Abstract:
An electronic memory circuit comprises a matrix of EEPROM memory cells. Each memory cell includes a MOS floating gate transistor and a selection transistor. The matrix includes a plurality of rows and columns, with each row being provided with a word line and each column comprising a bit line organized in line groups so as to group the matrix cells in bytes, each of which has an associated control gate line. A pair of cells have a common source region, and each cell symmetrically provided with respect to this common source region has a common control gate region.
Abstract:
A word line selector for selecting word lines of an array of semiconductor memory cells formed in a doped semiconductor region of a semiconductor substrate comprises a plurality of word line drivers responsive to word line selection signals. Each word line driver is associated with a respective word line for driving the word line to prescribed word line electric potentials, depending on an operation to be conducted on the array of memory cells, in accordance with the word line selection signal.
Abstract:
Method for refreshing data stored in an electrically erasable and programmable non-volatile semiconductor memory including at least one two-dimensional array of memory cells containing a plurality of individually erasable and programmable memory pages. Each time a request to modify a content of a memory page is received by the memory, the method provides for modifying the content of said memory page and submitting a portion of the two-dimensional array to a refresh procedure. The refresh procedure includes detecting memory cells of that memory portion that have partially lost a respective datum stored therein and reprogramming the datum in the detected memory cells.
Abstract:
Non-volatile, electrically alterable semiconductor memory, including at least one two-dimensional array of memory cells with a plurality of rows and a plurality of columns, column selection circuitry for selecting columns among the plurality of columns, and a write circuit for simultaneously writing a first number of memory cells. A plurality of doped semiconductor regions is provided, extending transversally to the rows and subdividing a set of memory cells of each row in a corresponding plurality of subsets of memory cells, each subset of memory cells including memory cells of the row formed in a respective doped semiconductor region distinct from the remaining doped semiconductor regions and defining an elementary memory block that can be individually erased. The plurality of doped semiconductor regions define a plurality of column packets each one containing a second number of columns equal to or higher than the first number, memory cells belonging to columns of a same column packet being formed in a same doped semiconductor region distinct from the doped semiconductor regions in which memory cells belonging to columns of the other column packets are formed. The column selection circuits are such that within each column packet columns containing memory cells that can be written simultaneously by the write circuit are distributed among the columns of the column packet so as to be at the substantially maximum distance from each other allowable within the column packet.
Abstract:
The programming method comprises supplying a turnoff voltage to the source terminal of the selected cells when writing the cells. The turnoff voltage is a positive voltage of greater amplitude than the absolute value of the threshold voltage of the most written cell, i.e., the most depleted cell, taking into account the body effect. For example, the turnoff voltage may be 1 V greater than the absolute value of the threshold voltage of the most written cell. Advantageously, the turnoff voltage may be 5-6 V; to take into account the process, supply, and temperature variations, the turnoff voltage may be 7-8 V. The programming method is advantageously applicable to EEPROM memory devices with divided source lines, so as to apply the turnoff voltage only to the addressed byte or bytes, or to the page containing the addressed byte.
Abstract:
An HV transistor integrated in a semiconductor substrate with a first type of conductivity, comprising a gate region included between corresponding drain and source regions, and being of the type wherein at least said drain region is lightly doped with a second type of conductivity. The drain region comprises a contact region with the second type of conductivity but being more heavily doped, from which a contact pad extends.
Abstract:
The driving capability of a selection transistor is increased by an N-type implant at the source and drain regions of the selection transistor itself. This implant is conveniently made at the end of the self-aligned etching, using the same self-aligned etching mask defining the control gate regions and the floating gate regions of memory elements, keeping the circuitry area covered by a circuitry mask.
Abstract:
A programming voltage is supplied to a control gate of a non-volatile memory cell via a control gate line. A supply voltage is coupled to a first plate of a capacitor and a reference voltage is coupled to a second plate of the capacitor. The supply voltage is then uncoupled from the first plate and the reference voltage is uncoupled from the second plate. Next, the reference voltage is coupled to the first plate to generate the programming voltage on the second plate.
Abstract:
A circuit structure for a matrix of EEPROM memory cells, being of a type which comprises a matrix of cells including plural rows and columns, with each row being provided with a word line and a control gate line and each column having a bit line; the bit lines, moreover, are gathered into groups or bytes of simultaneously addressable adjacent lines. Each cell in the matrix incorporates a floating gate transistor which is coupled to a control gate, connected to the control gate line, and is connected serially to a selection transistor; also, the cells of each individual byte share their respective source areas, which areas are structurally independent for each byte and are led to a corresponding source addressing line extending along a matrix column.
Abstract:
A method for forming thin oxide portions in electrically erasable and programmable read-only memory cells, including the use of the enhanced oxidation effect and the lateral diffusion of heavy doping, for obtaining a tunnel portion whose dimensions are smaller than the resolution of the photolithographic method used.