公开(公告)号：US20100314736A1

公开(公告)日：2010-12-16

申请号：US12483087

申请日：2009-06-11

申请人： Chan Hoon Ko ,  Soo-San Park ,  HeeJo Chi

发明人： Chan Hoon Ko ,  Soo-San Park ,  HeeJo Chi

IPC分类号： H01L23/485 ,  H01L21/60

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/83191 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture an integrated circuit packaging system includes: providing a base substrate; mounting a first base integrated circuit over the base substrate; mounting a second base integrated circuit over the first base integrated circuit; attaching a stacking interconnect to the base substrate and adjacent to the first base integrated circuit; and forming a base encapsulation, having a recess portion from a corner of the base encapsulation and a step portion adjacent to the recess portion, with the step portion over the second base integrated circuit and the recess portion exposing the stacking interconnect.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基底; 在基底基板上安装第一基底集成电路; 在第一基础集成电路上安装第二基础集成电路; 将堆叠互连附接到所述基底基板并且邻近所述第一基底集成电路; 以及形成基底封装，所述基底封装具有从所述基底封装的拐角处的凹陷部分和邻近所述凹部的台阶部分，所述台阶部分在所述第二基底集成电路上方，所述凹部暴露所述堆叠互连。

公开(公告)号：US07812435B2

公开(公告)日：2010-10-12

申请号：US11849087

申请日：2007-08-31

申请人： Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha

发明人： Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha

IPC分类号： H01L23/02

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package-in-package system includes: mounting a first integrated circuit device over a substrate; mounting an integrated circuit package system having an inner encapsulation over the first integrated circuit device with a first offset; mounting a second integrated circuit device over the first integrated circuit device and adjacent to the integrated circuit package system; connecting the integrated circuit package system and the substrate; and forming a package encapsulation as a cover for the first integrated circuit device, the integrated circuit package system, and the second integrated circuit device.

摘要翻译： 集成电路封装包装系统包括：将第一集成电路器件安装在衬底上; 在第一集成电路装置上安装具有第一偏移的内封装的集成电路封装系统; 将第二集成电路装置安装在所述第一集成电路装置上并与所述集成电路封装系统相邻; 连接集成电路封装系统和基板; 以及形成作为第一集成电路器件，集成电路封装系统和第二集成电路器件的封装的封装封装。

公开(公告)号：US20090303690A1

公开(公告)日：2009-12-10

申请号：US12136037

申请日：2008-06-09

申请人： Sang-Ho Lee ,  Soo-San Park ,  DaeSik Choi

发明人： Sang-Ho Lee ,  Soo-San Park ,  DaeSik Choi

IPC分类号： H05K7/06

CPC分类号： H01L23/3128 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/91 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04073 ,  H01L2224/1134 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48475 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85951 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An integrated circuit package system includes: providing a package substrate; mounting an interposer chip containing active circuitry over the package substrate; attaching a conductive bump stack having a base bump end and a stud bump end, the base bump end on the interposer chip; connecting a stack connector to the interposer chip and the package substrate; and applying a package encapsulant over the interposer chip, the stack connector, and the conductive bump stack with the stud bump end of the conductive bump stack substantially exposed.

摘要翻译： 集成电路封装系统包括：提供封装衬底; 将包含有源电路的插入器芯片安装在所述封装衬底上; 附接具有基底凸起端和柱形凸起端的导电凸块，所述基座凸起端在所述插入片上; 将堆叠连接器连接到插入器芯片和封装衬底; 以及将封装密封剂施加在所述插入器芯片，所述堆叠连接器以及所述导电凸块堆叠上，其中所述导电凸块的所述凸块的端部基本暴露。

公开(公告)号：US20090212408A1

公开(公告)日：2009-08-27

申请号：US12037291

申请日：2008-02-26

申请人： DaeSik Choi ,  Sang-Ho Lee ,  Soo-San Park

发明人： DaeSik Choi ,  Sang-Ho Lee ,  Soo-San Park

IPC分类号： H01L23/49

CPC分类号： H01L23/3128 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2223/6677 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06596 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit package system comprising: providing a package die; and connecting a connector lead having a first connector end with a protruded connection surface and a lowered structure over the package die.

摘要翻译： 一种集成电路封装系统，包括：提供封装管芯; 并且将具有第一连接器端部的连接器引线与在封装模具上的突出的连接表面和降低的结构连接。

公开(公告)号：US20090152740A1

公开(公告)日：2009-06-18

申请号：US11957862

申请日：2007-12-17

申请人： Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha ,  DaeSik Choi

发明人： Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha ,  DaeSik Choi

IPC分类号： H01L23/538

CPC分类号： H01L23/552 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/206

摘要： An integrated circuit package system includes: mounting a flip chip over a carrier with a non-active side of the flip chip facing the carrier; mounting a substrate over the flip chip; connecting an internal interconnect between the flip chip and the carrier; and encapsulating the flip chip and the internal interconnect over the carrier with the substrate exposed.

摘要翻译： 集成电路封装系统包括：将倒装芯片安装在载体上，其中倒装芯片的非活动侧面向载体; 将衬底安装在倒装芯片上; 连接倒装芯片和载体之间的内部互连; 并且在衬底被暴露的情况下将倒装芯片和内部互连封装在载体上。

公开(公告)号：US20090057861A1

公开(公告)日：2009-03-05

申请号：US11849087

申请日：2007-08-31

申请人： Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha

发明人： Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha

IPC分类号： H01L23/02 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package-in-package system includes: mounting a first integrated circuit device over a substrate; mounting an integrated circuit package system having an inner encapsulation over the first integrated circuit device with a first offset; mounting a second integrated circuit device over the first integrated circuit device and adjacent to the integrated circuit package system; connecting the integrated circuit package system and the substrate; and forming a package encapsulation as a cover for the first integrated circuit device, the integrated circuit package system, and the second integrated circuit device.

摘要翻译： 集成电路封装包装系统包括：将第一集成电路器件安装在衬底上; 在第一集成电路装置上安装具有第一偏移的内封装的集成电路封装系统; 将第二集成电路装置安装在所述第一集成电路装置上并与所述集成电路封装系统相邻; 连接集成电路封装系统和基板; 以及形成作为第一集成电路器件，集成电路封装系统和第二集成电路器件的封装的封装封装。

公开(公告)号：US07456088B2

公开(公告)日：2008-11-25

申请号：US11306627

申请日：2006-01-04

申请人： Soo-San Park ,  Hyeog Chan Kwon ,  Sang-Ho Lee ,  Jong-Woo Ha

发明人： Soo-San Park ,  Hyeog Chan Kwon ,  Sang-Ho Lee ,  Jong-Woo Ha

IPC分类号： H01L21/44

CPC分类号： H01L25/0657 ,  H01L21/561 ,  H01L23/3128 ,  H01L25/03 ,  H01L25/50 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

摘要： An integrated circuit package system is provided including providing a wafer with bond pads formed on the wafer. A solder bump is deposited on one or more bond pads. The bond pads and the solder bump are embedded within a mold compound formed on the wafer. A groove is formed in the mold compound to expose a portion of the solder bump. The wafer is singulated into individual die structures at the groove.

摘要翻译： 提供了一种集成电路封装系统，其包括在晶片上提供形成有接合焊盘的晶片。 焊料凸块沉积在一个或多个焊盘上。 接合焊盘和焊料凸块嵌入在晶片上形成的模具化合物中。 在模具化合物中形成凹槽以暴露焊料凸块的一部分。 将晶片在凹槽处分成单独的模具结构。