12-17

    申请号：US13462450

    申请日：2012-05-02

    申请人： Sung Chul Joo ,  Christopher P. Hussell

    发明人： Sung Chul Joo ,  Christopher P. Hussell

    IPC分类号： H01L33/60

    CPC分类号： H01L33/60 ,  F21K9/27 ,  F21K9/68 ,  F21Y2115/10 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00012

    摘要： Packages, systems, and devices for light emitting diodes (LEDs) and related methods are provided. The packages can include a lead frame with an electrically conductive chip carrier comprising an upper surface. An LED can be placed on the upper surface of the electrically conductive chip carrier. A casing can be disposed on the lead frame covering at least a portion of the lead frame. A reflector cavity can be in the casing surrounding the LED. The reflector cavity can have angled side wall portions and angled end wall portions with an angle at which the side wall portions are angled that is different from an angle at which the end wall portions are angled.

    摘要翻译： 提供了用于发光二极管（LED）和相关方法的封装，系统和器件。 封装可以包括具有包括上表面的导电芯片载体的引线框架。 LED可以放置在导电芯片载体的上表面上。 壳体可以设置在引线框架上，覆盖引线框架的至少一部分。 反射器腔可以在围绕LED的壳体中。 反射器腔体可以具有成角度的侧壁部分和成角度的端壁部分，其中侧壁部分成角度，其不同于端壁部分成角度的角度。