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公开(公告)号：US06705705B2
公开(公告)日：2004-03-16
申请号：US10229453
申请日：2002-08-28
申请人： Janis Horvath , Brian J. Keefe , Joseph E. Scheffelin , Mohammad Akhavain , David K. McElfresh , Noah Carl Lassar
发明人： Janis Horvath , Brian J. Keefe , Joseph E. Scheffelin , Mohammad Akhavain , David K. McElfresh , Noah Carl Lassar
IPC分类号： B41J201
CPC分类号： B41J2/14145 , B41J2/14024 , B41J2/14072 , B41J2/155 , B41J2002/14362 , B41J2002/14387 , B41J2202/19 , B41J2202/20
摘要： A fluid ejection assembly includes a substrate and a plurality of fluid ejection devices each mounted on the substrate. The substrate includes a frame formed of a first material and a body formed of a second material such that the body substantially surrounds the frame and forms a first side and a second side of the substrate with each of the fluid ejection devices being mounted on the first side of the substrate.
摘要翻译： 流体喷射组件包括基板和各自安装在基板上的多个流体喷射装置。 衬底包括由第一材料形成的框架和由第二材料形成的本体，使得主体基本上围绕框架并形成衬底的第一侧和第二侧，每个流体喷射装置安装在第一 侧面。
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62.发明申请公开(公告)号：US20130230272A1
公开(公告)日：2013-09-05
申请号：US13410113
申请日：2012-03-01
IPC分类号： G02B6/12
CPC分类号： G02B6/428 , G02B6/4246 , G02B6/4269 , G02B6/4274
摘要： A chip assembly configuration includes an substrate with an integrated circuit on one side and a conversion mechanism on the other side. The integrated circuit and the conversion mechanism are electrically coupled by a short electrical transmission line through the substrate. Moreover, the conversion mechanism converts signals between an electrical and an optical domain, thereby allowing high-speed communication between the integrated circuit and other components and devices using optical communication (for example, in an optical fiber or an optical waveguide).
摘要翻译： 芯片组装配置包括在一侧具有集成电路的基板和另一侧上的转换机构。 集成电路和转换机构通过穿过衬底的短电传输线电耦合。 此外，转换机构在电区域和光学域之间转换信号，从而允许集成电路与使用光通信的其他部件和设备（例如，在光纤或光波导中）之间的高速通信。
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公开(公告)号：US08207752B2
公开(公告)日：2012-06-26
申请号：US12685159
申请日：2010-01-11
申请人： Kannan Raj , Xuezhe Zheng , Ashok V. Krishnamoorthy , Ronald Ho , Michael O. McCracken , David K. McElfresh , John E. Cunningham
发明人： Kannan Raj , Xuezhe Zheng , Ashok V. Krishnamoorthy , Ronald Ho , Michael O. McCracken , David K. McElfresh , John E. Cunningham
IPC分类号： H03K19/003
CPC分类号： H03K19/177
摘要： A multi-chip module (MCM) is described. This MCM includes multiple sites, where a given site in the multiple sites includes multiple chips with proximity connectors that communicate information through proximity communication within the MCM via multiple components associated with the given site. Note that the MCM includes global redundancy and local redundancy at the given site. In particular, the global redundancy involves providing one or more redundant sites in the multiple sites. Furthermore, the local redundancy involves providing one or more redundant chips in the multiple chips and one or more redundant components in the multiple components.
摘要翻译： 描述了多芯片模块（MCM）。 该MCM包括多个站点，其中多个站点中的给定站点包括具有邻近连接器的多个芯片，其通过与给定站点相关联的多个组件在MCM内通过邻近通信传递信息。 请注意，MCM包括给定站点的全局冗余和本地冗余。 特别地，全局冗余涉及在多个站点中提供一个或多个冗余站点。 此外，本地冗余包括在多个芯片中提供一个或多个冗余芯片以及在多个组件中提供一个或多个冗余组件。
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64.发明申请RADIO FREQUENCY MICROSCOPE FOR AMPLIFYING AND ANALYZING ELECTROMAGNETIC SIGNALS 有权用于放大和分析电磁信号的无线电频率显微镜公开(公告)号：US20100306165A1
公开(公告)日：2010-12-02
申请号：US12473173
申请日：2009-05-27
CPC分类号： G01R29/0871 , G01R31/308
摘要： One embodiment provides a technique for analyzing a target electromagnetic signal radiating from a monitored system. During the technique, the monitored system is positioned at a first locus of an ellipsoidal surface to amplify the target electromagnetic signal received at a second locus of the ellipsoidal surface. Next, the amplified target electromagnetic signal is monitored using an antenna positioned at the second locus of the ellipsoidal surface. Finally, the integrity of the monitored system is assessed by analyzing the amplified target electromagnetic signal monitored by the antenna.
摘要翻译： 一个实施例提供了一种用于分析从被监视系统辐射的目标电磁信号的技术。 在该技术期间，所监视的系统位于椭圆面的第一轨迹处，以放大在椭圆面的第二轨迹处接收到的目标电磁信号。 接下来，使用位于椭圆面的第二轨迹处的天线来监视放大的目标电磁信号。 最后，通过分析由天线监测的放大的目标电磁信号来评估监控系统的完整性。
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公开(公告)号：US07466404B1
公开(公告)日：2008-12-16
申请号：US11145388
申请日：2005-06-03
IPC分类号： G01N21/00
CPC分类号： H01S5/0021 , G01R31/2635 , H01S5/18311
摘要： A method for testing a substrate by using a photoemission microscope is provided which includes providing the substrate and applying a reverse bias voltage to the substrate. The method further includes detecting light emissions from a top surface of the substrate and characterizing viability of the substrate from the detection of the light emissions.
摘要翻译： 提供一种通过使用光电显微镜测试基板的方法，其包括提供基板并向基板施加反向偏置电压。 该方法还包括检测来自衬底的顶表面的光发射，并且从光发射的检测来表征衬底的可行性。
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66.发明申请Method and apparatus for performing a real-time root-cause analysis by analyzing degrading telemetry signals 有权通过分析降级遥测信号进行实时根本原因分析的方法和装置公开(公告)号：US20080252441A1
公开(公告)日：2008-10-16
申请号：US11787506
申请日：2007-04-16
IPC分类号： G08B29/00
CPC分类号： G08B29/06
摘要： One embodiment of the present invention provides a system that performs a real-time root-cause-analysis for a degradation event associated with a component under test. During operation, the system monitors a telemetry signal collected from the component, and while doing so, attempts to detect an anomaly in the telemetry signal. If an anomaly is detected in the telemetry signal, the system performs a failure analysis on the telemetry signal in real-time while the telemetry signal is degrading. Next, the system identifies a failure mechanism for the component based on the failure analysis.
摘要翻译： 本发明的一个实施例提供一种系统，其执行与被测试组件相关联的退化事件的实时根本原因分析。 在操作期间，系统监视从组件收集的遥测信号，并且在这样做时，尝试检测遥测信号中的异常。 如果在遥测信号中检测到异常，则系统在遥测信号降级的同时对遥测信号进行实时故障分析。 接下来，系统基于故障分析识别组件的故障机制。
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公开(公告)号：US07353431B2
公开(公告)日：2008-04-01
申请号：US11508025
申请日：2006-08-21
IPC分类号： G06F11/00
CPC分类号： G06F11/0751 , G01R31/046 , G01R31/31717 , G06F11/0721 , G06F11/34 , G06F11/3452 , G06F2201/81
摘要： A system that detects the onset of degradation for interconnections in a component within a computer system. During operation, the system monitors inferential variables associated with the interconnections during operation of the computer system. Next, the system determines a present state of the component from the monitored inferential variables. The system then compares the present state of the component with an initial state of the component. If the comparison indicates that the interconnections in the component have reached or will reach a limited operating state (LOS), the system performs a remedial action.
摘要翻译： 一种检测计算机系统内的组件中相互连接劣化开始的系统。 在操作期间，系统在计算机系统的操作期间监视与互连相关联的推理变量。 接下来，系统从监视的推理变量确定组件的当前状态。 然后，系统将组件的当前状态与组件的初始状态进行比较。 如果比较表明组件中的互连达到或将达到有限的运行状态（LOS），则系统执行补救措施。
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公开(公告)号：US20080061812A1
公开(公告)日：2008-03-13
申请号：US11531657
申请日：2006-09-13
IPC分类号： G01R31/26
CPC分类号： G01R31/046 , G01R31/2896
摘要： Apparatus, systems, and methods are provided for testing the integrity of electrical interconnections in electronic systems. Apparatus may be constructed by modifying a substrate designed for deployment in an end-use product by shorting together multiple contacts on one side of it. Such vehicles may be used to test the characteristics of interconnections between the vehicle and its support, the shorted contacts enabling testing of individual interconnects under both DC and AC conditions. A system for testing the interconnects may include the modified substrate, an input signal generator, and an output signal monitor.
摘要翻译： 提供了用于测试电子系统中电互连的完整性的装置，系统和方法。 装置可以通过将设计用于部署在最终用途产品中的基板通过将其一侧上的多个触点短接在一起而构成。 这样的车辆可以用于测试车辆与其支撑件之间的互连的特性，短路触点能够在DC和AC条件下测试各个互连。 用于测试互连的系统可以包括修改的衬底，输入信号发生器和输出信号监视器。
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69.发明授权Determining the quality and reliability of a component by monitoring dynamic variables 有权通过监测动态变量确定组件的质量和可靠性公开(公告)号：US07283919B2
公开(公告)日：2007-10-16
申请号：US11369293
申请日：2006-03-06
IPC分类号： G01R27/28
CPC分类号： G06F11/24 , G01R31/2849
摘要： One embodiment of the present invention provides a system that tests the quality and/or the reliability of a component. During operation, the system applies test conditions to a plurality of specimens of the component. While applying the test conditions, the system measures the same variable from each of the plurality of specimens. Next, the system computes a running average of the measured variable across the plurality of specimens. The system then computes residuals between the measured variable for each specimen and the running average. The system next determines from the residuals whether the associated specimens are degraded.
摘要翻译： 本发明的一个实施例提供一种测试组件的质量和/或可靠性的系统。 在操作过程中，系统将测试条件应用于组件的多个样本。 在应用测试条件的同时，系统从多个样本中的每一个测量相同的变量。 接下来，系统计算跨越多个样本的测量变量的运行平均值。 然后，系统计算每个样本的测量变量与运行平均值之间的残差。 系统接下来从残差确定相关标本是否退化。
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70.发明授权
公开(公告)号：US5514627A
公开(公告)日：1996-05-07
申请号：US186196
申请日：1994-01-24
CPC分类号： H01L33/44 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H01L33/56 , Y10S438/938
摘要： A method for increasing the resistance of a light emitting diode and other semiconductor devices to extremes of temperature is disclosed. During the manufacture of the light emitting diode, a liquid coating is applied to the light emitting die after the die has been placed in its lead frame. After the liquid coating has been placed on the die and its lead frames, a thermosetting encapsulant material is placed over the coating. The operation that cures the thermosetting material leaves the coating liquid intact. As the die and the encapsulant expand and contract at different rates with respect to changes in temperature, and as in known light emitting diodes the encapsulating material adheres to the die and lead frames, this liquid coating reduces the stresses that these different rates of expansion and contraction normally cause by eliminating the adherence of the encapsulating material to the die and frame.
摘要翻译： 公开了一种用于将发光二极管和其它半导体器件的电阻增加到极限温度的方法。 在制造发光二极管期间，在将裸片放置在其引线框架之后，将液体涂层施加到发光管芯。 将液体涂层放置在模具及其引线框架上之后，将热固性密封剂材料放置在涂层上。 固化热固性材料的操作使涂布液完好无损。 随着模具和密封剂相对于温度变化以不同的速率膨胀和收缩，并且如已知的发光二极管中的封装材料粘附到模具和引线框架，该液体涂层减少了这些不同的膨胀率和 收缩通常通过消除封装材料对模具和框架的粘附而引起。
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